WO2008078746A1 - 半導体素子の実装構造体及び半導体素子の実装方法 - Google Patents

半導体素子の実装構造体及び半導体素子の実装方法 Download PDF

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Publication number
WO2008078746A1
WO2008078746A1 PCT/JP2007/074844 JP2007074844W WO2008078746A1 WO 2008078746 A1 WO2008078746 A1 WO 2008078746A1 JP 2007074844 W JP2007074844 W JP 2007074844W WO 2008078746 A1 WO2008078746 A1 WO 2008078746A1
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WIPO (PCT)
Prior art keywords
semiconductor element
element mounting
mounting structure
adhesive resin
sealing adhesive
Prior art date
Application number
PCT/JP2007/074844
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English (en)
French (fr)
Inventor
Yoshihiro Tomura
Daido Komyoji
Original Assignee
Panasonic Corporation
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Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to CN2007800485532A priority Critical patent/CN101578695B/zh
Priority to US12/521,020 priority patent/US8110933B2/en
Priority to JP2008551119A priority patent/JP5039058B2/ja
Publication of WO2008078746A1 publication Critical patent/WO2008078746A1/ja

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Abstract

　半導体素子の外周端部に対向する位置における基板表面に、その内側の一部に封止接着用樹脂が配置された凹部を形成することで、封止接着用樹脂におけるフィレット部分（裾広がり部分）の配置領域の拡大を抑制しながら、その傾斜角度を大きくする。これにより、実装時の加熱処理や冷却処理によって生じる各部材の熱膨張差及び熱収縮差による半導体素子の周辺部分に発生する応力負荷を軽減し、半導体素子の実装構造体の内部破壊を回避する。
PCT/JP2007/074844 2006-12-26 2007-12-25 半導体素子の実装構造体及び半導体素子の実装方法 WO2008078746A1 (ja)

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CN2007800485532A CN101578695B (zh) 2006-12-26 2007-12-25 半导体元件的安装结构体及半导体元件的安装方法
US12/521,020 US8110933B2 (en) 2006-12-26 2007-12-25 Semiconductor device mounted structure and semiconductor device mounted method
JP2008551119A JP5039058B2 (ja) 2006-12-26 2007-12-25 半導体素子の実装構造体

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JP2017120800A (ja) * 2015-12-28 2017-07-06 富士通株式会社 半導体素子、半導体素子の製造方法及び電子機器
JP2017152484A (ja) * 2016-02-23 2017-08-31 京セラ株式会社 配線基板
WO2018074581A1 (ja) * 2016-10-21 2018-04-26 ソニーセミコンダクタソリューションズ株式会社 電子基板、および電子装置
JP2018113301A (ja) * 2017-01-10 2018-07-19 トヨタ自動車株式会社 半導体装置とその製造方法
WO2020003838A1 (ja) * 2018-06-27 2020-01-02 京セラ株式会社 接着構造、撮像装置、および移動体
JP2021009938A (ja) * 2019-07-01 2021-01-28 新光電気工業株式会社 配線基板、接合型配線基板及び配線基板の製造方法
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CN104112739A (zh) * 2013-04-16 2014-10-22 展晶科技(深圳)有限公司 发光二极管
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CN103325702A (zh) * 2013-07-04 2013-09-25 北京京东方光电科技有限公司 芯片的绑定方法及芯片绑定结构
JP6678506B2 (ja) * 2016-04-28 2020-04-08 株式会社アムコー・テクノロジー・ジャパン 半導体パッケージ及び半導体パッケージの製造方法
CN110349847B (zh) * 2018-04-08 2022-11-04 上海新微技术研发中心有限公司 一种通过键合材料进行键合的方法和键合结构
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JP2011187735A (ja) * 2010-03-09 2011-09-22 Toshiba Corp 半導体発光装置および半導体発光装置の製造方法
JP2012028457A (ja) * 2010-07-21 2012-02-09 Murata Mfg Co Ltd セラミック電子部品及び配線基板
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JP2017098508A (ja) * 2015-11-27 2017-06-01 富士電機株式会社 半導体装置
JP2017120800A (ja) * 2015-12-28 2017-07-06 富士通株式会社 半導体素子、半導体素子の製造方法及び電子機器
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