JP2021005674A - 電子部品モジュール、電子部品ユニット、および、電子部品モジュールの製造方法 - Google Patents
電子部品モジュール、電子部品ユニット、および、電子部品モジュールの製造方法 Download PDFInfo
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- JP2021005674A JP2021005674A JP2019119677A JP2019119677A JP2021005674A JP 2021005674 A JP2021005674 A JP 2021005674A JP 2019119677 A JP2019119677 A JP 2019119677A JP 2019119677 A JP2019119677 A JP 2019119677A JP 2021005674 A JP2021005674 A JP 2021005674A
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- heat
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- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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Abstract
Description
図1は、本発明の実施形態1に係る電子部品モジュールの構成を示す平面図である。図2は、図1の電子部品モジュールのII−II線矢印方向から見た断面図である。図3は、本発明の実施形態1に係る電子部品ユニットの構成を示す正面図である。
以下、本発明の実施形態2に係る電子部品モジュールについて図を参照して説明する。本発明の実施形態2に係る電子部品モジュールは、放熱部がマザー基板の配線パターンで構成されている点が主に、本発明の実施形態1の第3変形例に係る電子部品モジュール100cと異なるため、本発明の実施形態1の第3変形例に係る電子部品モジュール100cと同様である構成については説明を繰り返さない。
Claims (17)
- 基板と、
前記基板に実装され、発熱素子である第1電子部品と、
第1面および該第1面とは反対側に位置する第2面を有する素体、前記第1面から前記第2面に連続して設けられた第1端子電極、並びに、前記第1面から前記第2面に連続して設けられ、前記第1端子電極とは電位的に独立した第2端子電極を含み、前記第1面が前記基板に対向した状態で前記基板に実装された第2電子部品と、
前記第1端子電極および前記第2端子電極の両方に接続されるように前記第2電子部品の前記第2面に設けられた伝熱部と、
前記第1端子電極および前記第2端子電極並びに前記伝熱部を介して前記基板に接続された放熱部と、
を備える、電子部品モジュール。 - 前記第1電子部品および前記第2電子部品を埋め込むように前記基板上に設けられた樹脂部をさらに備え、
前記伝熱部は、前記樹脂部より熱伝導率が高い高熱伝導部材を含み、
前記放熱部は、前記樹脂部より熱伝導率が高い、請求項1に記載の電子部品モジュール。 - 前記第1電子部品および前記第2電子部品の各々は、前記基板の一方の主面上に実装されている、請求項1または請求項2に記載の電子部品モジュール。
- 前記第2電子部品は、前記基板の一方の主面上に実装されており、
前記第1電子部品は、前記基板の他方の主面上に実装されている、請求項1または請求項2に記載の電子部品モジュール。 - 前記第1電子部品と前記第2電子部品とは、前記基板の表面および内部の少なくとも一方に設けられた配線パターンによって互いに電気的に接続されている、請求項1から請求項4のいずれか1項に記載の電子部品モジュール。
- 前記第1電子部品は、能動部品であり、
前記第2電子部品は、受動部品である、請求項1から請求項5のいずれか1項に記載の電子部品モジュール。 - 前記第2電子部品は、積層セラミックコンデンサである、請求項6に記載の電子部品モジュール。
- 前記伝熱部は、前記第2電子部品の第2面側において、前記第1端子電極、前記第2端子電極、および、前記第1端子電極と前記第2端子電極との間に位置する部分の前記素体の各々と接している、請求項1から請求項7のいずれか1項に記載の電子部品モジュール。
- 前記高熱伝導部材は、平板状の絶縁性部材で構成されており、かつ、接着層を介して前記第1端子電極および前記第2端子電極の各々に接続されている、請求項2に記載の電子部品モジュール。
- 前記高熱伝導部材は、平板状の金属部材で構成されており、かつ、絶縁性接着層を介して前記第1端子電極および前記第2端子電極の各々に接続されている、請求項2に記載の電子部品モジュール。
- 前記放熱部は、導電膜で構成されている、請求項1から請求項10のいずれか1項に記載の電子部品モジュール。
- 前記放熱部は、前記電子部品モジュールが搭載されるマザー基板の表面および内部の少なくとも一方に設けられた配線パターンで構成されている、請求項1から請求項10のいずれか1項に記載の電子部品モジュール。
- 前記第2電子部品として、複数の第2電子部品を備え、
前記複数の第2電子部品のうちの2つ以上の第2電子部品における、前記第1端子電極および前記第2端子電極の各々は、1つの前記伝熱部に接続されている、請求項1から請求項12のいずれか1項に記載の電子部品モジュール。 - 第1面および該第1面とは反対側に位置する第2面を有する素体、前記第1面から前記第2面に連続して設けられた第1端子電極、並びに、前記第1面から前記第2面に連続して設けられ、前記第1端子電極とは電位的に独立した第2端子電極を含む電子部品と、
前記第1端子電極と前記第2端子電極とが互いに電位的に独立した状態を保持しつつ前記第1端子電極および前記第2端子電極の両方に接続されるように、前記電子部品の前記第2面に設けられた伝熱部とを備える、電子部品ユニット。 - 発熱素子である第1電子部品を基板に実装する工程と、
第1面および該第1面とは反対側に位置する第2面を有する素体、前記第1面から前記第2面に連続して設けられた第1端子電極、並びに、前記第1面から前記第2面に連続して設けられ、前記第1端子電極と電位的に独立した第2端子電極を含み、かつ、前記第1端子電極および前記第2端子電極の両方に接続されるように伝熱部が前記第2面に設けられた第2電子部品を、前記第1面が前記基板に対向した状態で前記基板に実装する工程と、
前記第1端子電極および前記第2端子電極並びに前記伝熱部を介して前記基板に接続される放熱部を設ける工程と、
を備える、電子部品モジュールの製造方法。 - 前記第1電子部品を前記基板に実装する工程、および、前記第2電子部品を前記基板に実装する工程の後に、前記第1電子部品および前記第2電子部品を埋め込むように樹脂部を設ける工程をさらに備える、請求項15に記載の電子部品モジュールの製造方法。
- 前記樹脂部を設ける工程において、前記伝熱部の高さ寸法よりも高くなるように設けられた前記樹脂部とともに前記伝熱部の一部を研削することによって、前記伝熱部を前記樹脂部の表面に露出させる、請求項16に記載の電子部品モジュールの製造方法。
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