M359141 五、新型說明·· 【新型所屬之技術領域】 本創作係為一種連接器總成，關於一種連接器的零部 件’尤指一種將連接器安裝至設備上之裝置。 【先前技術】 隨著全球化時代來臨，人們對於工作步調的快速與便M359141 V. New description·· 【New technical field of the invention】 This creation is a connector assembly, relating to a component of a connector, especially a device for mounting a connector to a device. [Prior Art] With the advent of the era of globalization, people are quick and easy to work.
利性要求已遠非過去時代可比擬，如何在最短時間内完成 表夕功此或達到最高效率的生活需求，正是今曰消費者於 選講各類電子產品時所依循的準則’故電子產品應如何突 破研發瓶頸以開發出兼具小尺寸、多功能與高效率之新世 代產品，正是近年來為迎合消費者此一需求所不得不然的 研發趨勢，由研發角度觀之，近十年一曰千里的半導體製 程與ic設計技術雖已成功地使電子元件完成尺寸縮小與 積集化之目標，且同時又可兼有多功能整合之功效，卻也 不免衍生其他難以解決的新問題，導致元件可靠度降低， 此係由於電子元件於操作時需要電功率來驅動作功，然其 效料可能輕百分之百，因此，所浪費之功率即轉換成 熱能而使整體系統之操作溫度大幅上升，假若操作溫度超 過容=之範圍’系崎作即可能產生錯誤，甚至可能於溫 度過间下造成系統故障或燒毀之情形，對前述新世代高密 度電子產品而言，其内部電子元件之數目與運算速度均遠 2統產品為高，使用過程中所產生之熱量自然越大，極 造成操作溫度大於容許·之狀況，形成額外的使用問 M359141 題。 因此，如何創作出—種連 產生高熱量之連接器晶片模缸接=，於該些會 各種連接器晶片，將* 更加廣泛地應用於 【新型内容】 疋本創作所欲積極揭露之處。 有鑑於上述習知連接器之缺 完善，遂竭其心智悉心研究克服，，* =感其未臻於 之累積經驗’進:研發出-種連接器總成，年 用於該些會產生高熱量之連接器晶片模組，進 = 泛地應用於各種連接器晶片之目的。 更加廣 為達上述目的，本創作提出—種 有：-底部殼體，具有複數個第一通孔侧二有= 個第一卡扣件；一上部殼體，其長度較 有：複數個第一凸塊n又體長，具 針腳，係設置於該上部殼:兩側r至;:::：;複數個 體後側，其中，利用該等該 扣件互相嵌合，該底部殼體和該上部殼體結合 口’-彈片構件’係設置於該開口處； 汗 合於該彈片構件上，·至少—散熱^少扣 具有:·至少二止壓片，係設置於該散熱片扣具二= 部，係投置於該散熱片扣具之一 抵 扣合；及一第三卡扣件該等第二卡扣件 側，—合， M359141 熱片扣合於該上部殼體之上；及至少一導光柱，係設置於 該散熱片扣具之上。 藉此，本創作之一種連接器總成，可確實適用於該些 會產生高熱量之連接器晶片模組，進而可更加廣泛地應用 於各種連接器晶片。 【實施方式】 為充分瞭解本創作之目的、特徵及功效，茲藉由下述 具體之實施例，並配合所附之圖式，對本創作做一詳細說 明，說明如後： 首先，請參閱第一至第三圖，第一圖係為依據本創作 一實施例之連接器總成的爆炸圖；第二圖係為依據本創作 一實施例之連接器總成的立體圖；及第三圖係為第二圖 中，沿A-A線之連接器總成的剖視圖。其中，本創作之一 種連接器總成，包含有一底部殼體10、一上部殼體20、 一彈片構件30、一前置式扣具40、一散熱片50、一散熱 片扣具60及一導光柱70。 該底部殼體10，具有複數個第一通孔12，兩側設置 有複數個第一卡扣件14。該上部殼體20，其長度較該底 部殼體長10，具有複數個第一凸塊22、複數個針腳24、 二第二卡扣件26及一定位件28。該等第一凸塊22係設置 於該上部殼體20兩側。該等針腳24係設置於該上部殼體 20兩侧。該等第二卡扣件26係設置於該上部殼體20頂 面。該定位件28係設置於該上部殼體20後側。其中，利 用該等第一凸塊22與該底部殼體10之第一卡扣件14互 M359141 相嵌合，該底部殼體10和該上部殼體20結合後具有一開 Π ° 該彈片構件30係設置於該開口處，該前置式扣具40 則扣合於該彈片構件30上。藉由上述元件之組合而形成 一連接器端子的插入空間，可供連接器端子插入。 該散熱片扣具60具有四止壓片62、一摺部64及一第 三卡扣件66。該等止壓片62係兩兩設置於該散熱片扣具 60兩側。該摺部64係設置於該散熱片扣具60之一侧，以 與該等第二卡扣件26扣合。該第三卡扣件66係設置於該 散熱片扣具60之另一側，以與該定位件28扣合，其中， 利用該散熱片扣具60將該散熱片50扣合於該上部殼體20 之上。該導光柱70係設置於該散熱片扣具60之上，係用 以導引位於所設置之電路板上的LED燈所產生之光束， 該LED燈可用以顯示該連接器晶片模組是否失效。 藉由於該上部殼體20上設置有可拆卸之一散熱片50 及一散熱片扣具60,則可將該些會產生高熱量之連接器晶 片模組所產生之熱量有效發散，而減少散熱器晶片模組損 壞的可能。 本創作的連接器總成中，該散熱片扣具60之兩侧可 分別更具有一凹槽68,該導光柱70對應該凹槽68之位置 處更分別具有一圓柱體72以套設入該凹槽68。 本創作的連接器總成中，該上部殼體20可更具有兩 第二通孔29，係設置於該上部殼體20之後侧，該導光柱 70對應該等第二通孔29之位置處更具有兩凸柱74以套設 M359141 入該等第二通孔29。 藉由該凹槽68及相對應之圓柱體72，則可使該散熱 片扣具60與該導光柱70之結合更形穩固。藉由該等第二 通孔29及相對應之凸柱74,則可使該上部殼體20與該導 光柱70之結合更形穩固。 接著請參考第四、五圖，第四圖係為依據本創作另一 實施例之連接器總成的爆炸圖；第五圖係為第四圖中依據 本創作另一實施例之連接器總成的立體圖。其中，本創作 另一態樣之一種連接器總成，包含有一底部殼體10’、一 上部殼體20’、一彈片構件30’、一前置式扣具40’、複數 個散熱片50’、複數個散熱片扣具60’及複數個導光柱 70’，及至少一間隔板25。 該底部殼體10’，具有複數個第一通孔12’，兩側設置 有複數個第一卡扣件14’。該上部殼體20’，其長度較該底 部殼體長10’，具有複數個第一凸塊22’、複數個針腳24’、 複數個第二卡扣件26’及複數個定位件28’。該等第一凸塊 22’係設置於該上部殼體20’兩側。該等針腳24’係設置於 該上部殼體20’兩側。該等第二卡扣件26’係設置於該上部 殼體20’頂面。該等定位件28’係設置於該上部殼體20’後 側。其中，利用該等第一凸塊22’與該底部殼體10’之第一 卡扣件14’互相嵌合，該底部殼體10’和該上部殼體20’結 合後具有一開口。 該彈片構件30’係設置於該開口處，該前置式扣具40’ 則扣合於該彈片構件30’上。該間隔板25係設置於該底部 M359141 殼體10’與該上部殼體20’之間，以間隔出複數個連接器端 子的插入空間，並導引該等連接器端子的插入。 該等散熱片扣具60’分別具有四止壓片62’、一摺部 64’及一第三卡扣件66’。該等止壓片62’係兩兩設置於該 散熱片扣具60’兩側。該摺部64’係設置於該散熱片扣具 60’之一侧，以與該等第二卡扣件26’扣合。該第三卡扣件 66’係設置於該散熱片扣具60’之另一側，以與該定位件28’ 扣合，其中，利用該等散熱片扣具60’將該等散熱片50’ 扣合於該上部殼體20’之上。該等導光柱70’係設置於該等 散熱片扣具60’之上，係用以導引位於所設置之電路板上 的LED燈所產生之光束，該LED燈可用以顯示該連接器 晶片核組是否失效。 藉由於該上部殼體20’上設置有可拆卸之該等散熱片 50’及該等散熱片扣具60’，則可將該些會產生高熱量之連 接器晶片模組所產生之熱量有效發散，而減少散熱器晶片 模組損壞的可能。 本創作的連接器總成中，該等散熱片扣具60’之兩側 可分別更具有一凹槽68’，該等導光柱70’對應該凹槽68’ 之位置處更分別具有一圓柱體7’2以套設入該凹槽68’。 本創作的連接器總成中，該上部殼體20’可更具有複 數個第二通孔29’，係設置於該上部殼體20’之後侧，該等 導光柱70’對應該等第二通孔29’之位置處更具有兩凸柱 74以套設入該等第二通孔29’。 藉由該凹槽68’及相對應之圓柱體72’，則可使該等散 M359141 熱片扣具60’與該等導光柱70’之結合更形穩固。藉由該等 第二通孔29’及相對應之凸柱74’，則可使該上部殼體20’ 與該等導光柱70’之結合更形穩固。 本創作在上文中已以較佳實施例揭露，然熟習本項技 術者應理解的是，該實施例僅用於描繪本創作，而不應解 讀為限制本創作之範圍。應注意的是，舉凡與該實施例等 效之變化與置換，均應設為涵蓋於本創作之範疇内。因 此，本創作之保護範圍當以下文之申請專利範圍所界定者 為準。 【圖式簡單說明】 第一圖係為依據本創作一實施例之連接器總成的爆炸圖。 第二圖係為依據本創作一實施例之連接器總成的立體圖。 第三圖係為第二圖中，沿A-A線之連接器總成的剖視圖。 第四圖係為依據本創作另一實施例之連接器總成的爆炸 圖。 第五圖係為第四圖中依據本創作另一實施例之連接器總 成的立體圖。 【主要元件符號說明】 10，10， 底部殼體 12,12， 第一通孔 14,145 第一卡扣件 20,20， 上部殼體 22,22， 第一凸塊 24,24， 針腳 M359141 25 間隔板 26,26， 第二卡扣件 28,28’ 定位件 29,295 第二通孔 30,30， 彈片構件 40,40’ 前置式扣具 50,505 散熱片 60,60， 散熱片扣具 • 62,62’ 止壓片 64,64’ 摺部 66,66’ 第三卡扣件 68,68， 凹槽 70,705 導光柱 12,IT 圓柱體 74,74’ 凸柱The demand for interest is far from being comparable in the past. How to complete the best or the most efficient living needs in the shortest time is the standard that consumers follow today when they choose to talk about various electronic products. How should products break through the research and development bottlenecks to develop new generation products with small size, multi-function and high efficiency? It is the R&D trend that has to be commensurate with the needs of consumers in recent years. From the perspective of R&D, nearly ten Although the semiconductor process and ic design technology have been successfully completed, the electronic components have achieved the goal of size reduction and integration, and at the same time they have the function of multi-functional integration, but they are also inevitably derived from other difficult problems. The reliability of the component is reduced. This is because the electronic component needs electric power to drive the work during operation, but the effect may be 100% lighter. Therefore, the wasted power is converted into heat energy, and the operating temperature of the overall system is greatly increased. If the operating temperature exceeds the range of the volume=, it may cause errors, and may even cause the system to be caused by temperature. In the case of obstacles or burnout, for the aforementioned new generation of high-density electronic products, the number of internal electronic components and the calculation speed are far higher than those of the second-generation products. The heat generated during use is naturally larger, and the operating temperature is extremely larger. Allowing the situation to form an additional use question M359141. Therefore, how to create a connector chip module with high heat generation will be used in a variety of connector wafers, and will be more widely used in [new content]. In view of the lack of perfection of the above-mentioned conventional connectors, exhausting their mental research and overcoming, * = feeling that they have not accumulated experience in the 'into: develop a kind of connector assembly, the annual use for these will produce high The thermal connector chip module is used for a variety of connector wafers. More broadly for the above purposes, the present invention proposes: a bottom housing having a plurality of first through-hole sides 2 having a first snap member; an upper housing having a length of more than: plural a bump n is long and has a pin, and is disposed on the upper shell: both sides r to;::::; a plurality of individual rear sides, wherein the bottom case is fitted with the fasteners, the bottom case and The upper housing joint port '-spring member' is disposed at the opening; the sweat is coupled to the elastic piece member, and at least the heat dissipation and the low buckle have: at least two stop pieces, which are disposed on the heat sink clip The second part is placed on one of the heat sink fasteners; and a third fastener is on the side of the second fastening piece, and the M359141 hot piece is fastened on the upper casing And at least one light guide is disposed on the heat sink clip. Therefore, the connector assembly of the present invention can be applied to the connector chip modules which generate high heat, and can be more widely applied to various connector chips. [Embodiment] In order to fully understand the purpose, features and effects of this creation, the following specific examples and the accompanying drawings are used to explain the creation in detail, as follows: First, please refer to 1 to 3, the first diagram is an exploded view of the connector assembly according to an embodiment of the present invention; the second diagram is a perspective view of the connector assembly according to an embodiment of the present invention; and the third diagram In the second figure, a cross-sectional view of the connector assembly along the AA line. The connector assembly of the present invention comprises a bottom housing 10, an upper housing 20, a spring member 30, a front buckle 40, a heat sink 50, a heat sink clip 60 and a Light guide column 70. The bottom housing 10 has a plurality of first through holes 12, and a plurality of first fastening members 14 are disposed on both sides. The upper casing 20 has a length 10 longer than the bottom casing, and has a plurality of first projections 22, a plurality of pins 24, two second fastening members 26 and a positioning member 28. The first bumps 22 are disposed on both sides of the upper casing 20. The pins 24 are disposed on both sides of the upper housing 20. The second fastening members 26 are disposed on the top surface of the upper casing 20. The positioning member 28 is disposed on the rear side of the upper casing 20. The first protrusions 22 are engaged with the first fastening members 14 of the bottom housing 10, M359141, and the bottom housing 10 and the upper housing 20 are combined to have an opening. The elastic member The 30 series is disposed at the opening, and the front type fastener 40 is fastened to the elastic member 30. The insertion space of a connector terminal is formed by the combination of the above elements, and the connector terminal can be inserted. The heat sink clip 60 has a four-stop sheet 62, a folded portion 64 and a third clip member 66. The pressure-retaining pieces 62 are disposed on both sides of the heat-dissipating clip 60. The folded portion 64 is disposed on one side of the heat sink clip 60 to be engaged with the second fastening members 26. The third fastening member 66 is disposed on the other side of the heat sink clip 60 to be engaged with the positioning member 28, wherein the heat sink 50 is fastened to the upper shell by the heat sink fastener 60. Above body 20. The light guide column 70 is disposed on the heat sink clip 60 for guiding a light beam generated by an LED lamp on the disposed circuit board, and the LED light can be used to indicate whether the connector chip module is invalid. . Since the upper housing 20 is provided with a detachable heat sink 50 and a heat sink clip 60, the heat generated by the high-heat connector chip module can be effectively dissipated to reduce heat dissipation. The possibility of damage to the wafer module. In the connector assembly of the present invention, the two sides of the heat sink clip 60 can respectively have a recess 68, and the light guide column 70 has a cylindrical body 72 corresponding to the position of the recess 68 to be sleeved. The groove 68. In the connector assembly of the present invention, the upper housing 20 may further have two second through holes 29 disposed on the rear side of the upper housing 20, and the position of the light guiding column 70 corresponding to the second through hole 29 There are two protrusions 74 to insert the M359141 into the second through holes 29. With the groove 68 and the corresponding cylinder 72, the combination of the heat sink clip 60 and the light guide post 70 can be more stable. With the second through holes 29 and the corresponding studs 74, the combination of the upper housing 20 and the light guide post 70 can be more stable. Next, please refer to the fourth and fifth figures. The fourth figure is an exploded view of the connector assembly according to another embodiment of the present creation; the fifth figure is the total connector of the fourth embodiment according to another embodiment of the present creation. A stereogram. The connector assembly of another aspect of the present invention comprises a bottom housing 10 ′, an upper housing 20 ′, a spring member 30 ′, a front buckle 40 ′, and a plurality of heat sinks 50 . ', a plurality of heat sink clips 60' and a plurality of light guides 70', and at least one spacer 25. The bottom case 10' has a plurality of first through holes 12', and a plurality of first snap members 14' are disposed on both sides. The upper housing 20' has a length 10' longer than the bottom housing, and has a plurality of first protrusions 22', a plurality of pins 24', a plurality of second fastening members 26', and a plurality of positioning members 28' . The first bumps 22' are disposed on both sides of the upper casing 20'. The pins 24' are disposed on both sides of the upper casing 20'. The second fastening members 26' are disposed on the top surface of the upper casing 20'. The positioning members 28' are disposed on the rear side of the upper casing 20'. Wherein, the first protrusions 22' are engaged with the first fastening members 14' of the bottom case 10', and the bottom case 10' and the upper case 20' are combined to have an opening. The elastic member 30' is disposed at the opening, and the front fastener 40' is fastened to the elastic member 30'. The spacer 25 is disposed between the bottom portion M359141 of the housing 10' and the upper housing 20' to space the insertion spaces of the plurality of connector terminals and guide the insertion of the connector terminals. The fin fasteners 60' respectively have four stoppers 62', a folded portion 64' and a third fastener member 66'. The pressure-retaining pieces 62' are disposed on both sides of the heat-dissipating clip 60'. The folded portion 64' is disposed on one side of the heat sink clip 60' to be engaged with the second fastening member 26'. The third fastening member 66' is disposed on the other side of the heat sink fastener 60' to be engaged with the positioning member 28'. The heat sink 50 is used by the heat sink fasteners 60'. 'Snaps over the upper housing 20'. The light guides 70' are disposed on the heat sink clips 60' for guiding the light beams generated by the LED lamps on the disposed circuit board, and the LED lights can be used to display the connector wafers. Whether the nuclear group is invalid. By providing the detachable heat sinks 50 ′ and the heat sink clips 60 ′ on the upper casing 20 ′, the heat generated by the high-heat connector chip modules can be effectively Divergence reduces the possibility of damage to the heat sink wafer module. In the connector assembly of the present invention, the two sides of the heat sink clips 60' may respectively have a recess 68', and the light guide posts 70' respectively have a cylinder at the position corresponding to the recess 68'. The body 7'2 is sleeved into the recess 68'. In the connector assembly of the present invention, the upper housing 20 ′ may further have a plurality of second through holes 29 ′ disposed on the rear side of the upper housing 20 ′, and the light guiding columns 70 ′ are corresponding to the second. The position of the through hole 29' further has two protrusions 74 to be sleeved into the second through holes 29'. By the groove 68' and the corresponding cylinder 72', the combination of the three-dimensional M359141 hot sheet fastener 60' and the light guiding rods 70' can be made more stable. By the second through holes 29' and the corresponding studs 74', the combination of the upper casing 20' and the light guiding columns 70' can be made more stable. The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that the present invention is only intended to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations that are equivalent to the embodiment are intended to be within the scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application below. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an exploded view of a connector assembly in accordance with an embodiment of the present invention. The second drawing is a perspective view of a connector assembly in accordance with an embodiment of the present invention. The third figure is a cross-sectional view of the connector assembly along line A-A in the second figure. The fourth figure is an exploded view of the connector assembly in accordance with another embodiment of the present creation. The fifth drawing is a perspective view of the connector assembly according to another embodiment of the present invention in the fourth figure. [Main component symbol description] 10,10, bottom housing 12,12, first through hole 14,145 first fastening member 20,20, upper housing 22,22, first projection 24,24, stitch M359141 25 spacing Plates 26, 26, second snap members 28, 28' locating members 29, 295 second through holes 30, 30, spring members 40, 40' front buckles 50, 505 heat sinks 60, 60, heat sink clips 62, 62' stop plate 64, 64' fold 66, 66' third snap 68, 68, groove 70, 705 light guide 12, IT cylinder 74, 74'