WO2008105069A1 - プリント基板ユニットおよび半導体パッケージ - Google Patents

プリント基板ユニットおよび半導体パッケージ Download PDF

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Publication number
WO2008105069A1
WO2008105069A1 PCT/JP2007/053631 JP2007053631W WO2008105069A1 WO 2008105069 A1 WO2008105069 A1 WO 2008105069A1 JP 2007053631 W JP2007053631 W JP 2007053631W WO 2008105069 A1 WO2008105069 A1 WO 2008105069A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
package board
package
semiconductor element
reinforcing member
Prior art date
Application number
PCT/JP2007/053631
Other languages
English (en)
French (fr)
Inventor
Kenji Fukuzono
Hideaki Yoshimura
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to CN2007800516899A priority Critical patent/CN101611491B/zh
Priority to JP2009501072A priority patent/JP4846019B2/ja
Priority to PCT/JP2007/053631 priority patent/WO2008105069A1/ja
Priority to KR1020097014542A priority patent/KR101072420B1/ko
Publication of WO2008105069A1 publication Critical patent/WO2008105069A1/ja
Priority to US12/461,867 priority patent/US8023268B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • H01L21/10—Preliminary treatment of the selenium or tellurium, its application to the foundation plate, or the subsequent treatment of the combination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

　プリント基板ユニット（１３）では、半導体素子（２６）の動作時に半導体素子（２６）は発熱する。半導体素子（２６）の熱はパッケージ基板（１６）やマザーボード（１４）に伝達される。パッケージ基板（１６）の熱膨張率とマザーボード（１４）の熱膨張率とは異なる。パッケージ基板（１６）では応力が生成される。パッケージ基板（１６）上では補強部材（１８）は第２角柱空間（３３）よりも内側に収まる。こうして補強部材（１８）は外縁から内側に向かって広がる接合領域でパッケージ基板（１６）の表面に接合される。その結果、第２角柱空間（３３）よりも外側で補強部材（１８）がパッケージ基板（１６）に接合される場合に比べてパッケージ基板（１８）の剛性の高まりは抑制される。パッケージ基板（１８）の角で応力の集中は回避される。最外周のバンプ列で端子バンプ（１７）の破損は回避される。
PCT/JP2007/053631 2007-02-27 2007-02-27 プリント基板ユニットおよび半導体パッケージ WO2008105069A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2007800516899A CN101611491B (zh) 2007-02-27 2007-02-27 印刷基板单元和半导体封装
JP2009501072A JP4846019B2 (ja) 2007-02-27 2007-02-27 プリント基板ユニットおよび半導体パッケージ
PCT/JP2007/053631 WO2008105069A1 (ja) 2007-02-27 2007-02-27 プリント基板ユニットおよび半導体パッケージ
KR1020097014542A KR101072420B1 (ko) 2007-02-27 2007-02-27 프린트 기판 유닛 및 반도체 패키지
US12/461,867 US8023268B2 (en) 2007-02-27 2009-08-26 Printed circuit board unit and semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/053631 WO2008105069A1 (ja) 2007-02-27 2007-02-27 プリント基板ユニットおよび半導体パッケージ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/461,867 Continuation US8023268B2 (en) 2007-02-27 2009-08-26 Printed circuit board unit and semiconductor package

Publications (1)

Publication Number Publication Date
WO2008105069A1 true WO2008105069A1 (ja) 2008-09-04

Family

ID=39720915

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/053631 WO2008105069A1 (ja) 2007-02-27 2007-02-27 プリント基板ユニットおよび半導体パッケージ

Country Status (5)

Country Link
US (1) US8023268B2 (ja)
JP (1) JP4846019B2 (ja)
KR (1) KR101072420B1 (ja)
CN (1) CN101611491B (ja)
WO (1) WO2008105069A1 (ja)

Cited By (1)

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JP2013247274A (ja) * 2012-05-28 2013-12-09 Fujitsu Ltd 半導体パッケージ及び配線基板ユニット

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US9159643B2 (en) 2012-09-14 2015-10-13 Freescale Semiconductor, Inc. Matrix lid heatspreader for flip chip package
US8921994B2 (en) 2012-09-14 2014-12-30 Freescale Semiconductor, Inc. Thermally enhanced package with lid heat spreader
TWI508238B (zh) * 2012-12-17 2015-11-11 Princo Corp 晶片散熱系統
CN203243595U (zh) * 2013-03-07 2013-10-16 杭州华三通信技术有限公司 一种pcb结构
US20150047821A1 (en) * 2013-08-14 2015-02-19 Atomic Energy Council - Institute Of Nuclear Energy Research Heating device structure
US20150221570A1 (en) * 2014-02-04 2015-08-06 Amkor Technology, Inc. Thin sandwich embedded package
EP2914071A1 (en) * 2014-02-28 2015-09-02 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Heat spreader in multilayer build ups
JP6823283B2 (ja) * 2016-10-24 2021-02-03 日本電気株式会社 冷却装置、搭載方法
US20180190596A1 (en) 2016-12-30 2018-07-05 Intel Corporation Standoff members for semiconductor package
DE102019119118B4 (de) * 2019-07-15 2024-06-13 Infineon Technologies Ag Halbleitergehäuse, halbleiteranordnung und verfahren zur herstellung eines halbleitergehäuses
TW202214057A (zh) * 2020-05-29 2022-04-01 美商谷歌有限責任公司 用於晶片總成之熱管理之方法及熱分配裝置

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* Cited by examiner, † Cited by third party
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JP2013247274A (ja) * 2012-05-28 2013-12-09 Fujitsu Ltd 半導体パッケージ及び配線基板ユニット

Also Published As

Publication number Publication date
US8023268B2 (en) 2011-09-20
JP4846019B2 (ja) 2011-12-28
JPWO2008105069A1 (ja) 2010-06-03
KR101072420B1 (ko) 2011-10-11
CN101611491A (zh) 2009-12-23
KR20090088956A (ko) 2009-08-20
CN101611491B (zh) 2012-09-05
US20100014254A1 (en) 2010-01-21

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