JPWO2023032475A5 - - Google Patents

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Publication number
JPWO2023032475A5
JPWO2023032475A5 JP2023545136A JP2023545136A JPWO2023032475A5 JP WO2023032475 A5 JPWO2023032475 A5 JP WO2023032475A5 JP 2023545136 A JP2023545136 A JP 2023545136A JP 2023545136 A JP2023545136 A JP 2023545136A JP WO2023032475 A5 JPWO2023032475 A5 JP WO2023032475A5
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JP
Japan
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producing
film
cured product
product according
treatment
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JP2023545136A
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English (en)
Japanese (ja)
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JPWO2023032475A1 (https=
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Priority claimed from PCT/JP2022/027411 external-priority patent/WO2023032475A1/ja
Publication of JPWO2023032475A1 publication Critical patent/JPWO2023032475A1/ja
Publication of JPWO2023032475A5 publication Critical patent/JPWO2023032475A5/ja
Pending legal-status Critical Current

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JP2023545136A 2021-08-31 2022-07-12 Pending JPWO2023032475A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021140832 2021-08-31
PCT/JP2022/027411 WO2023032475A1 (ja) 2021-08-31 2022-07-12 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法、並びに、処理液、及び、樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2023032475A1 JPWO2023032475A1 (https=) 2023-03-09
JPWO2023032475A5 true JPWO2023032475A5 (https=) 2024-05-23

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ID=85412103

Family Applications (1)

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JP2023545136A Pending JPWO2023032475A1 (https=) 2021-08-31 2022-07-12

Country Status (5)

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JP (1) JPWO2023032475A1 (https=)
KR (1) KR102877409B1 (https=)
CN (1) CN117836916A (https=)
TW (1) TW202311307A (https=)
WO (1) WO2023032475A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025182049A1 (ja) * 2024-02-29 2025-09-04 Ｈｄマイクロシステムズ株式会社 パターン硬化物の製造方法、現像剤の選択方法、溶剤の選択方法及び感光性樹脂組成物
CN118878824B (zh) * 2024-08-19 2025-09-16 湖南大学 一种紫外阻隔性聚酰亚胺树脂及其制备方法和应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2559614B2 (ja) 1988-03-01 1996-12-04 宇部興産株式会社 ポリイミドパターン層の形成法およびその方法に使用するリンス液
JPH03194559A (ja) * 1989-12-25 1991-08-26 Hitachi Chem Co Ltd 感光性ポリイミド前駆体用現像液
JPH07209879A (ja) 1994-01-20 1995-08-11 Asahi Chem Ind Co Ltd パターンを形成する方法
JPH08211629A (ja) * 1995-02-06 1996-08-20 Toray Ind Inc 感放射線性レジスト用現像前処理液および感放射線性レジストの現像前処理方法
JP3501877B2 (ja) * 1995-06-12 2004-03-02 日本ゼオン株式会社 感光性ポリイミド用現像液
JPH11233949A (ja) * 1998-02-16 1999-08-27 Hitachi Chem Co Ltd 感光性ポリイミド前駆体用現像液及びこれを用いたパターン製造法
JP3677191B2 (ja) * 1999-03-15 2005-07-27 株式会社東芝 感光性ポリイミド用現像液、ポリイミド膜パターン形成方法、及び電子部品
JP6659481B2 (ja) * 2016-06-30 2020-03-04 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法
WO2020255825A1 (ja) * 2019-06-17 2020-12-24 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリイミド、ポリベンゾオキサゾール、ポリイミド前駆体、又は、ポリベンゾオキサゾール前駆体
JP7395278B2 (ja) * 2019-07-31 2023-12-11 日東電工株式会社 感光性組成物、デバイス及びデバイスの製造方法

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