JP2024517612A5 - - Google Patents
Info
- Publication number
- JP2024517612A5 JP2024517612A5 JP2023562960A JP2023562960A JP2024517612A5 JP 2024517612 A5 JP2024517612 A5 JP 2024517612A5 JP 2023562960 A JP2023562960 A JP 2023562960A JP 2023562960 A JP2023562960 A JP 2023562960A JP 2024517612 A5 JP2024517612 A5 JP 2024517612A5
- Authority
- JP
- Japan
- Prior art keywords
- stress
- warpage
- stress film
- adjustment
- warpage adjustment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163175123P | 2021-04-15 | 2021-04-15 | |
| US63/175,123 | 2021-04-15 | ||
| US17/703,072 | 2022-03-24 | ||
| US17/703,072 US20220336226A1 (en) | 2021-04-15 | 2022-03-24 | Method of correcting wafer bow using a direct write stress film |
| PCT/US2022/022529 WO2022221060A1 (en) | 2021-04-15 | 2022-03-30 | Method of correcting wafer bow using a direct write stress film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024517612A JP2024517612A (ja) | 2024-04-23 |
| JP2024517612A5 true JP2024517612A5 (https=) | 2025-04-04 |
Family
ID=83602562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023562960A Pending JP2024517612A (ja) | 2021-04-15 | 2022-03-30 | 直接描画応力膜を用いたウェーハの反り修正方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220336226A1 (https=) |
| JP (1) | JP2024517612A (https=) |
| KR (1) | KR20230170006A (https=) |
| CN (1) | CN117321735A (https=) |
| TW (1) | TW202305956A (https=) |
| WO (1) | WO2022221060A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12455511B2 (en) * | 2022-02-04 | 2025-10-28 | Tokyo Electron Limited | In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones |
| CN117275356B (zh) * | 2023-11-23 | 2024-04-12 | 荣耀终端有限公司 | 柔性显示屏、电子设备及电子设备组件 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001230341A (ja) * | 2000-02-18 | 2001-08-24 | Hitachi Ltd | 半導体装置 |
| JP3929966B2 (ja) * | 2003-11-25 | 2007-06-13 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
| US7282324B2 (en) * | 2004-01-05 | 2007-10-16 | Microchem Corp. | Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using them |
| TW200638812A (en) * | 2004-11-18 | 2006-11-01 | Matsushita Electric Industrial Co Ltd | Wiring board, method for manufacturing same and semiconductor device |
| JP2011201759A (ja) * | 2010-03-05 | 2011-10-13 | Namiki Precision Jewel Co Ltd | 多層膜付き単結晶基板、多層膜付き単結晶基板の製造方法および素子製造方法 |
| JP6047422B2 (ja) * | 2013-02-21 | 2016-12-21 | 富士フイルム株式会社 | 感光性組成物、光硬化性組成物、化学増幅型レジスト組成物、レジスト膜、パターン形成方法、及び電子デバイスの製造方法 |
| US9397051B2 (en) * | 2013-12-03 | 2016-07-19 | Invensas Corporation | Warpage reduction in structures with electrical circuitry |
| KR101913020B1 (ko) * | 2014-03-25 | 2018-10-29 | 칼 짜이스 에스엠에스 엘티디 | 광학 부품 및/또는 웨이퍼의 미리 정해진 3차원 윤곽을 생성하는 방법 및 장치 |
| US10409163B2 (en) * | 2014-09-30 | 2019-09-10 | Toray Industries, Inc. | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device |
| US10975263B2 (en) * | 2016-04-25 | 2021-04-13 | Kaneka Corporation | Thermosetting resin composition, cured film and method for producing same, and flexible printed board with cured film and method for producing same |
| JP7164289B2 (ja) * | 2016-09-05 | 2022-11-01 | 東京エレクトロン株式会社 | 半導体プロセッシング中のオーバレイを制御するための湾曲を制御する応力の位置特定チューニング |
| JP2020047617A (ja) * | 2018-09-14 | 2020-03-26 | キオクシア株式会社 | 基板処理装置、半導体装置の製造方法、および被加工基板 |
| WO2020073218A1 (en) * | 2018-10-10 | 2020-04-16 | Applied Materials, Inc. | Techniques and apparatus for anisotropic stress compensation in substrates using ion implantation |
| JP6867522B2 (ja) * | 2020-01-21 | 2021-04-28 | デクセリアルズ株式会社 | 熱硬化性接着シート、及び半導体装置の製造方法 |
-
2022
- 2022-03-24 US US17/703,072 patent/US20220336226A1/en active Pending
- 2022-03-30 CN CN202280028480.5A patent/CN117321735A/zh active Pending
- 2022-03-30 KR KR1020237037722A patent/KR20230170006A/ko active Pending
- 2022-03-30 JP JP2023562960A patent/JP2024517612A/ja active Pending
- 2022-03-30 WO PCT/US2022/022529 patent/WO2022221060A1/en not_active Ceased
- 2022-04-11 TW TW111113586A patent/TW202305956A/zh unknown
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