WO2008105069A1 - Printed board unit and semiconductor package - Google Patents
Printed board unit and semiconductor package Download PDFInfo
- Publication number
- WO2008105069A1 WO2008105069A1 PCT/JP2007/053631 JP2007053631W WO2008105069A1 WO 2008105069 A1 WO2008105069 A1 WO 2008105069A1 JP 2007053631 W JP2007053631 W JP 2007053631W WO 2008105069 A1 WO2008105069 A1 WO 2008105069A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- board
- package board
- package
- semiconductor element
- reinforcing member
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
- H01L21/10—Preliminary treatment of the selenium or tellurium, its application to the foundation plate, or the subsequent treatment of the combination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007800516899A CN101611491B (en) | 2007-02-27 | 2007-02-27 | Printed board unit and semiconductor package |
JP2009501072A JP4846019B2 (en) | 2007-02-27 | 2007-02-27 | Printed circuit board unit and semiconductor package |
KR1020097014542A KR101072420B1 (en) | 2007-02-27 | 2007-02-27 | Printed board unit and semiconductor package |
PCT/JP2007/053631 WO2008105069A1 (en) | 2007-02-27 | 2007-02-27 | Printed board unit and semiconductor package |
US12/461,867 US8023268B2 (en) | 2007-02-27 | 2009-08-26 | Printed circuit board unit and semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/053631 WO2008105069A1 (en) | 2007-02-27 | 2007-02-27 | Printed board unit and semiconductor package |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/461,867 Continuation US8023268B2 (en) | 2007-02-27 | 2009-08-26 | Printed circuit board unit and semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008105069A1 true WO2008105069A1 (en) | 2008-09-04 |
Family
ID=39720915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/053631 WO2008105069A1 (en) | 2007-02-27 | 2007-02-27 | Printed board unit and semiconductor package |
Country Status (5)
Country | Link |
---|---|
US (1) | US8023268B2 (en) |
JP (1) | JP4846019B2 (en) |
KR (1) | KR101072420B1 (en) |
CN (1) | CN101611491B (en) |
WO (1) | WO2008105069A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013247274A (en) * | 2012-05-28 | 2013-12-09 | Fujitsu Ltd | Semiconductor package and wiring board unit |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9159643B2 (en) | 2012-09-14 | 2015-10-13 | Freescale Semiconductor, Inc. | Matrix lid heatspreader for flip chip package |
US8921994B2 (en) * | 2012-09-14 | 2014-12-30 | Freescale Semiconductor, Inc. | Thermally enhanced package with lid heat spreader |
TWI508238B (en) * | 2012-12-17 | 2015-11-11 | Princo Corp | Chip thermal system |
CN203243595U (en) * | 2013-03-07 | 2013-10-16 | 杭州华三通信技术有限公司 | A pcb structure |
US20150047821A1 (en) * | 2013-08-14 | 2015-02-19 | Atomic Energy Council - Institute Of Nuclear Energy Research | Heating device structure |
US20150221570A1 (en) * | 2014-02-04 | 2015-08-06 | Amkor Technology, Inc. | Thin sandwich embedded package |
EP2914071A1 (en) * | 2014-02-28 | 2015-09-02 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Heat spreader in multilayer build ups |
JP6823283B2 (en) * | 2016-10-24 | 2021-02-03 | 日本電気株式会社 | Cooling device, mounting method |
US20180190596A1 (en) | 2016-12-30 | 2018-07-05 | Intel Corporation | Standoff members for semiconductor package |
DE102019119118A1 (en) * | 2019-07-15 | 2021-01-21 | Infineon Technologies Ag | SEMI-CONDUCTOR ENCLOSURE, CONDUCTOR ARRANGEMENT, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR ENCLOSURE |
US11600548B2 (en) | 2020-05-29 | 2023-03-07 | Google Llc | Methods and heat distribution devices for thermal management of chip assemblies |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1187410A (en) * | 1997-09-11 | 1999-03-30 | Toshiba Microelectron Corp | Semiconductor device |
JPH11220055A (en) * | 1998-01-30 | 1999-08-10 | Hitachi Cable Ltd | Bga-type semiconductor device, and stiffener used for the device |
JP2001110926A (en) * | 1999-10-13 | 2001-04-20 | Nec Corp | Flip chip package |
WO2004086498A1 (en) * | 2003-03-26 | 2004-10-07 | Fujitsu Limited | Semiconductor device |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
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US161816A (en) * | 1875-04-06 | Improvement in combined fruit-presses, filters, and funnels | ||
US29655A (en) * | 1860-08-21 | Washing-machine | ||
US5909056A (en) * | 1997-06-03 | 1999-06-01 | Lsi Logic Corporation | High performance heat spreader for flip chip packages |
JP2930057B2 (en) | 1997-06-06 | 1999-08-03 | 日本電気株式会社 | BGA type semiconductor device |
US5966290A (en) * | 1997-09-03 | 1999-10-12 | Internatioinal Business Machines Corporation | Electronic packages and a method to improve thermal performance of electronic packages |
US5909057A (en) * | 1997-09-23 | 1999-06-01 | Lsi Logic Corporation | Integrated heat spreader/stiffener with apertures for semiconductor package |
JP2991172B2 (en) * | 1997-10-24 | 1999-12-20 | 日本電気株式会社 | Semiconductor device |
JP3173459B2 (en) * | 1998-04-21 | 2001-06-04 | 日本電気株式会社 | Method for manufacturing semiconductor device |
JP2001044310A (en) * | 1999-07-28 | 2001-02-16 | Mitsubishi Electric Corp | Semiconductor device and mounting method therefor |
JP2002033424A (en) | 2000-07-18 | 2002-01-31 | Hitachi Ltd | Semiconductor device and its manufacturing method |
JP2002190560A (en) | 2000-12-21 | 2002-07-05 | Nec Corp | Semiconductor device |
JP2002270717A (en) * | 2001-03-12 | 2002-09-20 | Rohm Co Ltd | Semiconductor device |
KR100394809B1 (en) * | 2001-08-09 | 2003-08-14 | 삼성전자주식회사 | Semiconductor package and method for manufacturing the same |
US6617683B2 (en) * | 2001-09-28 | 2003-09-09 | Intel Corporation | Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material |
US7045890B2 (en) * | 2001-09-28 | 2006-05-16 | Intel Corporation | Heat spreader and stiffener having a stiffener extension |
US6590278B1 (en) * | 2002-01-08 | 2003-07-08 | International Business Machines Corporation | Electronic package |
US7228440B1 (en) * | 2002-02-13 | 2007-06-05 | Lsi Corporation | Scan and boundary scan disable mechanism on secure device |
US6703704B1 (en) * | 2002-09-25 | 2004-03-09 | International Business Machines Corporation | Stress reducing stiffener ring |
US6825556B2 (en) * | 2002-10-15 | 2004-11-30 | Lsi Logic Corporation | Integrated circuit package design with non-orthogonal die cut out |
TWI286832B (en) * | 2002-11-05 | 2007-09-11 | Advanced Semiconductor Eng | Thermal enhance semiconductor package |
US6949404B1 (en) * | 2002-11-25 | 2005-09-27 | Altera Corporation | Flip chip package with warpage control |
JP2005064118A (en) | 2003-08-08 | 2005-03-10 | Renesas Technology Corp | Semiconductor device and its manufacturing method |
US6909176B1 (en) * | 2003-11-20 | 2005-06-21 | Altera Corporation | Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate |
US7126217B2 (en) * | 2004-08-07 | 2006-10-24 | Texas Instruments Incorporated | Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support |
US20060118947A1 (en) * | 2004-12-03 | 2006-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Thermal expansion compensating flip chip ball grid array package structure |
US7271480B2 (en) * | 2005-09-29 | 2007-09-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Constraint stiffener design |
US7459782B1 (en) * | 2005-10-05 | 2008-12-02 | Altera Corporation | Stiffener for flip chip BGA package |
US8174114B2 (en) * | 2005-12-15 | 2012-05-08 | Taiwan Semiconductor Manufacturing Go. Ltd. | Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency |
JP2007305761A (en) | 2006-05-11 | 2007-11-22 | Fujitsu Ltd | Semiconductor device |
TWI311366B (en) * | 2006-06-30 | 2009-06-21 | Advanced Semiconductor Eng | A flip-chip package structure with stiffener |
TWI309879B (en) * | 2006-08-21 | 2009-05-11 | Advanced Semiconductor Eng | Reinforced package and the stiffener thereof |
KR100788280B1 (en) | 2006-12-29 | 2007-12-27 | 옵토팩 주식회사 | Package for semiconductor device and packaging method thereof |
-
2007
- 2007-02-27 CN CN2007800516899A patent/CN101611491B/en not_active Expired - Fee Related
- 2007-02-27 KR KR1020097014542A patent/KR101072420B1/en not_active IP Right Cessation
- 2007-02-27 JP JP2009501072A patent/JP4846019B2/en not_active Expired - Fee Related
- 2007-02-27 WO PCT/JP2007/053631 patent/WO2008105069A1/en active Application Filing
-
2009
- 2009-08-26 US US12/461,867 patent/US8023268B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1187410A (en) * | 1997-09-11 | 1999-03-30 | Toshiba Microelectron Corp | Semiconductor device |
JPH11220055A (en) * | 1998-01-30 | 1999-08-10 | Hitachi Cable Ltd | Bga-type semiconductor device, and stiffener used for the device |
JP2001110926A (en) * | 1999-10-13 | 2001-04-20 | Nec Corp | Flip chip package |
WO2004086498A1 (en) * | 2003-03-26 | 2004-10-07 | Fujitsu Limited | Semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013247274A (en) * | 2012-05-28 | 2013-12-09 | Fujitsu Ltd | Semiconductor package and wiring board unit |
Also Published As
Publication number | Publication date |
---|---|
KR101072420B1 (en) | 2011-10-11 |
CN101611491A (en) | 2009-12-23 |
JPWO2008105069A1 (en) | 2010-06-03 |
JP4846019B2 (en) | 2011-12-28 |
US20100014254A1 (en) | 2010-01-21 |
KR20090088956A (en) | 2009-08-20 |
CN101611491B (en) | 2012-09-05 |
US8023268B2 (en) | 2011-09-20 |
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