JP2021009938A5 - - Google Patents

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Publication number
JP2021009938A5
JP2021009938A5 JP2019123233A JP2019123233A JP2021009938A5 JP 2021009938 A5 JP2021009938 A5 JP 2021009938A5 JP 2019123233 A JP2019123233 A JP 2019123233A JP 2019123233 A JP2019123233 A JP 2019123233A JP 2021009938 A5 JP2021009938 A5 JP 2021009938A5
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JP
Japan
Prior art keywords
wiring
posts
layer
wiring board
post
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JP2019123233A
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English (en)
Japanese (ja)
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JP7321009B2 (ja
JP2021009938A (ja
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Priority to JP2019123233A priority Critical patent/JP7321009B2/ja
Priority claimed from JP2019123233A external-priority patent/JP7321009B2/ja
Priority to US16/915,107 priority patent/US10959328B2/en
Publication of JP2021009938A publication Critical patent/JP2021009938A/ja
Publication of JP2021009938A5 publication Critical patent/JP2021009938A5/ja
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JP2019123233A 2019-07-01 2019-07-01 配線基板、接合型配線基板及び配線基板の製造方法 Active JP7321009B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019123233A JP7321009B2 (ja) 2019-07-01 2019-07-01 配線基板、接合型配線基板及び配線基板の製造方法
US16/915,107 US10959328B2 (en) 2019-07-01 2020-06-29 Wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019123233A JP7321009B2 (ja) 2019-07-01 2019-07-01 配線基板、接合型配線基板及び配線基板の製造方法

Publications (3)

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JP2021009938A JP2021009938A (ja) 2021-01-28
JP2021009938A5 true JP2021009938A5 (enExample) 2022-03-22
JP7321009B2 JP7321009B2 (ja) 2023-08-04

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JP2019123233A Active JP7321009B2 (ja) 2019-07-01 2019-07-01 配線基板、接合型配線基板及び配線基板の製造方法

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US (1) US10959328B2 (enExample)
JP (1) JP7321009B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11694984B2 (en) * 2019-08-30 2023-07-04 Advanced Semiconductor Engineering, Inc. Package structure including pillars and method for manufacturing the same
US11158572B2 (en) 2019-08-30 2021-10-26 Advanced Semiconductor Engineering, Inc. Package structure including a first electronic device, a second electronic device and a plurality of dummy pillars
JP7782131B2 (ja) * 2021-02-05 2025-12-09 Ｔｏｐｐａｎホールディングス株式会社 複合配線基板

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100192766B1 (ko) * 1995-07-05 1999-06-15 황인길 솔더볼을 입출력 단자로 사용하는 볼그리드 어레이 반도체 패키지의 솔더볼 평탄화 방법 및 그 기판구조
JPH11111771A (ja) * 1997-10-07 1999-04-23 Matsushita Electric Ind Co Ltd 配線基板の接続方法、キャリア基板および配線基板
JP2003100801A (ja) * 2001-09-25 2003-04-04 Mitsubishi Electric Corp 半導体装置
JP4752586B2 (ja) 2006-04-12 2011-08-17 ソニー株式会社 半導体装置の製造方法
JP2007305814A (ja) 2006-05-12 2007-11-22 Matsushita Electric Ind Co Ltd 半導体集積回路装置とその実装方法
JP5017930B2 (ja) 2006-06-01 2012-09-05 富士通株式会社 半導体装置、はんだバンプ接続用基板の製造方法及び半導体装置の製造方法
JP2008091649A (ja) 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd 半導体装置
WO2008078746A1 (ja) 2006-12-26 2008-07-03 Panasonic Corporation 半導体素子の実装構造体及び半導体素子の実装方法
JP2009049499A (ja) 2007-08-14 2009-03-05 Fujifilm Corp 半導体チップの実装方法及び半導体装置
US8604614B2 (en) * 2010-03-26 2013-12-10 Samsung Electronics Co., Ltd. Semiconductor packages having warpage compensation
JP2011243683A (ja) 2010-05-17 2011-12-01 Fujitsu Ltd 電子部品の実装方法、電子部品の製造方法および電子部品、電子部品の製造装置
KR101695353B1 (ko) * 2010-10-06 2017-01-11 삼성전자 주식회사 반도체 패키지 및 반도체 패키지 모듈
TWI503935B (zh) * 2011-10-17 2015-10-11 矽品精密工業股份有限公司 半導體封裝件及其製法
US9059106B2 (en) * 2012-10-31 2015-06-16 International Business Machines Corporation Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
JP6029958B2 (ja) 2012-12-04 2016-11-24 新光電気工業株式会社 配線基板の製造方法
JP2015111608A (ja) 2013-12-06 2015-06-18 イビデン株式会社 プリント配線板
KR20160004065A (ko) * 2014-07-02 2016-01-12 삼성전자주식회사 반도체 패키지 및 이의 제조방법
US9099364B1 (en) * 2014-08-15 2015-08-04 Powertech Technology Inc. MPS-C2 semiconductor device having shorter supporting posts
JP2016048709A (ja) 2014-08-27 2016-04-07 マイクロン テクノロジー， インク． 半導体装置およびその製造方法
JP6515047B2 (ja) 2016-03-11 2019-05-15 東芝メモリ株式会社 半導体装置及びその製造方法
KR102214176B1 (ko) 2017-03-21 2021-02-09 후지필름 가부시키가이샤 적층 디바이스, 적층체 및 적층 디바이스의 제조 방법

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