JP2019526927A - 傾斜イオンビーム蒸着を用いる複合パターニングマスク - Google Patents
傾斜イオンビーム蒸着を用いる複合パターニングマスク Download PDFInfo
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- 239000002131 composite material Substances 0.000 title claims abstract description 38
- 238000000059 patterning Methods 0.000 title claims description 15
- 238000007737 ion beam deposition Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 169
- 239000000463 material Substances 0.000 claims abstract description 101
- 238000000034 method Methods 0.000 claims abstract description 63
- 238000005530 etching Methods 0.000 claims abstract description 62
- 150000002500 ions Chemical class 0.000 claims abstract description 59
- 238000010884 ion-beam technique Methods 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 230000004907 flux Effects 0.000 claims description 9
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 150000004767 nitrides Chemical class 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- -1 tungsten nitride Chemical class 0.000 claims description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 1
- 229910001936 tantalum oxide Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 73
- 230000008569 process Effects 0.000 description 27
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 229910052799 carbon Inorganic materials 0.000 description 10
- 238000000151 deposition Methods 0.000 description 10
- 238000001020 plasma etching Methods 0.000 description 9
- 230000008021 deposition Effects 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
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Abstract
Description
本出願は、2016年8月9日に出願された米国仮特許出願第62/372,388号の利益を主張し、その全体は参照により本明細書に組み込まれる。
Claims (15)
- 基板の上に配置されるマスクに最初のマスク造作を提供するステップであって、該最初のマスク造作は第1の材料を含み、前記基板は基板平面を画定するステップと、
イオンをイオンビームとして、前記基板平面に対する垂線に対して、非ゼロの入射角θで、前記最初のマスク造作へ向けるステップであって、複合マスク造作が形成され、該複合マスク造作は前記最初のマスク造作の上に配置されるキャップ材料を含み、該キャップ材料は前記イオンを含むステップと、
基板エッチングを実施するステップであって、エッチングの造作が前記基板に形成され、前記最初のマスク造作の少なくとも1部が、前記基板エッチングの後に、残り、前記基板エッチングは、前記第1の材料を第1のエッチング速度でエッチングし、前記キャップ材料を第2のエッチング速度でエッチングし、前記第1のエッチング速度は前記第2のエッチング速度より大きいステップと、を有する、方法。 - 前記キャップ材料は、Al、Ta、W、Ti、酸化アルミニウム、酸化タンタル、窒化アルミニウム、窒化タンタル、窒化タングステン又は窒化チタンを含む、請求項1記載の方法。
- 前記イオンビームを向ける前記ステップ中に、反応種の流束を前記基板へ供給するステップを更に有する、請求項1記載の方法。
- 前記基板エッチングを実施する前記ステップは、反応性エッチャントを前記基板へ向けるステップを有し、前記第1のエッチング速度は前記第2のエッチング速度より少なくとも5倍大きい、請求項1記載の方法。
- 前記イオンビームを向ける前記ステップは、金属種の第1の流束を前記基板へ供給するステップを有し、
前記方法は、更に、前記イオンビームを向ける前記ステップ中に、反応種の第2の流束を前記基板へ供給するステップを有し、
前記キャップ材料は、前記金属種から形成される酸化物、又は、前記金属種から形成される窒化物を含む、請求項1記載の方法。 - 前記イオンビームを向ける前記ステップは、
前記基板が第1の位置にあるときに、前記金属種の第1のドーズを含む第1の照射で、前記イオンビームを前記基板へ向けるステップと、
前記第1の位置から第2の位置へ前記垂線の周りを前記基板を回転させるステップと、
前記基板が前記第2の位置にあるときに、前記金属種の第2のドーズを含む第2の照射で、前記イオンビームを前記基板へ向けるステップと、を有する、請求項1記載の方法。 - 前記イオンビームを向ける前記ステップの前に、成形イオンビームを前記最初のマスク造作へ向けるステップを更に有し、
前記キャップ材料が形成される前に、前記最初のマスク造作の頂部部分が変えられる、請求項1記載の方法。 - 前記イオンビームは、100eVから2000eVのイオンエネルギーを有するイオンを含む、請求項1記載の方法。
- 前記キャップ材料は、5nmから50nmの厚さを有するキャップ層を備える、請求項1記載の方法。
- 前記マスクは前記最初のマスク造作及び少なくとも1つの追加のマスク造作を含む複数のマスク造作を備え、
前記複数のマスク造作は、造作の高さHを備え、造作の間隔Sを画定し、tan(θ)<H/Sである、請求項1記載の方法。 - 基板をパターニングする方法であって、該方法は、
犠牲マスクを基板の上に形成するステップであって、該犠牲マスクは複数の最初のマスク造作を備え、該複数の最初のマスク造作の1つの最初のマスク造作は第1の材料を含み、前記基板は基板平面を画定するステップと、
イオンをイオンビームとして、前記基板平面に対する垂線に対して、非ゼロの入射角(θ)で、前記犠牲マスクへ向けるステップであって、複合犠牲マスクが形成され、該複合犠牲マスクは複数のマスク造作を含み、前記複数の最初のマスク造作の1つのマスク造作は、前記第1の材料を含む下部と、該下部の上に配置されるキャップ材料とを備え、該キャップ材料は前記イオンを含むステップと、
基板エッチングを実施するステップであって、複数のエッチングの造作が前記基板に形成され、前記犠牲マスクの少なくとも1部が、前記基板エッチングの後に、残るステップと、を有し、
前記基板エッチングは、前記第1の材料を第1のエッチング速度でエッチングし、前記キャップ材料を第2のエッチング速度でエッチングし、前記第1のエッチング速度は前記第2のエッチング速度より大きい、方法。 - 前記複数のマスク造作は、造作の高さHを備え、造作の間隔Sを画定し、tan(θ)<H/Sである、請求項11記載の方法。
- 前記イオンビームを向ける前記ステップは、金属種の第1の流束を前記基板へ供給するステップを有し、
前記方法は、更に、前記イオンビームを向ける前記ステップ中に、反応種の第2の流束を前記基板へ供給するステップを有し、
前記キャップ材料は金属酸化物又は金属窒化物を含み、該金属酸化物及び金属窒化物は前記金属種から形成される、請求項11記載の方法。 - マスクを形成する方法であって、該方法は、
第1の材料を含み、基板平面に沿って配置される、ブランケット層を形成するステップと、
複数の最初のマスク造作を形成するために、前記ブランケット層をパターンニングするステップであって、前記複数の最初のマスク造作は前記第1の材料を含むステップと、
イオンをイオンビームとして、前記基板平面に対する垂線に対して、非ゼロの入射角(θ)で、前記複数の最初のマスク造作へ向けるステップであって、前記イオンビームを向ける前記ステップの後に、前記複数の最初のマスク造作は、前記第1の材料を含む下部と、該下部の上に配置されるキャップ材料とを備え、該キャップ材料は前記イオンを含むステップと、を有する、方法。 - 前記複数のマスク造作は、造作の高さHを備え、造作の間隔Sを画定し、tan(θ)<H/Sである、請求項14記載の方法。
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