WO2008117434A1 - 半導体部品および半導体部品の製造方法 - Google Patents

半導体部品および半導体部品の製造方法 Download PDF

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Publication number
WO2008117434A1
WO2008117434A1 PCT/JP2007/056389 JP2007056389W WO2008117434A1 WO 2008117434 A1 WO2008117434 A1 WO 2008117434A1 JP 2007056389 W JP2007056389 W JP 2007056389W WO 2008117434 A1 WO2008117434 A1 WO 2008117434A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor part
semiconductor element
heat conduction
support member
adhesion
Prior art date
Application number
PCT/JP2007/056389
Other languages
English (en)
French (fr)
Inventor
Tsuyoshi So
Hideo Kubo
Seiji Ueno
Osamu Igawa
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/056389 priority Critical patent/WO2008117434A1/ja
Priority to JP2009506147A priority patent/JP5126219B2/ja
Publication of WO2008117434A1 publication Critical patent/WO2008117434A1/ja
Priority to US12/585,704 priority patent/US7999374B2/en
Priority to US13/171,382 priority patent/US8421219B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

　複数の入出力信号を有する半導体素子と、半導体素子の複数の入出力信号を外部に引き出すための配線基板と、半導体素子が発生する熱を放熱するための熱伝導部材と、熱伝導部材を半導体素子に接合するための接合部材と、熱伝導部材を支持するための支持部材と、支持部材と配線基板とを接着する第１の接着部材と、支持部材と熱伝導部材とを接着する第２の接着部材とを有する半導体部品において、支持部材と接着部材の少なくとも一方が、上面に複数の凹が設けられたものであるか、外周部に切り欠きが設けられたものである。
PCT/JP2007/056389 2007-03-27 2007-03-27 半導体部品および半導体部品の製造方法 WO2008117434A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2007/056389 WO2008117434A1 (ja) 2007-03-27 2007-03-27 半導体部品および半導体部品の製造方法
JP2009506147A JP5126219B2 (ja) 2007-03-27 2007-03-27 半導体部品および半導体部品の製造方法
US12/585,704 US7999374B2 (en) 2007-03-27 2009-09-22 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same
US13/171,382 US8421219B2 (en) 2007-03-27 2011-06-28 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056389 WO2008117434A1 (ja) 2007-03-27 2007-03-27 半導体部品および半導体部品の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/585,704 Continuation US7999374B2 (en) 2007-03-27 2009-09-22 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same

Publications (1)

Publication Number Publication Date
WO2008117434A1 true WO2008117434A1 (ja) 2008-10-02

Family

ID=39788177

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/056389 WO2008117434A1 (ja) 2007-03-27 2007-03-27 半導体部品および半導体部品の製造方法

Country Status (3)

Country Link
US (2) US7999374B2 (ja)
JP (1) JP5126219B2 (ja)
WO (1) WO2008117434A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102157462A (zh) * 2010-01-21 2011-08-17 精材科技股份有限公司 晶片封装体及其制造方法

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US9354138B2 (en) * 2013-07-02 2016-05-31 Texas Instruments Incorporated Fixture for test circuit board reliability testing
DE102013015041B4 (de) * 2013-09-12 2018-03-08 Jörg Alexander Böken Vorrichtung zur Signalisierung von Bewegungen eines Bewegungsapparates eines Menschen
US9831190B2 (en) 2014-01-09 2017-11-28 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device package with warpage control structure
US11101236B2 (en) * 2018-08-31 2021-08-24 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and method of forming the same
US11234351B2 (en) * 2018-10-18 2022-01-25 Facebook Technologies, Llc Display fabrication microassembly system
US11710672B2 (en) * 2019-07-08 2023-07-25 Intel Corporation Microelectronic package with underfilled sealant
US11302600B2 (en) * 2019-12-18 2022-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293808A (ja) * 1996-04-25 1997-11-11 Fujitsu Ltd 半導体装置
JPH1050877A (ja) * 1996-07-30 1998-02-20 Toshiba Corp 半導体パッケージ
JPH10144737A (ja) * 1996-11-08 1998-05-29 Fujitsu Ltd 半導体装置
JP2000106410A (ja) * 1998-09-28 2000-04-11 Matsushita Electronics Industry Corp 半導体装置
JP2003218253A (ja) * 2002-01-18 2003-07-31 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置

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JPH0817974A (ja) * 1994-06-27 1996-01-19 Hitachi Ltd 放熱構造を持つｂｇａ型ｌｓｉパッケージ
JPH1174403A (ja) * 1997-08-28 1999-03-16 Mitsubishi Electric Corp 半導体装置
JP3753538B2 (ja) * 1998-06-02 2006-03-08 富士通株式会社 半導体装置
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US7173329B2 (en) * 2001-09-28 2007-02-06 Intel Corporation Package stiffener
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293808A (ja) * 1996-04-25 1997-11-11 Fujitsu Ltd 半導体装置
JPH1050877A (ja) * 1996-07-30 1998-02-20 Toshiba Corp 半導体パッケージ
JPH10144737A (ja) * 1996-11-08 1998-05-29 Fujitsu Ltd 半導体装置
JP2000106410A (ja) * 1998-09-28 2000-04-11 Matsushita Electronics Industry Corp 半導体装置
JP2003218253A (ja) * 2002-01-18 2003-07-31 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102157462A (zh) * 2010-01-21 2011-08-17 精材科技股份有限公司 晶片封装体及其制造方法

Also Published As

Publication number Publication date
JPWO2008117434A1 (ja) 2010-07-08
US7999374B2 (en) 2011-08-16
US20110254149A1 (en) 2011-10-20
US8421219B2 (en) 2013-04-16
JP5126219B2 (ja) 2013-01-23
US20100013089A1 (en) 2010-01-21

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