SG11201700654XA - High tg epoxy formulation with good thermal properties - Google Patents

High tg epoxy formulation with good thermal properties

Info

Publication number
SG11201700654XA
SG11201700654XA SG11201700654XA SG11201700654XA SG11201700654XA SG 11201700654X A SG11201700654X A SG 11201700654XA SG 11201700654X A SG11201700654X A SG 11201700654XA SG 11201700654X A SG11201700654X A SG 11201700654XA SG 11201700654X A SG11201700654X A SG 11201700654XA
Authority
SG
Singapore
Prior art keywords
good thermal
thermal properties
epoxy formulation
formulation
epoxy
Prior art date
Application number
SG11201700654XA
Inventor
David Bedner
Tarun Amla
Original Assignee
Isola Usa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isola Usa Corp filed Critical Isola Usa Corp
Publication of SG11201700654XA publication Critical patent/SG11201700654XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C09D163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
SG11201700654XA 2014-09-16 2015-06-23 High tg epoxy formulation with good thermal properties SG11201700654XA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462051051P 2014-09-16 2014-09-16
US14/743,093 US9822227B2 (en) 2014-09-16 2015-06-18 High Tg epoxy formulation with good thermal properties
PCT/US2015/037247 WO2016043825A1 (en) 2014-09-16 2015-06-23 High tg epoxy formulation with good thermal properties

Publications (1)

Publication Number Publication Date
SG11201700654XA true SG11201700654XA (en) 2017-04-27

Family

ID=55454127

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201700654XA SG11201700654XA (en) 2014-09-16 2015-06-23 High tg epoxy formulation with good thermal properties

Country Status (10)

Country Link
US (3) US9822227B2 (en)
EP (1) EP3194516B1 (en)
JP (2) JP7134627B2 (en)
KR (1) KR102447582B1 (en)
CN (1) CN107075294B (en)
CA (1) CA2957830C (en)
MY (1) MY178642A (en)
SG (1) SG11201700654XA (en)
TW (1) TWI561594B (en)
WO (1) WO2016043825A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9822227B2 (en) 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties
TWI709483B (en) * 2018-01-22 2020-11-11 聯茂電子股份有限公司 Laminated substrate and printed circuit board thereof
CN111500270A (en) * 2019-12-30 2020-08-07 大庆石油管理局有限公司 Efficient resin plugging liquid for underground well repair of oil-water well
CN111961314A (en) * 2020-08-26 2020-11-20 深圳先进电子材料国际创新研究院 Electronic packaging material and preparation method and application thereof
US11359062B1 (en) 2021-01-20 2022-06-14 Thintronics, Inc. Polymer compositions and their uses
US11596066B1 (en) 2022-03-22 2023-02-28 Thintronics. Inc. Materials for printed circuit boards

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4455250A (en) 1981-01-12 1984-06-19 American Cyanamid Company Stable liquid hard surface cleanser composition containing DGH and a quaternary germicide
US4550128A (en) * 1984-04-16 1985-10-29 International Business Machines Corporation Epoxy composition
US5364700A (en) * 1985-12-27 1994-11-15 Amoco Corporation Prepregable resin composition and composite
JPH07121989B2 (en) * 1987-08-13 1995-12-25 東邦レーヨン株式会社 Molding prepreg
JPH05295083A (en) * 1992-04-24 1993-11-09 Nippon Kayaku Co Ltd Epoxy resin composition for mold and resin mold made thereof
JP3216291B2 (en) * 1993-01-13 2001-10-09 東邦テナックス株式会社 Flame-retardant epoxy resin composition and prepreg
DE69734427T2 (en) 1996-02-14 2006-07-20 Stepan Co., Northfield HYDROTROP CONTAINING CLEANERS FOR HARD SURFACES WITH REDUCED RESIDUE CONSTRUCTION
US6159916A (en) 1998-06-12 2000-12-12 The Clorox Company Shower rinsing composition
US6204456B1 (en) 1998-09-24 2001-03-20 International Business Machines Corporation Filling open through holes in a multilayer board
US6528218B1 (en) 1998-12-15 2003-03-04 International Business Machines Corporation Method of fabricating circuitized structures
KR100721697B1 (en) 1999-12-13 2007-05-28 다우 글로벌 테크놀로지스 인크. Flame retardant phosphorus element-containing epoxy resin compositions
JP2001240836A (en) * 2000-02-29 2001-09-04 Hitachi Chem Co Ltd Thermosetting resin composition and metal foil with adhesive
JP2006131920A (en) * 2000-04-21 2006-05-25 Mitsubishi Rayon Co Ltd Epoxy resin composition and prepreg made with the epoxy resin composition
JP3796176B2 (en) 2000-04-21 2006-07-12 三菱レイヨン株式会社 Epoxy resin composition and prepreg using the epoxy resin composition
JP2002080559A (en) * 2000-09-06 2002-03-19 Sumitomo Bakelite Co Ltd Epoxy resin composition for interposer, prepreg and copper-clad laminate using the prepreg
JP4154234B2 (en) 2000-12-18 2008-09-24 三菱レイヨン株式会社 Flame retardant epoxy resin composition, prepreg and fiber reinforced composite material using the same
JP5078208B2 (en) * 2001-09-25 2012-11-21 三菱レイヨン株式会社 Epoxy resin composition and prepreg using the epoxy resin composition
US20030158337A1 (en) * 2001-12-05 2003-08-21 Isola Laminate Systems Corp. Thermosetting resin composition for high performance laminates
US20060115440A1 (en) 2004-09-07 2006-06-01 Arata Andrew B Silver dihydrogen citrate compositions
US8129456B2 (en) 2004-09-28 2012-03-06 Isola Usa Corp. Flame retardant compositions with a phosphorated compound
US7687556B2 (en) 2004-09-28 2010-03-30 Isola Usa Corp. Flame retardant compositions
JP2006152099A (en) * 2004-11-29 2006-06-15 Toray Ind Inc Prepreg
ES2376995T3 (en) * 2005-07-13 2012-03-21 Mitsubishi Rayon Co. Ltd. Prepreg Material
JP2007314761A (en) * 2006-04-28 2007-12-06 Hitachi Chem Co Ltd Epoxy resin composition, and prepreg, metal-clad laminate and multi-layered printed circuit board each using the same
BRPI0706065A2 (en) 2006-07-31 2011-03-22 Reckitt Benckiser improved cleaning compositions for rigid surfaces
BRPI0810290A2 (en) * 2007-05-09 2014-11-04 Dow Global Technologies Inc "Process to cure a thermosetting composition, thermosetting composition and a process to form a composite."
TWI350716B (en) * 2008-12-29 2011-10-11 Nanya Plastics Corp High thermal conductivity, halogen-free flame-retardent resin composition and its pre-impregnated and coating materials for printed circuit boards
JP5487634B2 (en) * 2009-02-10 2014-05-07 東亞合成株式会社 Flame retardant adhesive composition for flexible printed wiring board and flexible printed wiring board using the same
EP2578613B8 (en) * 2010-05-31 2018-12-19 Hitachi Chemical Company, Ltd. Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition
CN103249775A (en) * 2010-07-30 2013-08-14 陶氏环球技术有限责任公司 Curable compositions
CN102633990A (en) * 2012-04-05 2012-08-15 广东生益科技股份有限公司 Epoxy resin composition, prepreg made of epoxy resin composition and copper-coated laminate made of epoxy resin composition
TWI545153B (en) * 2012-06-05 2016-08-11 三菱麗陽股份有限公司 Epoxy resin composition, tow prepreg, pressure vessel reinforced by composite material and tendon
JP6128311B2 (en) * 2013-02-12 2017-05-17 パナソニックＩｐマネジメント株式会社 Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
CN104119639B (en) * 2013-04-24 2016-08-03 台光电子材料(昆山)有限公司 Non-halogen resin composition and apply its copper clad laminate and printed circuit board (PCB)
DE112015000252T5 (en) 2014-06-23 2016-10-20 The Armor All/Stp Products Company Cleaning composition with improved vertical adhesion
US9822227B2 (en) 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties
JP6206980B2 (en) 2015-01-09 2017-10-04 国立研究開発法人防災科学技術研究所 Pressure sensor output frequency calculation method and tsunami warning device and tsunami warning system based on atmospheric pressure observation using the same

Also Published As

Publication number Publication date
TWI561594B (en) 2016-12-11
EP3194516B1 (en) 2020-08-05
JP2021001337A (en) 2021-01-07
KR102447582B1 (en) 2022-09-26
KR20170057274A (en) 2017-05-24
JP7084966B2 (en) 2022-06-15
MY178642A (en) 2020-10-19
CN107075294A (en) 2017-08-18
EP3194516A1 (en) 2017-07-26
WO2016043825A1 (en) 2016-03-24
TW201612264A (en) 2016-04-01
US20200181342A1 (en) 2020-06-11
JP7134627B2 (en) 2022-09-12
US11155687B2 (en) 2021-10-26
CN107075294B (en) 2019-12-31
US20180251618A1 (en) 2018-09-06
CA2957830A1 (en) 2016-03-24
US10364332B2 (en) 2019-07-30
JP2017531067A (en) 2017-10-19
US20160075839A1 (en) 2016-03-17
US9822227B2 (en) 2017-11-21
CA2957830C (en) 2019-01-08

Similar Documents

Publication Publication Date Title
HK1258509A1 (en) Gitr agonists
SG11201704238YA (en) High performance thermal interface materials with low thermal impedance
ZA201501155B (en) Thermal therapy apparel
PL3119816T3 (en) Heterophasic propylene copolymer with high melting point
GB201513010D0 (en) Novel formulation
SG11201610090RA (en) Cyclic dipeptide-containing composition
TWI561594B (en) High tg epoxy formulation with good thermal properties
ZA201702401B (en) Composition with reduced immunogenicity
GB201518818D0 (en) Capacitor with improved heat dissipation
EP3054972A4 (en) Vaccines with interleukin-33 as an adjuvant
ZA201608808B (en) Integrated circuit with cooling array
GB201419688D0 (en) Substrate cooling device
GB201516711D0 (en) Fast curing compositions
EP3104887A4 (en) Vaccines with interleukin-17 as an adjuvant
GB201619916D0 (en) Insulation enclosure with varying thermal properties
DK3154908T3 (en) PROCEDURE FOR THE GEL WITH HIGH DISPERSIBILITY
GB2532496B (en) Crystal-pair counter-rotator with translation capability
GB2526856B (en) Thermal power measurement
LU92406B1 (en) Camera head with integrated calibration tables
GB201407384D0 (en) Formulation
IL248596A0 (en) Aerodynamic device
EP3168442A4 (en) Boiling cooling device
GB201502880D0 (en) Thermal therapy apparel
GB201402448D0 (en) Novel formulation
GB201407051D0 (en) Veterinary composition