JP2020511785A5 - - Google Patents

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Publication number
JP2020511785A5
JP2020511785A5 JP2019547451A JP2019547451A JP2020511785A5 JP 2020511785 A5 JP2020511785 A5 JP 2020511785A5 JP 2019547451 A JP2019547451 A JP 2019547451A JP 2019547451 A JP2019547451 A JP 2019547451A JP 2020511785 A5 JP2020511785 A5 JP 2020511785A5
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Japan
Prior art keywords
polishing
substrate
polishing pad
support member
support arm
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JP2019547451A
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Japanese (ja)
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JP7162000B2 (ja
JP2020511785A (ja
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Priority claimed from PCT/US2018/017358 external-priority patent/WO2018164804A1/en
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Publication of JP2020511785A5 publication Critical patent/JP2020511785A5/ja
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JP2019547451A 2017-03-06 2018-02-08 Ｃｍｐ位置特定研磨（ｌｓｐ）用に設計された螺旋及び同心運動 Active JP7162000B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762467672P 2017-03-06 2017-03-06
US62/467,672 2017-03-06
PCT/US2018/017358 WO2018164804A1 (en) 2017-03-06 2018-02-08 Spiral and concentric movement designed for cmp location specific polish (lsp)

Publications (3)

Publication Number Publication Date
JP2020511785A JP2020511785A (ja) 2020-04-16
JP2020511785A5 true JP2020511785A5 (https=) 2021-03-25
JP7162000B2 JP7162000B2 (ja) 2022-10-27

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ID=63356879

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Application Number Title Priority Date Filing Date
JP2019547451A Active JP7162000B2 (ja) 2017-03-06 2018-02-08 Ｃｍｐ位置特定研磨（ｌｓｐ）用に設計された螺旋及び同心運動

Country Status (6)

Country Link
US (2) US20180250788A1 (https=)
JP (1) JP7162000B2 (https=)
KR (1) KR102526545B1 (https=)
CN (1) CN110352115A (https=)
TW (1) TWI780114B (https=)
WO (1) WO2018164804A1 (https=)

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TWI771668B (zh) 2019-04-18 2022-07-21 美商應用材料股份有限公司 Cmp期間基於溫度的原位邊緣不對稱校正
JP7374710B2 (ja) * 2019-10-25 2023-11-07 株式会社荏原製作所 研磨方法および研磨装置
TWI797501B (zh) * 2019-11-22 2023-04-01 美商應用材料股份有限公司 在拋光墊中使用溝槽的晶圓邊緣不對稱校正
CN113411486B (zh) 2020-03-16 2022-05-17 浙江宇视科技有限公司 云台摄像机控制方法、装置、云台摄像机和存储介质
US20210323117A1 (en) * 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11919120B2 (en) 2021-02-25 2024-03-05 Applied Materials, Inc. Polishing system with contactless platen edge control
US20230024009A1 (en) * 2021-07-20 2023-01-26 Applied Materials, Inc. Face-up wafer edge polishing apparatus
US12519020B2 (en) * 2022-06-17 2026-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
WO2024015530A1 (en) * 2022-07-14 2024-01-18 Applied Materials, Inc. Monitoring thickness in face-up polishing
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US20260070182A1 (en) * 2024-09-11 2026-03-12 Service Support Specialties, Inc. Chemical mechanical planarization apparatus and method

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