JP2021001337A5 - - Google Patents
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- Publication number
- JP2021001337A5 JP2021001337A5 JP2020139551A JP2020139551A JP2021001337A5 JP 2021001337 A5 JP2021001337 A5 JP 2021001337A5 JP 2020139551 A JP2020139551 A JP 2020139551A JP 2020139551 A JP2020139551 A JP 2020139551A JP 2021001337 A5 JP2021001337 A5 JP 2021001337A5
- Authority
- JP
- Japan
- Prior art keywords
- varnish
- epoxy resin
- curing agent
- amount
- varnish according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002966 varnish Substances 0.000 claims 18
- 239000003822 epoxy resin Substances 0.000 claims 9
- 229920000647 polyepoxide Polymers 0.000 claims 9
- 239000003795 chemical substances by application Substances 0.000 claims 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 4
- 239000003063 flame retardant Substances 0.000 claims 4
- 150000004982 aromatic amines Chemical group 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 230000001588 bifunctional effect Effects 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229920003986 novolac Polymers 0.000 claims 2
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical group BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 claims 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 claims 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462051051P | 2014-09-16 | 2014-09-16 | |
| US62/051,051 | 2014-09-16 | ||
| US14/743,093 US9822227B2 (en) | 2014-09-16 | 2015-06-18 | High Tg epoxy formulation with good thermal properties |
| US14/743,093 | 2015-06-18 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017514684A Division JP7134627B2 (ja) | 2014-09-16 | 2015-06-23 | 良好な熱的性質を有する高Ｔｇエポキシ配合物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021001337A JP2021001337A (ja) | 2021-01-07 |
| JP2021001337A5 true JP2021001337A5 (enExample) | 2021-07-26 |
| JP7084966B2 JP7084966B2 (ja) | 2022-06-15 |
Family
ID=55454127
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017514684A Active JP7134627B2 (ja) | 2014-09-16 | 2015-06-23 | 良好な熱的性質を有する高Ｔｇエポキシ配合物 |
| JP2020139551A Active JP7084966B2 (ja) | 2014-09-16 | 2020-08-20 | 良好な熱的性質を有する高Ｔｇエポキシ配合物 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017514684A Active JP7134627B2 (ja) | 2014-09-16 | 2015-06-23 | 良好な熱的性質を有する高Ｔｇエポキシ配合物 |
Country Status (10)
| Country | Link |
|---|---|
| US (3) | US9822227B2 (enExample) |
| EP (1) | EP3194516B1 (enExample) |
| JP (2) | JP7134627B2 (enExample) |
| KR (1) | KR102447582B1 (enExample) |
| CN (1) | CN107075294B (enExample) |
| CA (1) | CA2957830C (enExample) |
| MY (1) | MY178642A (enExample) |
| SG (1) | SG11201700654XA (enExample) |
| TW (1) | TWI561594B (enExample) |
| WO (1) | WO2016043825A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9822227B2 (en) | 2014-09-16 | 2017-11-21 | Isola Usa Corp. | High Tg epoxy formulation with good thermal properties |
| TWI709483B (zh) * | 2018-01-22 | 2020-11-11 | 聯茂電子股份有限公司 | 層壓板以及印刷電路板 |
| CN111500270A (zh) * | 2019-12-30 | 2020-08-07 | 大庆石油管理局有限公司 | 一种油水井井下修井用高效树脂封堵液 |
| CN111961314A (zh) * | 2020-08-26 | 2020-11-20 | 深圳先进电子材料国际创新研究院 | 一种电子封装材料及其制备方法和应用 |
| US11359062B1 (en) | 2021-01-20 | 2022-06-14 | Thintronics, Inc. | Polymer compositions and their uses |
| US11596066B1 (en) | 2022-03-22 | 2023-02-28 | Thintronics. Inc. | Materials for printed circuit boards |
| IT202300022308A1 (it) * | 2023-10-25 | 2025-04-25 | Antonio ARONNE | Materiale composito termoisolante e resistente alla fiamma a base di resina epossidica contenente particelle di titania funzionalizzate con silano |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4455250A (en) | 1981-01-12 | 1984-06-19 | American Cyanamid Company | Stable liquid hard surface cleanser composition containing DGH and a quaternary germicide |
| US4550128A (en) * | 1984-04-16 | 1985-10-29 | International Business Machines Corporation | Epoxy composition |
| US5364700A (en) * | 1985-12-27 | 1994-11-15 | Amoco Corporation | Prepregable resin composition and composite |
| JPH07121989B2 (ja) * | 1987-08-13 | 1995-12-25 | 東邦レーヨン株式会社 | 型成形用プリプレグ |
| JPH05295083A (ja) * | 1992-04-24 | 1993-11-09 | Nippon Kayaku Co Ltd | 型用エポキシ樹脂組成物及びそれから得られる樹脂型 |
| JP3216291B2 (ja) * | 1993-01-13 | 2001-10-09 | 東邦テナックス株式会社 | 難燃性エポキシ樹脂組成物及びプリプレグ |
| AU728470B2 (en) | 1996-02-14 | 2001-01-11 | Stepan Company | Reduced residue hard surface cleaner comprising hydrotrope |
| US6159916A (en) | 1998-06-12 | 2000-12-12 | The Clorox Company | Shower rinsing composition |
| US6204456B1 (en) | 1998-09-24 | 2001-03-20 | International Business Machines Corporation | Filling open through holes in a multilayer board |
| US6528218B1 (en) | 1998-12-15 | 2003-03-04 | International Business Machines Corporation | Method of fabricating circuitized structures |
| WO2001042359A1 (en) | 1999-12-13 | 2001-06-14 | Dow Global Technologies Inc. | Flame retardant phosphorus element-containing epoxy resin compositions |
| JP2001240836A (ja) * | 2000-02-29 | 2001-09-04 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物および接着剤付き金属箔 |
| WO2001081445A1 (fr) | 2000-04-21 | 2001-11-01 | Mitsubishi Rayon Co., Ltd. | Composition de resine epoxy et preimpregne fabrique avec cette composition de resine epoxy |
| JP2006131920A (ja) * | 2000-04-21 | 2006-05-25 | Mitsubishi Rayon Co Ltd | エポキシ樹脂組成物及び該エポキシ樹脂組成物を使用したプリプレグ |
| JP2002080559A (ja) * | 2000-09-06 | 2002-03-19 | Sumitomo Bakelite Co Ltd | インターポーザ用エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板 |
| EP1359174B1 (en) | 2000-12-18 | 2005-10-19 | Mitsubishi Rayon Co., Ltd. | Flame-retardant epoxy resin composition, and prepregs and fiber-reinforced composite materials made by using the composition |
| JP5078208B2 (ja) * | 2001-09-25 | 2012-11-21 | 三菱レイヨン株式会社 | エポキシ樹脂組成物及び該エポキシ樹脂組成物を使用したプリプレグ |
| AU2002365609A1 (en) * | 2001-12-05 | 2003-06-17 | Isola Laminate Systems Corp. | Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) |
| US20060115440A1 (en) | 2004-09-07 | 2006-06-01 | Arata Andrew B | Silver dihydrogen citrate compositions |
| US8129456B2 (en) | 2004-09-28 | 2012-03-06 | Isola Usa Corp. | Flame retardant compositions with a phosphorated compound |
| US7687556B2 (en) | 2004-09-28 | 2010-03-30 | Isola Usa Corp. | Flame retardant compositions |
| JP2006152099A (ja) * | 2004-11-29 | 2006-06-15 | Toray Ind Inc | プリプレグ |
| BRPI0612875A2 (pt) * | 2005-07-13 | 2010-11-30 | Mitsubishi Rayon Co | prepreg |
| JP2007314761A (ja) * | 2006-04-28 | 2007-12-06 | Hitachi Chem Co Ltd | エポキシ樹脂組成物、ならびにそれを用いたプリプレグ、金属張積層板および多層プリント配線板 |
| ES2320819T3 (es) | 2006-07-31 | 2009-05-28 | Reckitt Benckiser (Uk) Limited | Composiciones limpiadoras de superficies duras mejoradas. |
| BRPI0810290A2 (pt) * | 2007-05-09 | 2014-11-04 | Dow Global Technologies Inc | "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito." |
| TWI350716B (en) * | 2008-12-29 | 2011-10-11 | Nanya Plastics Corp | High thermal conductivity, halogen-free flame-retardent resin composition and its pre-impregnated and coating materials for printed circuit boards |
| JP5487634B2 (ja) * | 2009-02-10 | 2014-05-07 | 東亞合成株式会社 | フレキシブル印刷配線板用難燃性接着剤組成物及びそれを用いたフレキシブル印刷配線板 |
| WO2011152412A1 (ja) * | 2010-05-31 | 2011-12-08 | 日立化成工業株式会社 | エポキシ樹脂組成物、このエポキシ樹脂組成物を用いたプリプレグ、支持体付き樹脂フィルム、金属箔張り積層板及び多層プリント配線板 |
| WO2012015467A1 (en) * | 2010-07-30 | 2012-02-02 | Dow Global Technologies Llc | Curable compositions |
| CN102633990A (zh) * | 2012-04-05 | 2012-08-15 | 广东生益科技股份有限公司 | 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
| TWI545155B (zh) * | 2012-06-05 | 2016-08-11 | 三菱麗陽股份有限公司 | 環氧樹脂組成物、預浸絲束、複合材料補強壓力容器以及鋼腱 |
| JP6128311B2 (ja) * | 2013-02-12 | 2017-05-17 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板 |
| CN104119639B (zh) * | 2013-04-24 | 2016-08-03 | 台光电子材料(昆山)有限公司 | 无卤素树脂组合物及应用其的铜箔基板及印刷电路板 |
| AU2015280573A1 (en) | 2014-06-23 | 2016-08-11 | The Armor All/Stp Products Company | Cleaning composition having improved vertical cling |
| US9822227B2 (en) | 2014-09-16 | 2017-11-21 | Isola Usa Corp. | High Tg epoxy formulation with good thermal properties |
-
2015
- 2015-06-18 US US14/743,093 patent/US9822227B2/en active Active
- 2015-06-23 KR KR1020177007277A patent/KR102447582B1/ko active Active
- 2015-06-23 EP EP15741397.2A patent/EP3194516B1/en active Active
- 2015-06-23 CA CA2957830A patent/CA2957830C/en active Active
- 2015-06-23 JP JP2017514684A patent/JP7134627B2/ja active Active
- 2015-06-23 CN CN201580049319.6A patent/CN107075294B/zh active Active
- 2015-06-23 SG SG11201700654XA patent/SG11201700654XA/en unknown
- 2015-06-23 MY MYPI2017700599A patent/MY178642A/en unknown
- 2015-06-23 WO PCT/US2015/037247 patent/WO2016043825A1/en not_active Ceased
- 2015-07-09 TW TW104122396A patent/TWI561594B/zh active
-
2017
- 2017-10-17 US US15/786,131 patent/US10364332B2/en active Active
-
2019
- 2019-07-18 US US16/515,127 patent/US11155687B2/en active Active
-
2020
- 2020-08-20 JP JP2020139551A patent/JP7084966B2/ja active Active
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