JP7162000B2 - Ｃｍｐ位置特定研磨（ｌｓｐ）用に設計された螺旋及び同心運動 - Google Patents

Ｃｍｐ位置特定研磨（ｌｓｐ）用に設計された螺旋及び同心運動 Download PDF

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Publication number
JP7162000B2
JP7162000B2 JP2019547451A JP2019547451A JP7162000B2 JP 7162000 B2 JP7162000 B2 JP 7162000B2 JP 2019547451 A JP2019547451 A JP 2019547451A JP 2019547451 A JP2019547451 A JP 2019547451A JP 7162000 B2 JP7162000 B2 JP 7162000B2
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polishing
substrate
motion
support arm
housing
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JP2019547451A
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Japanese (ja)
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JP2020511785A (ja
JP2020511785A5 (https=
Inventor
エリック ラウ，
チー チュン チョウ，
チャールズ シー． ギャレットソン，
ジョンフン オー，
キン イー ヒョン，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2020511785A5 publication Critical patent/JP2020511785A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/005—Blocking means, chucks or the like; Alignment devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Dental Tools And Instruments Or Auxiliary Dental Instruments (AREA)
JP2019547451A 2017-03-06 2018-02-08 Ｃｍｐ位置特定研磨（ｌｓｐ）用に設計された螺旋及び同心運動 Active JP7162000B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762467672P 2017-03-06 2017-03-06
US62/467,672 2017-03-06
PCT/US2018/017358 WO2018164804A1 (en) 2017-03-06 2018-02-08 Spiral and concentric movement designed for cmp location specific polish (lsp)

Publications (3)

Publication Number Publication Date
JP2020511785A JP2020511785A (ja) 2020-04-16
JP2020511785A5 JP2020511785A5 (https=) 2021-03-25
JP7162000B2 true JP7162000B2 (ja) 2022-10-27

Family

ID=63356879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019547451A Active JP7162000B2 (ja) 2017-03-06 2018-02-08 Ｃｍｐ位置特定研磨（ｌｓｐ）用に設計された螺旋及び同心運動

Country Status (6)

Country Link
US (2) US20180250788A1 (https=)
JP (1) JP7162000B2 (https=)
KR (1) KR102526545B1 (https=)
CN (1) CN110352115A (https=)
TW (1) TWI780114B (https=)
WO (1) WO2018164804A1 (https=)

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EP3640972A1 (en) * 2018-10-18 2020-04-22 ASML Netherlands B.V. System and method for facilitating chemical mechanical polishing
US11890717B2 (en) 2018-12-26 2024-02-06 Applied Materials, Inc. Polishing system with platen for substrate edge control
TWI771668B (zh) 2019-04-18 2022-07-21 美商應用材料股份有限公司 Cmp期間基於溫度的原位邊緣不對稱校正
JP7374710B2 (ja) * 2019-10-25 2023-11-07 株式会社荏原製作所 研磨方法および研磨装置
TWI797501B (zh) * 2019-11-22 2023-04-01 美商應用材料股份有限公司 在拋光墊中使用溝槽的晶圓邊緣不對稱校正
CN113411486B (zh) 2020-03-16 2022-05-17 浙江宇视科技有限公司 云台摄像机控制方法、装置、云台摄像机和存储介质
US20210323117A1 (en) * 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11919120B2 (en) 2021-02-25 2024-03-05 Applied Materials, Inc. Polishing system with contactless platen edge control
US20230024009A1 (en) * 2021-07-20 2023-01-26 Applied Materials, Inc. Face-up wafer edge polishing apparatus
US12519020B2 (en) * 2022-06-17 2026-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
WO2024015530A1 (en) * 2022-07-14 2024-01-18 Applied Materials, Inc. Monitoring thickness in face-up polishing
CN119526128B (zh) * 2023-08-29 2026-02-13 中国联合网络通信集团有限公司 一种平面打磨的方法、装置及可读存储介质
US20260070182A1 (en) * 2024-09-11 2026-03-12 Service Support Specialties, Inc. Chemical mechanical planarization apparatus and method

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JP2010130022A (ja) 2008-11-28 2010-06-10 Semes Co Ltd 基板研磨装置、及びそれを利用する基板研磨方法
WO2016010866A1 (en) 2014-07-17 2016-01-21 Applied Materials, Inc. Method, system and polishing pad for chemical mechancal polishing
JP2016058724A (ja) 2014-09-11 2016-04-21 株式会社荏原製作所 処理モジュール、処理装置、及び、処理方法

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JP2004074314A (ja) 2002-08-12 2004-03-11 Nikon Corp 研磨体、この研磨体を備えた研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの半導体デバイス製造方法により製造された半導体デバイス
JP2010130022A (ja) 2008-11-28 2010-06-10 Semes Co Ltd 基板研磨装置、及びそれを利用する基板研磨方法
WO2016010866A1 (en) 2014-07-17 2016-01-21 Applied Materials, Inc. Method, system and polishing pad for chemical mechancal polishing
JP2016058724A (ja) 2014-09-11 2016-04-21 株式会社荏原製作所 処理モジュール、処理装置、及び、処理方法

Also Published As

Publication number Publication date
TW201835998A (zh) 2018-10-01
KR20190117795A (ko) 2019-10-16
TWI780114B (zh) 2022-10-11
US20180250788A1 (en) 2018-09-06
CN110352115A (zh) 2019-10-18
WO2018164804A1 (en) 2018-09-13
KR102526545B1 (ko) 2023-04-28
JP2020511785A (ja) 2020-04-16
US20200282506A1 (en) 2020-09-10

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