JP2022169624A - 検査治具 - Google Patents
検査治具 Download PDFInfo
- Publication number
- JP2022169624A JP2022169624A JP2022126971A JP2022126971A JP2022169624A JP 2022169624 A JP2022169624 A JP 2022169624A JP 2022126971 A JP2022126971 A JP 2022126971A JP 2022126971 A JP2022126971 A JP 2022126971A JP 2022169624 A JP2022169624 A JP 2022169624A
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- substrate
- inspection
- movable plate
- inspection jig
- contact
- Prior art date
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- 238000007689 inspection Methods 0.000 title claims abstract description 213
- 239000000758 substrate Substances 0.000 claims abstract description 148
- 239000000463 material Substances 0.000 claims description 35
- 230000010355 oscillation Effects 0.000 abstract 2
- 238000012856 packing Methods 0.000 description 23
- 238000004891 communication Methods 0.000 description 11
- 238000003825 pressing Methods 0.000 description 10
- 230000003028 elevating effect Effects 0.000 description 9
- 238000001514 detection method Methods 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 7
- 238000001179 sorption measurement Methods 0.000 description 7
- 230000003014 reinforcing effect Effects 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
0の主要部に対応した大きさ、具体的には基板本体11を載置し得る大きさを有している。
第二検査治具4bを検査待機位置に移動させた状態で、揺動駆動部72により支持軸81を支点に第一可動板6a及び第二可動板6bを揺動変位させてコンタクト部63,63を検査対象部13U,13Dに接触させる際における駆動抵抗は、枢支部8の摺動抵抗だけである。このため、揺動駆動部72として低摩擦かつ高感度のエアシリンダを用いることにより、コンタクト部63,63を検査対象部13U,13Dに適度の圧力で正確に接触させて基板10を適正に検査することができる。
電コネクタ材が配設された構成としてもよい。
Claims (3)
- 検査対象の基板の検査対象部に接触するコンタクト部が設けられた可動板と、前記可動板を支持する支持部材と、を備え、 前記支持部材には、前記可動板を揺動可能に支持する支持軸を備えた枢支部と、前記支持軸を支点に前記可動板を揺動変位させて前記コンタクト部を前記検査対象部に接触させる揺動駆動部とが設けられている検査治具。
- 前記コンタクト部には、導電ゴム製の導電コネクタ材が配設されている、請求項1に記載の検査治具。
- 前記基板の下方側に配設された第一可動板を有する第一検査治具と、前記基板の上方側に配設された第二可動板を有する第二検査治具と、を備え、 前記第一可動板及び前記第二可動板には、前記コンタクト部が複数個所に分離された状態でそれぞれ設置されるとともに、相隣接する前記コンタクト部の間に、前記枢支部側に向けて凹入する切欠部が形成され、 前記第一検査治具及び前記第二検査治具の支持部材には、前記基板を支持する支持ブロックがそれぞれ設けられ、 当該支持ブロックは、前記切欠部内に導入される突部を有している、請求項1又は2に記載の検査治具。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017248714 | 2017-12-26 | ||
JP2017248714 | 2017-12-26 | ||
JP2019562869A JP7124834B2 (ja) | 2017-12-26 | 2018-11-27 | 基板検査装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019562869A Division JP7124834B2 (ja) | 2017-12-26 | 2018-11-27 | 基板検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022169624A true JP2022169624A (ja) | 2022-11-09 |
JP7476926B2 JP7476926B2 (ja) | 2024-05-01 |
Family
ID=67063430
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019562869A Active JP7124834B2 (ja) | 2017-12-26 | 2018-11-27 | 基板検査装置 |
JP2022126971A Active JP7476926B2 (ja) | 2017-12-26 | 2022-08-09 | 検査治具 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019562869A Active JP7124834B2 (ja) | 2017-12-26 | 2018-11-27 | 基板検査装置 |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP7124834B2 (ja) |
CN (1) | CN111492254A (ja) |
WO (1) | WO2019130949A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11940482B2 (en) | 2019-12-20 | 2024-03-26 | Nidec Read Corporation | Inspection device |
CN114209981B (zh) * | 2021-12-31 | 2022-11-08 | 江苏海莱新创医疗科技有限公司 | 肿瘤电场治疗用电极检测设备、系统及其方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6457632A (en) * | 1987-08-27 | 1989-03-03 | Tokyo Electron Ltd | Double contact probe device |
JPH1026635A (ja) * | 1996-07-11 | 1998-01-27 | Advantest Corp | プローブカード |
JPH1194910A (ja) * | 1997-09-17 | 1999-04-09 | Mitsubishi Materials Corp | プローブ検査装置 |
JP2000241508A (ja) * | 1999-02-24 | 2000-09-08 | Sumitomo Metal Ind Ltd | 基板検査装置及び基板検査方法 |
JP2001349912A (ja) * | 2000-06-06 | 2001-12-21 | Matsushita Electric Works Ltd | インピーダンス測定方法及びインピーダンス測定装置 |
JP2004309441A (ja) * | 2003-02-18 | 2004-11-04 | Yamaha Corp | プローブヘッド及びその組立方法並びにプローブカード |
JP2008014733A (ja) * | 2006-07-05 | 2008-01-24 | Matsushita Electric Ind Co Ltd | 半導体装置の検査装置 |
JP2012083156A (ja) * | 2010-10-08 | 2012-04-26 | Micronics Japan Co Ltd | プローブユニット及び検査装置 |
JP2012211927A (ja) * | 2012-08-06 | 2012-11-01 | Hioki Ee Corp | 電気計測プローブ用変位拡大機構および基板検査装置 |
JP2013024684A (ja) * | 2011-07-20 | 2013-02-04 | Mitsubishi Electric Corp | 検査治具および検査装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000208187A (ja) * | 1999-01-14 | 2000-07-28 | Fuji Electronics Kk | クリップ式中継コネクタ |
CN2457596Y (zh) * | 2000-12-27 | 2001-10-31 | 中国科学院上海技术物理研究所 | 可调恒压探针驱动架 |
JP2005141035A (ja) | 2003-11-07 | 2005-06-02 | Sharp Corp | 液晶パネルの点灯検査用治具および点灯検査方法 |
KR100602450B1 (ko) * | 2004-03-12 | 2006-07-19 | 바이옵트로 주식회사 | 가요성 인쇄회로기판의 테스트 장치 |
CN100549708C (zh) * | 2004-07-15 | 2009-10-14 | Jsr株式会社 | 电路基板的检查装置以及电路基板的检查方法 |
JP2012145370A (ja) * | 2011-01-07 | 2012-08-02 | Ai Technology Co Ltd | 基板検査装置 |
JP2012237656A (ja) * | 2011-05-12 | 2012-12-06 | Hitachi Chem Co Ltd | 被検査基板固定装置 |
JP5796870B2 (ja) * | 2011-12-05 | 2015-10-21 | 株式会社日本マイクロニクス | 半導体デバイスの検査装置とそれに用いるチャックステージ |
CN202794442U (zh) * | 2012-06-06 | 2013-03-13 | 深圳市矽电半导体设备有限公司 | 一种磁力探测器 |
JP5797240B2 (ja) * | 2013-08-12 | 2015-10-21 | 太洋工業株式会社 | プリント基板検査装置 |
US10281518B2 (en) * | 2014-02-25 | 2019-05-07 | Formfactor Beaverton, Inc. | Systems and methods for on-wafer dynamic testing of electronic devices |
CN105890841B (zh) * | 2014-11-26 | 2018-07-31 | 兰州大学 | 一种简易可编程微弱应力施加装置 |
CN104793098B (zh) | 2015-04-28 | 2017-11-03 | 华东光电集成器件研究所 | 一种基板通孔通断测试装置 |
JP6782001B2 (ja) * | 2016-05-23 | 2020-11-11 | ヤマハファインテック株式会社 | 電気検査装置 |
CN205910199U (zh) * | 2016-08-27 | 2017-01-25 | 河南省人口和计划生育科学技术研究院 | 一种超微量核酸蛋白分析仪自动清洗装置 |
CN107449939B (zh) * | 2017-08-03 | 2020-04-24 | 哈尔滨工业大学 | 采用磁驱峰值力调制原子力显微镜进行的多参数同步测量方法 |
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2018
- 2018-11-27 CN CN201880081787.5A patent/CN111492254A/zh active Pending
- 2018-11-27 WO PCT/JP2018/043548 patent/WO2019130949A1/ja active Application Filing
- 2018-11-27 JP JP2019562869A patent/JP7124834B2/ja active Active
-
2022
- 2022-08-09 JP JP2022126971A patent/JP7476926B2/ja active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6457632A (en) * | 1987-08-27 | 1989-03-03 | Tokyo Electron Ltd | Double contact probe device |
JPH1026635A (ja) * | 1996-07-11 | 1998-01-27 | Advantest Corp | プローブカード |
JPH1194910A (ja) * | 1997-09-17 | 1999-04-09 | Mitsubishi Materials Corp | プローブ検査装置 |
JP2000241508A (ja) * | 1999-02-24 | 2000-09-08 | Sumitomo Metal Ind Ltd | 基板検査装置及び基板検査方法 |
JP2001349912A (ja) * | 2000-06-06 | 2001-12-21 | Matsushita Electric Works Ltd | インピーダンス測定方法及びインピーダンス測定装置 |
JP2004309441A (ja) * | 2003-02-18 | 2004-11-04 | Yamaha Corp | プローブヘッド及びその組立方法並びにプローブカード |
JP2008014733A (ja) * | 2006-07-05 | 2008-01-24 | Matsushita Electric Ind Co Ltd | 半導体装置の検査装置 |
JP2012083156A (ja) * | 2010-10-08 | 2012-04-26 | Micronics Japan Co Ltd | プローブユニット及び検査装置 |
JP2013024684A (ja) * | 2011-07-20 | 2013-02-04 | Mitsubishi Electric Corp | 検査治具および検査装置 |
JP2012211927A (ja) * | 2012-08-06 | 2012-11-01 | Hioki Ee Corp | 電気計測プローブ用変位拡大機構および基板検査装置 |
Also Published As
Publication number | Publication date |
---|---|
CN111492254A (zh) | 2020-08-04 |
JP7476926B2 (ja) | 2024-05-01 |
JPWO2019130949A1 (ja) | 2021-01-14 |
JP7124834B2 (ja) | 2022-08-24 |
WO2019130949A1 (ja) | 2019-07-04 |
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