JP2020524901A - 側方収納ポッド、機器フロントエンドモジュール、及び、基板を処理する方法 - Google Patents
側方収納ポッド、機器フロントエンドモジュール、及び、基板を処理する方法 Download PDFInfo
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Abstract
Description
側方収納容器を収容するよう構成された第1のチャンバと、
パネル第1側面と、パネル第2側面と、パネル第1側面とパネル第2側面との間に延在するパネル開口部とを有するパネルであって、パネル第1側面は第1のチャンバに結合されるよう構成され、パネル開口部は第1のチャンバの近隣にあり、第2のパネル第2側面は機器フロントエンドモジュールに結合されるよう構成される、パネルと、
第1のチャンバに収容された側方収納容器であって、垂直方向に間隔が取られ基板を支持するよう各々が構成された複数の基板ホルダを有する側方収納容器と、
収容された側方収納容器に結合されるよう構成され、第1のチャンバの外へと延びる排気導管と
を備える。
機器フロントエンドモジュールであって、1つ以上の境界開口部を有する機器フロントエンドモジュールチャンバを含む機器フロントエンドモジュールと、
1つ以上のチャンバを有する側方収納ポッドであって、1つ以上のチャンバの各々は側方収納容器を収容するよう構成されており、
1つ以上のチャンバの各々は、
1つ以上の境界開口部のうちの1つの境界開口部の近隣に位置するパネル開口部、
境界開口部及びパネル開口部を通るガス流が可能となる開放状態と、境界開口部及びパネル開口部を通るガス流が不可能となる閉鎖状態と、を有する内部ドア、及び、
1つ以上のチャンバで収容された側方収納容器に結合されるよう構成された排気導管
を含む、1つ以上のチャンバを有する側方収納ポッドと
を備える。
1つ以上の基板を収容する構成された内部と、
ポッド開口部であって、1つ以上の基板がポッド開口部を介して内部へと収容可能である、ポッド開口部と、
内部に結合された排気ダクトと、
排気ダクトに結合された排気ポートと
を備え、
ポッド開口部は、側方収納容器に結合されたパネルに設けられたパネル開口部と位置合わせして構成され、内部ドアは、パネル開口部で収容可能である。
Claims (15)
- 側方収納ポッドであって、
側方収納容器を収容するよう構成された第1のチャンバと、
パネル第1側面と、パネル第2側面と、前記パネル第1側面と前記パネル第2側面との間に延在するパネル開口部とを有するパネルであって、前記パネル第1側面は第1のチャンバに結合されるよう構成され、前記パネル開口部は前記第1のチャンバの近隣にあり、前記パネル第2側面は機器フロントエンドモジュールに結合されるよう構成される、パネルと、
前記第1のチャンバに収容された側方収納容器であって、垂直方向に間隔が取られ基板を支持するよう各々が構成された複数の基板ホルダを有する側方収納容器と、
収容された前記側方収納容器に結合されるよう構成され、前記第1のチャンバの外へと延びる排気導管と
を備えた、側方収納ポッド。 - 前記側方収納容器は内部に結合されたポッド開口部を有し、前記内部は前記ポッド開口部を介して1つ以上の基板を収納するよう構成され、前記側方収納容器は前記パネル第1側面に結合されるよう構成され、前記ポッド開口部は前記パネル開口部の近傍にある、請求項1に記載の側方収納ポッド。
- 前記側方収納容器は、前記内部に結合され前記排気導管に結合するよう構成された排気口をさらに備える、請求項2に記載の側方収納ポッド。
- 前記排気導管に結合されており、前記内部を通るガス流の調整を支援するよう構成された弁をさらに備える、請求項3に記載の側方収納ポッド。
- 前記側方収納容器は、前記ポッド開口部に対向しており前記側方収納容器の一端に沿って延在する排気ダクトを含み、前記排気ダクトは、前記内部に結合され及び前記排気導管に結合される、請求項2に記載の側方収納ポッド。
- 前記側方収納容器を収容するよう構成されたプラットフォームを更に備える、請求項1に記載の側方収納ポッド。
- 前記プラットフォームに結合されており、側方収納容器が前記プラットフォームの近傍で収容されるのに応じて状態を変更するよう構成された1つ以上のプラットフォームセンサを更に備える、請求項6に記載の側方収納ポッド。
- 開放状態と閉鎖状態とを有する内部ドアを更に備え、前記パネルのパネル開口部は、前記内部ドアが前記閉鎖状態にあるときには閉鎖され、前記パネル開口部は、前記内部ドアが前記開放状態にあるときには開放される、請求項1に記載の側方収納ポッド。
- 第2のチャンバを更に備え、前記第1のチャンバと前記第2のチャンバとは、垂直方向に上下に配置される、請求項1に記載の側方収納ポッド。
- 電子デバイス処理システムであって、
機器フロントエンドモジュールであって、1つ以上の境界開口部を有する機器フロントエンドモジュールチャンバを含む機器フロントエンドモジュールと、
1つ以上のチャンバを有する側方収納ポッドであって、前記1つ以上のチャンバの各々は側方収納容器を収容するよう構成されており、
前記1つ以上のチャンバの各々は、
前記1つ以上の境界開口部のうちの1つの境界開口部の近隣に位置するパネル開口部、
前記境界開口部及び前記パネル開口部を通るガス流が可能となる開放状態と、前記境界開口部及び前記パネル開口部を通るガス流が不可能となる閉鎖状態と、を有する内部ドア、及び、
前記1つ以上のチャンバで収容された側方収納容器に結合されるよう構成された排気導管であって、前記側方収納容器は1つ以上の基板を収容するよう構成される、排気導管
を含む、1つ以上のチャンバを有する側方収納ポッドと
を備えた、電子デバイス処理システム。 - 前記1つ以上のチャンバは、垂直方向に置かれた2つ以上のチャンバを含む、請求項10に記載の電子デバイス処理システム。
- 前記機器フロントエンドモジュールチャンバ内にロード/アンロードロボットを更に備え、前記ロード/アンロードロボットは、前記1つ以上のチャンバの、上方のチャンバに収容された上方の側方収納容器と、前記1つ以上のチャンバの、下方のチャンバに収容された下方の側方収納容器と、の中に収容された基板にアクセスするよう構成される、請求項11に記載の電子デバイス処理システム。
- 前記1つ以上のチャンバの1つに収容された側方収納容器であって、前記パネル開口部と位置合わせされたポッド開口部を含む側方収納容器と、
前記ポッド開口部を通り、前記側方収納容器に収納された基板に渡って流れたガスを排出するよう構成された排気口であって、前記ガスは、前記内部ドアが開放状態にあるときには、前記側方収納容器の排気ダクトから排出される、排気口と、
を更に備える、請求項10に記載の電子デバイス処理システム。 - 前記側方収納容器は、垂直方向に積み重ねられた1つ以上の基板ホルダであって、前記基板を保持するよう構成された1つ以上の基板ホルダを更に備え、前記排気ダクトは、前記垂直方向に積み重ねられた基板ホルダの最上の基板ホルダと最下の基板ホルダとの間に延在する、請求項13に記載の電子デバイス処理システム。
- 側方収納容器であって、
1つ以上の基板を収容するよう構成された内部と、
ポッド開口部であって、前記1つ以上の基板が、当該ポッド開口部を介して、前記内部へと収容可能である、ポッド開口部と、
前記内部に結合された排気ダクトと、
前記排気ダクトに結合された排気ポートと
を備え、
前記ポッド開口部は、前記側方収納容器に結合されたパネルに設けられたパネル開口部と位置合わせして構成され、内部ドアが、前記パネル開口部で収容可能である、側方収納容器。
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Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105453246A (zh) | 2013-08-12 | 2016-03-30 | 应用材料公司 | 具有工厂接口环境控制的基板处理系统、装置和方法 |
WO2016085622A1 (en) * | 2014-11-25 | 2016-06-02 | Applied Materials, Inc. | Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls |
US10388547B2 (en) | 2017-06-23 | 2019-08-20 | Applied Materials, Inc. | Side storage pods, equipment front end modules, and methods for processing substrates |
KR102423761B1 (ko) | 2017-06-23 | 2022-07-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 인덱서블 측면 저장 포드 장치, 가열식 측면 저장 포드 장치, 시스템들, 및 방법들 |
US11097907B2 (en) * | 2017-07-10 | 2021-08-24 | Tokyo Electron Limited | Substrate transfer device and substrate transfer method |
CN109326546A (zh) * | 2017-07-31 | 2019-02-12 | 富士迈半导体精密工业(上海)有限公司 | 用于晶圆盒的气体填充装置及气体填充系统 |
US11373891B2 (en) * | 2018-10-26 | 2022-06-28 | Applied Materials, Inc. | Front-ducted equipment front end modules, side storage pods, and methods of operating the same |
US11508593B2 (en) * | 2018-10-26 | 2022-11-22 | Applied Materials, Inc. | Side storage pods, electronic device processing systems, and methods for operating the same |
US11189511B2 (en) * | 2018-10-26 | 2021-11-30 | Applied Materials, Inc. | Side storage pods, equipment front end modules, and methods for operating EFEMs |
US11244844B2 (en) * | 2018-10-26 | 2022-02-08 | Applied Materials, Inc. | High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods |
US11139190B2 (en) * | 2019-04-23 | 2021-10-05 | Applied Materials, Inc. | Equipment front end modules including multiple aligners, assemblies, and methods |
CN111952139B (zh) * | 2019-05-16 | 2023-11-14 | 北京北方华创微电子装备有限公司 | 半导体制造设备及半导体制造方法 |
KR102154475B1 (ko) * | 2020-04-06 | 2020-09-10 | (주) 예스티 | 반도체 부품용 듀얼 챔버 장치 |
US20210398824A1 (en) * | 2020-06-19 | 2021-12-23 | Applied Materials, Inc. | Batch wafer degas chamber and integration into factory interface and vacuum-based mainframe |
KR102389879B1 (ko) * | 2020-06-29 | 2022-04-22 | 송춘기 | 질소 누출 방지 기능을 구비한 이에프이엠 시스템 |
US11355368B2 (en) * | 2020-07-13 | 2022-06-07 | Applied Materials, Inc. | Decentralized substrate handling and processing system |
CN112349635A (zh) * | 2020-10-23 | 2021-02-09 | 杭州长川科技股份有限公司 | 晶圆与清针片存放装置 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11154699A (ja) * | 1997-11-21 | 1999-06-08 | Shin Etsu Polymer Co Ltd | 容器の封止構造 |
JP2003517724A (ja) * | 1999-07-28 | 2003-05-27 | ブルックス オートメーション インコーポレイテッド | 垂直方向に重ねられたロードロック部及び移送ロボット |
JP2005033118A (ja) * | 2003-07-11 | 2005-02-03 | Tdk Corp | パージ装置およびパージ方法 |
US20060045663A1 (en) * | 2004-08-05 | 2006-03-02 | Ravinder Aggarwal | Load port with manual FOUP door opening mechanism |
JP2009087972A (ja) * | 2007-09-27 | 2009-04-23 | Tokyo Electron Ltd | 基板収容機構及び半導体製造装置 |
JP2009538000A (ja) * | 2006-05-24 | 2009-10-29 | アルカテル−ルーセント | 密閉環境から汚染を除去するための方法および装置 |
US20100038283A1 (en) * | 2008-08-14 | 2010-02-18 | Ming-Long Chiu | Wafer container having the latch and inflatable seal element |
JP2010166077A (ja) * | 2004-09-15 | 2010-07-29 | Hitachi Kokusai Electric Inc | 基板装填脱装方法および半導体装置の製造方法 |
JP2015531546A (ja) * | 2012-09-24 | 2015-11-02 | ユ−ジーン テクノロジー カンパニー.リミテッド | ヒューム除去装置及び基板処理装置 |
KR20160114547A (ko) * | 2016-06-27 | 2016-10-05 | 피코앤테라(주) | 웨이퍼 수납용기 |
JP2017504218A (ja) * | 2014-01-21 | 2017-02-02 | ボムジェ ウ | ヒューム除去装置 |
JP2017028158A (ja) * | 2015-07-24 | 2017-02-02 | 東京エレクトロン株式会社 | ロードロック装置、及び基板処理システム |
JP2017063215A (ja) * | 2016-11-22 | 2017-03-30 | シンフォニアテクノロジー株式会社 | ロードポート |
Family Cites Families (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR970018335A (ko) * | 1995-09-28 | 1997-04-30 | 김광호 | 반도체 제조용 로더 스테이션의 카세트 안착불량 검출장치 |
JP3167970B2 (ja) | 1997-10-13 | 2001-05-21 | ティーディーケイ株式会社 | クリーンボックス、クリーン搬送方法及び装置 |
US6704998B1 (en) | 1997-12-24 | 2004-03-16 | Asyst Technologies, Inc. | Port door removal and wafer handling robotic system |
KR20030006683A (ko) * | 2001-07-14 | 2003-01-23 | 주식회사 신성이엔지 | 웨이퍼이송용기 오프너의 스테이지구동장치 |
JP2003092345A (ja) * | 2001-07-13 | 2003-03-28 | Semiconductor Leading Edge Technologies Inc | 基板収納容器、基板搬送システム、保管装置及びガス置換方法 |
JP3880343B2 (ja) | 2001-08-01 | 2007-02-14 | 株式会社ルネサステクノロジ | ロードポート、基板処理装置および雰囲気置換方法 |
KR20030037579A (ko) * | 2001-11-06 | 2003-05-14 | 삼성전자주식회사 | 캐리어 스테이지 |
US6955197B2 (en) | 2002-08-31 | 2005-10-18 | Applied Materials, Inc. | Substrate carrier having door latching and substrate clamping mechanisms |
JP4027837B2 (ja) | 2003-04-28 | 2007-12-26 | Tdk株式会社 | パージ装置およびパージ方法 |
WO2005015613A2 (en) * | 2003-08-07 | 2005-02-17 | Sundew Technologies, Llc | Perimeter partition-valve with protected seals |
JP2006261608A (ja) * | 2005-03-18 | 2006-09-28 | Canon Inc | デバイス製造装置及び制御方法 |
JP4904995B2 (ja) * | 2006-08-28 | 2012-03-28 | シンフォニアテクノロジー株式会社 | ロードポート装置 |
JP4816545B2 (ja) * | 2007-03-30 | 2011-11-16 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
TWI475627B (zh) | 2007-05-17 | 2015-03-01 | Brooks Automation Inc | 基板運送機、基板處理裝置和系統、於基板處理期間降低基板之微粒污染的方法,及使運送機與處理機結合之方法 |
JP5338335B2 (ja) * | 2008-08-13 | 2013-11-13 | 東京エレクトロン株式会社 | 搬送容器の開閉装置及びプローブ装置 |
WO2010080983A2 (en) | 2009-01-11 | 2010-07-15 | Applied Materials, Inc. | Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing |
US20100182586A1 (en) * | 2009-01-19 | 2010-07-22 | Canon Kabushiki Kaisha | Lithography apparatus, and method of manufacturing device using same |
JP2012094822A (ja) * | 2010-09-30 | 2012-05-17 | Shibaura Mechatronics Corp | 密閉型容器及び半導体製造装置 |
JP5617708B2 (ja) | 2011-03-16 | 2014-11-05 | 東京エレクトロン株式会社 | 蓋体開閉装置 |
JP2012204645A (ja) | 2011-03-25 | 2012-10-22 | Tokyo Electron Ltd | 蓋体開閉装置 |
JP6003011B2 (ja) | 2011-03-31 | 2016-10-05 | 東京エレクトロン株式会社 | 基板処理装置 |
KR101329304B1 (ko) * | 2011-07-29 | 2013-11-14 | 세메스 주식회사 | 기판처리장치 및 기판처리방법 |
KR101271246B1 (ko) | 2011-08-02 | 2013-06-07 | 주식회사 유진테크 | 에피택셜 공정을 위한 반도체 제조설비 |
KR20140023807A (ko) * | 2012-08-17 | 2014-02-27 | 삼성전자주식회사 | 반도체 소자를 제조하는 설비 |
KR101404621B1 (ko) * | 2012-11-05 | 2014-06-09 | 우범제 | 밀폐형 도어장치와 흄 제거장치를 갖춘 사이드 스토레이지 |
KR101444241B1 (ko) | 2013-01-14 | 2014-09-26 | 우범제 | 웨이퍼 처리장치의 배기시스템 |
CN105453246A (zh) | 2013-08-12 | 2016-03-30 | 应用材料公司 | 具有工厂接口环境控制的基板处理系统、装置和方法 |
KR101682473B1 (ko) | 2013-10-18 | 2016-12-05 | 삼성전자주식회사 | 사이드 스토리지 및 이를 구비하는 반도체 소자 제조 설비 |
TWI678751B (zh) * | 2013-12-13 | 2019-12-01 | 日商昕芙旎雅股份有限公司 | 設備前端模組(efem) |
WO2015099131A1 (ja) | 2013-12-26 | 2015-07-02 | 日本合成化学工業株式会社 | 掘削流体調整剤及びこれを用いた掘削流体 |
KR102173486B1 (ko) * | 2014-01-09 | 2020-11-03 | 주식회사 원익아이피에스 | 웨이퍼 처리장치 |
KR101611514B1 (ko) * | 2014-01-22 | 2016-04-11 | 우범제 | 퓸 제거 장치 |
JP6291878B2 (ja) | 2014-01-31 | 2018-03-14 | シンフォニアテクノロジー株式会社 | ロードポート及びefem |
CN105940487B (zh) * | 2014-02-07 | 2018-12-04 | 村田机械株式会社 | 净化装置以及净化方法 |
WO2015166710A1 (ja) * | 2014-04-28 | 2015-11-05 | 村田機械株式会社 | パージ装置及びパージ方法 |
US9543180B2 (en) * | 2014-08-01 | 2017-01-10 | Asm Ip Holding B.V. | Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum |
US9881826B2 (en) | 2014-10-24 | 2018-01-30 | Lam Research Corporation | Buffer station with single exit-flow direction |
JP6686014B2 (ja) | 2014-10-24 | 2020-04-22 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | ファクトリインターフェースで基板キャリアをパージするシステム、装置及び方法 |
WO2016085622A1 (en) | 2014-11-25 | 2016-06-02 | Applied Materials, Inc. | Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls |
KR101637498B1 (ko) * | 2015-03-24 | 2016-07-07 | 피코앤테라(주) | 웨이퍼 수납용기 |
KR101758214B1 (ko) | 2015-09-25 | 2017-07-14 | 주식회사 싸이맥스 | 웨이퍼 처리장치의 배기장치 |
JP6679906B2 (ja) * | 2015-12-11 | 2020-04-15 | Tdk株式会社 | Efem |
JP6613864B2 (ja) * | 2015-12-14 | 2019-12-04 | Tdk株式会社 | ミニエンバイロメント装置 |
KR200483073Y1 (ko) | 2016-07-15 | 2017-04-11 | 오션브릿지 주식회사 | 웨이퍼 스토리지용 퓸 제거 장치 |
KR20180045316A (ko) * | 2016-10-25 | 2018-05-04 | 삼성전자주식회사 | 설비 전방 단부 모듈 및 이를 포함하는 반도체 제조 장치 |
US10159169B2 (en) | 2016-10-27 | 2018-12-18 | Applied Materials, Inc. | Flexible equipment front end module interfaces, environmentally-controlled equipment front end modules, and assembly methods |
US10453726B2 (en) | 2016-11-10 | 2019-10-22 | Applied Materials, Inc. | Electronic device manufacturing load port apparatus, systems, and methods |
US10541165B2 (en) | 2016-11-10 | 2020-01-21 | Applied Materials, Inc. | Systems, apparatus, and methods for an improved load port backplane |
US10453727B2 (en) | 2016-11-10 | 2019-10-22 | Applied Materials, Inc. | Electronic device manufacturing load port apparatus, systems, and methods |
US10262884B2 (en) | 2016-11-10 | 2019-04-16 | Applied Materials, Inc. | Systems, apparatus, and methods for an improved load port |
KR101756743B1 (ko) * | 2016-12-30 | 2017-07-12 | 김태훈 | 웨이퍼 가공 설비용 버퍼 챔버 유닛 |
US10741432B2 (en) | 2017-02-06 | 2020-08-11 | Applied Materials, Inc. | Systems, apparatus, and methods for a load port door opener |
US10446428B2 (en) | 2017-03-14 | 2019-10-15 | Applied Materials, Inc. | Load port operation in electronic device manufacturing apparatus, systems, and methods |
CN106684023A (zh) * | 2017-03-14 | 2017-05-17 | 大族激光科技产业集团股份有限公司上海分公司 | 全封闭式smif系统 |
KR102423761B1 (ko) | 2017-06-23 | 2022-07-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 인덱서블 측면 저장 포드 장치, 가열식 측면 저장 포드 장치, 시스템들, 및 방법들 |
US10388547B2 (en) | 2017-06-23 | 2019-08-20 | Applied Materials, Inc. | Side storage pods, equipment front end modules, and methods for processing substrates |
-
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-
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Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11154699A (ja) * | 1997-11-21 | 1999-06-08 | Shin Etsu Polymer Co Ltd | 容器の封止構造 |
JP2003517724A (ja) * | 1999-07-28 | 2003-05-27 | ブルックス オートメーション インコーポレイテッド | 垂直方向に重ねられたロードロック部及び移送ロボット |
JP2005033118A (ja) * | 2003-07-11 | 2005-02-03 | Tdk Corp | パージ装置およびパージ方法 |
US20060045663A1 (en) * | 2004-08-05 | 2006-03-02 | Ravinder Aggarwal | Load port with manual FOUP door opening mechanism |
JP2010166077A (ja) * | 2004-09-15 | 2010-07-29 | Hitachi Kokusai Electric Inc | 基板装填脱装方法および半導体装置の製造方法 |
JP2009538000A (ja) * | 2006-05-24 | 2009-10-29 | アルカテル−ルーセント | 密閉環境から汚染を除去するための方法および装置 |
JP2009087972A (ja) * | 2007-09-27 | 2009-04-23 | Tokyo Electron Ltd | 基板収容機構及び半導体製造装置 |
US20100038283A1 (en) * | 2008-08-14 | 2010-02-18 | Ming-Long Chiu | Wafer container having the latch and inflatable seal element |
JP2015531546A (ja) * | 2012-09-24 | 2015-11-02 | ユ−ジーン テクノロジー カンパニー.リミテッド | ヒューム除去装置及び基板処理装置 |
JP2017504218A (ja) * | 2014-01-21 | 2017-02-02 | ボムジェ ウ | ヒューム除去装置 |
JP2017028158A (ja) * | 2015-07-24 | 2017-02-02 | 東京エレクトロン株式会社 | ロードロック装置、及び基板処理システム |
KR20160114547A (ko) * | 2016-06-27 | 2016-10-05 | 피코앤테라(주) | 웨이퍼 수납용기 |
JP2017063215A (ja) * | 2016-11-22 | 2017-03-30 | シンフォニアテクノロジー株式会社 | ロードポート |
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CN110809820A (zh) | 2020-02-18 |
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US11621182B2 (en) | 2023-04-04 |
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US10847390B2 (en) | 2020-11-24 |
TWI673585B (zh) | 2019-10-01 |
JP7267210B2 (ja) | 2023-05-01 |
US20230207354A1 (en) | 2023-06-29 |
JP2022095763A (ja) | 2022-06-28 |
JP2024041810A (ja) | 2024-03-27 |
CN116469814A (zh) | 2023-07-21 |
TWI779998B (zh) | 2022-10-01 |
TW201945875A (zh) | 2019-12-01 |
TW202121089A (zh) | 2021-06-01 |
TW202219673A (zh) | 2022-05-16 |
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JP7413428B2 (ja) | 2024-01-15 |
TWI711909B (zh) | 2020-12-01 |
KR102599502B1 (ko) | 2023-11-06 |
US20190267266A1 (en) | 2019-08-29 |
US10388547B2 (en) | 2019-08-20 |
KR20230012668A (ko) | 2023-01-26 |
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CN110809820B (zh) | 2023-04-18 |
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