JP2020009433A - ルーティングアセンブリ - Google Patents
ルーティングアセンブリ Download PDFInfo
- Publication number
- JP2020009433A JP2020009433A JP2019118731A JP2019118731A JP2020009433A JP 2020009433 A JP2020009433 A JP 2020009433A JP 2019118731 A JP2019118731 A JP 2019118731A JP 2019118731 A JP2019118731 A JP 2019118731A JP 2020009433 A JP2020009433 A JP 2020009433A
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- JP
- Japan
- Prior art keywords
- connector
- tray
- routing assembly
- connectors
- chip package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004020 conductor Substances 0.000 claims description 8
- 230000013011 mating Effects 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims 1
- 238000004891 communication Methods 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 18
- 239000000758 substrate Substances 0.000 description 12
- 230000008054 signal transmission Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
- H01R13/518—Means for holding or embracing insulating body, e.g. casing, hoods for holding or embracing several coupling parts, e.g. frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1439—Back panel mother boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
Abstract
Description
本出願は、2016年1月11日に出願された米国仮特許出願第62/277,275号の優先権を主張する。
Claims (5)
- ルーティングアセンブリであって、
N行1列のアレイの複数のポートを画定する前面を有するフレームであって、Nが少なくとも2である、フレームと、
各ポートと位置合せされたコネクタハウジングであって、金属材料から成るコネクタハウジングと、
前記フレームから延在するトレイであって、内部開口部を含むトレイと、
各コネクタハウジング内に位置付けられた複数の第1のコネクタと、
該複数の第1のコネクタに接続された第1の端及びトレイから内部開口部内に延在する第2の端を有する複数のケーブルであって、該複数のケーブルの一部分が所定の構成で前記トレイを通って延在する、複数のケーブルと、
前記第2の端上に装着された複数の第2のコネクタとを備え、前記複数のケーブルが、回路基板をバイパスしている間、信号が前記第1のコネクタと前記第2のコネクタとの間を通過することを可能にするように構成されている、ルーティングアセンブリ。 - 前記第2のコネクタが、前記トレイに対して横断する嵌合方向を有する、請求項1に記載のルーティングアセンブリ。
- 前記フレームが、前記トレイを支持する側部支持体を含んでいる、請求項2に記載のルーティングアセンブリ。
- 前記トレイが、片持ち様式で前記前面から延在している、請求項3に記載のルーティングアセンブリ。
- 前記トレイが、導電性材料から形成されている、請求項4に記載のルーティングアセンブリ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662277275P | 2016-01-11 | 2016-01-11 | |
US62/277,275 | 2016-01-11 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018536097A Division JP6549327B2 (ja) | 2016-01-11 | 2017-01-11 | ルーティングアセンブリ及びそれを使用するシステム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020009433A true JP2020009433A (ja) | 2020-01-16 |
JP6821746B2 JP6821746B2 (ja) | 2021-01-27 |
Family
ID=59312135
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018536097A Active JP6549327B2 (ja) | 2016-01-11 | 2017-01-11 | ルーティングアセンブリ及びそれを使用するシステム |
JP2019118731A Active JP6821746B2 (ja) | 2016-01-11 | 2019-06-26 | ルーティングアセンブリ |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018536097A Active JP6549327B2 (ja) | 2016-01-11 | 2017-01-11 | ルーティングアセンブリ及びそれを使用するシステム |
Country Status (6)
Country | Link |
---|---|
US (4) | US10424856B2 (ja) |
JP (2) | JP6549327B2 (ja) |
KR (1) | KR102092627B1 (ja) |
CN (1) | CN108713355B (ja) |
TW (1) | TWI648613B (ja) |
WO (1) | WO2017123574A1 (ja) |
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WO2017123574A1 (en) | 2016-01-11 | 2017-07-20 | Molex, Llc | Routing assembly and system using same |
CN110839182B (zh) | 2016-01-19 | 2021-11-05 | 莫列斯有限公司 | 集成路由组件以及采用集成路由组件的系统 |
CN111164841B (zh) | 2017-08-03 | 2022-01-28 | 安费诺有限公司 | 用于高速互连的线缆连接器 |
CN112514175B (zh) | 2018-04-02 | 2022-09-09 | 安达概念股份有限公司 | 受控阻抗顺应性线缆终端头 |
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CN208862209U (zh) | 2018-09-26 | 2019-05-14 | 安费诺东亚电子科技(深圳)有限公司 | 一种连接器及其应用的pcb板 |
CN113474706B (zh) | 2019-01-25 | 2023-08-29 | 富加宜(美国)有限责任公司 | 被配置用于线缆连接至中间板的i/o连接器 |
WO2020154526A1 (en) * | 2019-01-25 | 2020-07-30 | Fci Usa Llc | I/o connector configured for cabled connection to the midboard |
US10790269B2 (en) * | 2019-01-29 | 2020-09-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor devices and semiconductor structures |
WO2020172395A1 (en) | 2019-02-22 | 2020-08-27 | Amphenol Corporation | High performance cable connector assembly |
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TW202130060A (zh) | 2019-09-27 | 2021-08-01 | 美商Fci美國有限責任公司 | 高效能之堆疊式接頭 |
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CN113258325A (zh) | 2020-01-28 | 2021-08-13 | 富加宜(美国)有限责任公司 | 高频中板连接器 |
CN112490806A (zh) * | 2020-11-17 | 2021-03-12 | 广东电网有限责任公司电力科学研究院 | 一种软连接装置 |
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2017
- 2017-01-11 WO PCT/US2017/012917 patent/WO2017123574A1/en active Application Filing
- 2017-01-11 KR KR1020187022801A patent/KR102092627B1/ko active IP Right Grant
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TW201732493A (zh) | 2017-09-16 |
US20180309214A1 (en) | 2018-10-25 |
JP6821746B2 (ja) | 2021-01-27 |
US11108176B2 (en) | 2021-08-31 |
JP2019504417A (ja) | 2019-02-14 |
WO2017123574A1 (en) | 2017-07-20 |
JP6549327B2 (ja) | 2019-07-24 |
CN108713355A (zh) | 2018-10-26 |
US20190319380A1 (en) | 2019-10-17 |
US11688960B2 (en) | 2023-06-27 |
US20210359438A1 (en) | 2021-11-18 |
US20200403335A1 (en) | 2020-12-24 |
KR20180094119A (ko) | 2018-08-22 |
KR102092627B1 (ko) | 2020-03-24 |
TWI648613B (zh) | 2019-01-21 |
US10424856B2 (en) | 2019-09-24 |
CN108713355B (zh) | 2020-06-05 |
US10797416B2 (en) | 2020-10-06 |
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