JP2019523559A5 - - Google Patents
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- JP2019523559A5 JP2019523559A5 JP2019504710A JP2019504710A JP2019523559A5 JP 2019523559 A5 JP2019523559 A5 JP 2019523559A5 JP 2019504710 A JP2019504710 A JP 2019504710A JP 2019504710 A JP2019504710 A JP 2019504710A JP 2019523559 A5 JP2019523559 A5 JP 2019523559A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- film
- groove
- pattern
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 34
- 239000000758 substrate Substances 0.000 claims 23
- 238000000034 method Methods 0.000 claims 18
- 239000004020 conductor Substances 0.000 claims 13
- 239000000853 adhesive Substances 0.000 claims 10
- 230000001070 adhesive effect Effects 0.000 claims 10
- 239000002245 particle Substances 0.000 claims 6
- 239000004033 plastic Substances 0.000 claims 5
- 229920003023 plastic Polymers 0.000 claims 5
- 229920000642 polymer Polymers 0.000 claims 5
- 239000012528 membrane Substances 0.000 claims 4
- 238000000059 patterning Methods 0.000 claims 4
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims 2
- 239000004713 Cyclic olefin copolymer Substances 0.000 claims 2
- 239000004698 Polyethylene Substances 0.000 claims 2
- 239000004743 Polypropylene Substances 0.000 claims 2
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- -1 polyethylene Polymers 0.000 claims 2
- 229920000573 polyethylene Polymers 0.000 claims 2
- 229920001155 polypropylene Polymers 0.000 claims 2
- 238000003825 pressing Methods 0.000 claims 2
- 229920001169 thermoplastic Polymers 0.000 claims 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 2
- 238000009736 wetting Methods 0.000 claims 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 238000002167 anodic stripping potentiometry Methods 0.000 claims 1
- 206010003664 atrial septal defect Diseases 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 230000000295 complement effect Effects 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 claims 1
- 230000005294 ferromagnetic effect Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 125000002524 organometallic group Chemical group 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023039543A JP2023082014A (ja) | 2016-07-28 | 2023-03-14 | 電気絶縁基板への電気伝導体の適用方法 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1613051.0A GB201613051D0 (en) | 2016-07-28 | 2016-07-28 | Applying an electrical conductor to a substrate |
| GB1613051.0 | 2016-07-28 | ||
| GB1709427.7 | 2017-06-14 | ||
| GBGB1709427.7A GB201709427D0 (en) | 2016-07-28 | 2017-06-14 | Applying electrical conductors to a substrate |
| PCT/IB2017/054629 WO2018020481A1 (en) | 2016-07-28 | 2017-07-28 | Application of electrical conductors to an electrically insulating substrate |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023039543A Division JP2023082014A (ja) | 2016-07-28 | 2023-03-14 | 電気絶縁基板への電気伝導体の適用方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019523559A JP2019523559A (ja) | 2019-08-22 |
| JP2019523559A5 true JP2019523559A5 (https=) | 2020-09-03 |
Family
ID=56936708
Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019504710A Pending JP2019523559A (ja) | 2016-07-28 | 2017-07-28 | 電気絶縁基板への電気伝導体の適用方法 |
| JP2019504691A Active JP7311895B2 (ja) | 2016-07-28 | 2017-07-28 | 基板への導体パターン適用装置 |
| JP2019504700A Active JP7013035B2 (ja) | 2016-07-28 | 2017-07-28 | 太陽電池の電気伝導体の適用方法 |
| JP2022002861A Active JP7253852B2 (ja) | 2016-07-28 | 2022-01-12 | 太陽電池の電気伝導体の適用方法 |
| JP2022111553A Active JP7517725B2 (ja) | 2016-07-28 | 2022-07-12 | 基板への導体パターン適用装置 |
| JP2023039543A Pending JP2023082014A (ja) | 2016-07-28 | 2023-03-14 | 電気絶縁基板への電気伝導体の適用方法 |
Family Applications After (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019504691A Active JP7311895B2 (ja) | 2016-07-28 | 2017-07-28 | 基板への導体パターン適用装置 |
| JP2019504700A Active JP7013035B2 (ja) | 2016-07-28 | 2017-07-28 | 太陽電池の電気伝導体の適用方法 |
| JP2022002861A Active JP7253852B2 (ja) | 2016-07-28 | 2022-01-12 | 太陽電池の電気伝導体の適用方法 |
| JP2022111553A Active JP7517725B2 (ja) | 2016-07-28 | 2022-07-12 | 基板への導体パターン適用装置 |
| JP2023039543A Pending JP2023082014A (ja) | 2016-07-28 | 2023-03-14 | 電気絶縁基板への電気伝導体の適用方法 |
Country Status (13)
| Country | Link |
|---|---|
| US (7) | US10645815B2 (https=) |
| EP (4) | EP3491902B1 (https=) |
| JP (6) | JP2019523559A (https=) |
| KR (5) | KR102369972B1 (https=) |
| CN (4) | CN115458614A (https=) |
| CA (3) | CA3032024C (https=) |
| ES (1) | ES2868802T3 (https=) |
| GB (2) | GB201613051D0 (https=) |
| IL (2) | IL290336B (https=) |
| MX (2) | MX2023001879A (https=) |
| PL (1) | PL3491900T3 (https=) |
| RU (1) | RU2758792C2 (https=) |
| WO (3) | WO2018020479A1 (https=) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11751336B2 (en) * | 2016-07-28 | 2023-09-05 | Lumet Technologies, LTD. | Method for applying a pattern to a substrate |
| GB201613051D0 (en) * | 2016-07-28 | 2016-09-14 | Landa Labs (2012) Ltd | Applying an electrical conductor to a substrate |
| RU2697508C1 (ru) * | 2018-06-19 | 2019-08-15 | Федеральное Государственное Унитарное Предприятие "Всероссийский Научно-Исследовательский Институт Автоматики Им.Н.Л.Духова" (Фгуп "Внииа") | Способ изготовления печатных плат и устройство для изготовления проводящей схемы |
| WO2020023053A1 (en) * | 2018-07-27 | 2020-01-30 | Hewlett-Packard Development Company, L.P. | Cleaning electrophotographic printing drums |
| DE102018123261A1 (de) * | 2018-09-21 | 2020-03-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Aufbringen von Leitermaterial auf Substraten |
| GB2591723B (en) * | 2019-10-22 | 2022-09-14 | Lumet Tech Ltd | Method and apparatus for introducing a substrate into a nip |
| GB2592557B (en) | 2019-10-22 | 2024-07-10 | Lumet Tech Ltd | Transferable composition and methods for preparing and using the same |
| IL272290A (en) * | 2020-01-27 | 2021-07-29 | Creative Ic3D Ltd | Semiconductor process for the production of printed electronic conductors |
| CN112071921A (zh) * | 2020-09-01 | 2020-12-11 | 深圳纳弘熠岦光学科技有限公司 | 栅线制备方法 |
| KR102886680B1 (ko) * | 2021-03-29 | 2025-11-14 | 삼성디스플레이 주식회사 | 윈도우 부재의 제조 장치 및 윈도우 부재의 제조 방법 |
| GB2605622B (en) * | 2021-04-07 | 2023-12-20 | Landa Labs 2012 Ltd | System for introducing a substrate into a nip |
| CN115348718A (zh) * | 2021-05-14 | 2022-11-15 | 富致科技股份有限公司 | Ptc电路保护装置 |
| EP4120023A1 (en) | 2021-07-15 | 2023-01-18 | Wuhan Dr Laser Technology Corp., Ltd. | Pattern transfer sheet, method of monitoring pattern transfer printing, and pattern transfer printing system |
| IL295949B2 (en) | 2021-09-08 | 2025-11-01 | Wuhan Dr Laser Tech Corp Ltd | Dynamic pattern transfer printing and pattern transfer sheets with spaced groups of trenches |
| US11910537B2 (en) | 2021-11-09 | 2024-02-20 | Wuhan Dr Laser Technology Corp,. Ltd | Pattern transfer printing systems and methods |
| IL297544A (en) | 2021-10-22 | 2023-05-01 | Wuhan Dr Laser Tech Corp Ltd | Sheets and methods for transferring a pattern with a release layer and/or paste mixtures |
| US20240208242A1 (en) * | 2021-11-09 | 2024-06-27 | Wuhan Dr Laser Technology Corp,. Ltd | Pattern transfer printing systems and methods |
| EP4178326B1 (en) * | 2021-11-09 | 2026-03-25 | Wuhan Dr Laser Technology Corp., Ltd. | Pattern transfer printing system and method |
| US12349497B2 (en) | 2021-12-27 | 2025-07-01 | Wuhan Dr Laser Technology Corp,. Ltd | Pattern transfer printing of multi-layered features |
| CN114709278B (zh) * | 2022-06-06 | 2022-08-23 | 一道新能源科技(衢州)有限公司 | 一种激光熔融制备晶硅太阳能电池电极的方法 |
| CN116193760A (zh) * | 2022-12-29 | 2023-05-30 | 深圳市百柔新材料技术有限公司 | 实现pcb金属基板过孔互联的工艺方法及其应用 |
| CN116014003A (zh) * | 2023-01-20 | 2023-04-25 | 上海海优威新材料股份有限公司 | 一种光伏电池模块 |
| CN116314378A (zh) * | 2023-01-20 | 2023-06-23 | 上海海优威新材料股份有限公司 | 一种光伏电极 |
| EP4415019A1 (en) * | 2023-02-09 | 2024-08-14 | Littelfuse, Inc. | Hybrid conductive paste for fast-opening, low-rating fuses |
| CN116705871A (zh) * | 2023-07-03 | 2023-09-05 | 上海海优威新材料股份有限公司 | 一种光伏电池组 |
| GB2632019B (en) | 2023-07-21 | 2025-09-17 | Lumet Tech Ltd | Transfer of a pattern to a substrate |
| CN117637872A (zh) * | 2023-11-23 | 2024-03-01 | 天合光能股份有限公司 | 转印组件、太阳能电池及其制备方法 |
| KR102909691B1 (ko) * | 2024-02-16 | 2026-01-08 | 한국화학연구원 | 롤프레싱부를 포함하는 유연태양전지용 연속제조 장치 |
| CN118683218B (zh) * | 2024-07-15 | 2026-01-30 | 清华大学 | 一种高效率图案化的限域印刷方法 |
| WO2026065750A1 (zh) * | 2024-09-29 | 2026-04-02 | 北京载诚科技有限公司 | 一种电极栅线的制备方法及光伏电池 |
| CN119840312A (zh) * | 2025-02-21 | 2025-04-18 | 深圳艾普阳激光科技有限公司 | 载板、激光印刷装置和激光印刷方法 |
Family Cites Families (108)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1196201A (en) * | 1967-09-19 | 1970-06-24 | Tokyo Shibaura Electric Co | A method of Printing Electrical Circuits onto Substrates |
| JPS5239014B2 (https=) * | 1971-12-24 | 1977-10-03 | ||
| US3984244A (en) | 1974-11-27 | 1976-10-05 | E. I. Du Pont De Nemours And Company | Process for laminating a channeled photosensitive layer on an irregular surface |
| US4476002A (en) | 1982-06-29 | 1984-10-09 | Union Carbide Corporation | Metal current carrier for electrochemical cell electrodes |
| JPS6143564A (ja) * | 1984-08-06 | 1986-03-03 | 松下電工株式会社 | 印刷用回路基板への乾式転写用フイルム貼り合せ方法 |
| JPS63239895A (ja) * | 1986-11-19 | 1988-10-05 | 株式会社日立製作所 | 印刷回路の製造装置 |
| US4909886A (en) * | 1987-12-02 | 1990-03-20 | Mitsubishi Gas Chemical Company, Inc. | Process for producing copper-clad laminate |
| US5176310A (en) | 1988-11-28 | 1993-01-05 | Hitachi, Ltd. | Method and apparatus for wire bond |
| US5037023A (en) | 1988-11-28 | 1991-08-06 | Hitachi, Ltd. | Method and apparatus for wire bonding |
| JP2870023B2 (ja) * | 1989-07-24 | 1999-03-10 | 凸版印刷株式会社 | 熱ロールを使用したパターン転写方法および装置 |
| JP3239898B2 (ja) * | 1990-03-02 | 2001-12-17 | 大日本印刷株式会社 | 厚膜パターン形成方法 |
| EP0452118B1 (en) * | 1990-04-12 | 1996-08-21 | Matsushita Electric Industrial Co., Ltd. | Conductive ink composition and method of forming a conductive thick film pattern |
| CA2073575A1 (en) | 1991-07-19 | 1993-01-20 | Paul C. Koehler | Pleated metal article |
| JP2634724B2 (ja) * | 1992-01-24 | 1997-07-30 | 日立テクノエンジニアリング株式会社 | 厚膜形成方法 |
| US5609704A (en) * | 1993-09-21 | 1997-03-11 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating an electronic part by intaglio printing |
| JP3039285B2 (ja) * | 1993-09-21 | 2000-05-08 | 松下電器産業株式会社 | 電子部品およびその製造方法 |
| JPH08160216A (ja) * | 1994-12-02 | 1996-06-21 | Dainippon Printing Co Ltd | 転写方法及びそれに使用する転写装置 |
| TW353762B (en) * | 1996-10-21 | 1999-03-01 | Dainippon Printing Co Ltd | Transfer sheet, and pattern-forming method |
| JP3376552B2 (ja) * | 1996-11-05 | 2003-02-10 | 株式会社トクヤマ | 基板のセンタリング装置 |
| US6207268B1 (en) * | 1996-11-12 | 2001-03-27 | Dai Nippon Printing Co., Ltd. | Transfer sheet, and pattern-forming method |
| JP3173439B2 (ja) * | 1997-10-14 | 2001-06-04 | 松下電器産業株式会社 | セラミック多層基板及びその製造方法 |
| JPH11312860A (ja) | 1998-04-27 | 1999-11-09 | Jsr Corp | 電極の製造方法および転写フィルム |
| WO2000035260A1 (en) * | 1998-12-07 | 2000-06-15 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing ceramic substrate |
| JP3132493B2 (ja) * | 1998-12-11 | 2001-02-05 | 松下電器産業株式会社 | 配線基板の製造方法およびそれに用いられる導体ペースト |
| JP3951508B2 (ja) * | 1999-06-11 | 2007-08-01 | 松下電器産業株式会社 | 電子部品の製造方法 |
| JP3831179B2 (ja) * | 1999-06-29 | 2006-10-11 | 株式会社東芝 | 半導体装置の製造方法およびパターン形成方法 |
| EP1336999A4 (en) * | 2000-10-31 | 2006-08-16 | Matsushita Electric Industrial Co Ltd | HIGH POLYMER Electrolyte Fuel Cell |
| GB0106417D0 (en) * | 2001-03-15 | 2001-05-02 | Oxford Biosensors Ltd | Transfer screen-printing |
| JP2003031948A (ja) * | 2001-07-12 | 2003-01-31 | Matsushita Electric Ind Co Ltd | セラミック多層基板の製造方法 |
| US6591496B2 (en) * | 2001-08-28 | 2003-07-15 | 3M Innovative Properties Company | Method for making embedded electrical traces |
| US20030108664A1 (en) | 2001-10-05 | 2003-06-12 | Kodas Toivo T. | Methods and compositions for the formation of recessed electrical features on a substrate |
| JP2003223906A (ja) * | 2002-01-30 | 2003-08-08 | Aisin Seiki Co Ltd | 導電性部材の製造方法および燃料電池用セパレータの製造方法 |
| JP2004063943A (ja) * | 2002-07-31 | 2004-02-26 | Koa Corp | 導電パターン形成方法 |
| US6964722B2 (en) * | 2002-08-07 | 2005-11-15 | Trio Industries Holdings, L.L.C. | Method for producing a wood substrate having an image on at least one surface |
| US6805809B2 (en) * | 2002-08-28 | 2004-10-19 | Board Of Trustees Of University Of Illinois | Decal transfer microfabrication |
| US6703114B1 (en) * | 2002-10-17 | 2004-03-09 | Arlon | Laminate structures, methods for production thereof and uses therefor |
| JP4111116B2 (ja) * | 2002-12-05 | 2008-07-02 | 株式会社村田製作所 | 厚膜配線の形成方法及び積層型電子部品の製造方法 |
| AU2003258741A1 (en) | 2003-03-05 | 2004-09-28 | Outokumpu Oyj | Method and system for manufacturing an electrically conductive metal foil structure |
| JP4269745B2 (ja) * | 2003-03-31 | 2009-05-27 | 株式会社日立製作所 | スタンパ及び転写装置 |
| JP4482873B2 (ja) * | 2003-06-06 | 2010-06-16 | 昭栄化学工業株式会社 | 導電性ペースト、回路基板、太陽電池、及びチップ型セラミック電子部品 |
| JP2005011877A (ja) * | 2003-06-17 | 2005-01-13 | Matsushita Electric Ind Co Ltd | 回路パターン形成方法 |
| JP2005234206A (ja) * | 2004-02-19 | 2005-09-02 | Fuji Xerox Co Ltd | 記録材の冷却装置 |
| US7205483B2 (en) | 2004-03-19 | 2007-04-17 | Matsushita Electric Industrial Co., Ltd. | Flexible substrate having interlaminar junctions, and process for producing the same |
| JP2005276983A (ja) * | 2004-03-24 | 2005-10-06 | Matsushita Electric Ind Co Ltd | 電子部品およびその製造方法と印刷方法 |
| JP2005328025A (ja) | 2004-04-13 | 2005-11-24 | Matsushita Electric Ind Co Ltd | 面実装電子部品の製造方法とこの製造方法で製造した面実装電子部品とこれを用いた電子機器 |
| JP3960320B2 (ja) * | 2004-04-19 | 2007-08-15 | 松下電器産業株式会社 | 配線基板とそれを用いたバランと配線基板の製造方法 |
| US7414313B2 (en) | 2004-12-22 | 2008-08-19 | Eastman Kodak Company | Polymeric conductor donor and transfer method |
| US20060200980A1 (en) * | 2005-03-09 | 2006-09-14 | Gagne Norman P | System for producing flexible circuits |
| JP4617978B2 (ja) * | 2005-04-15 | 2011-01-26 | パナソニック株式会社 | 配線基板の製造方法 |
| US20060260944A1 (en) | 2005-05-19 | 2006-11-23 | The Regents Of The University Of California | Method and apparatus for dielectrophoretic separation |
| KR100715199B1 (ko) * | 2005-09-28 | 2007-05-07 | 조현철 | 인쇄회로기판 자동 검사장비 |
| WO2007094476A1 (en) | 2006-02-14 | 2007-08-23 | Showa Denko K.K. | Light-emitting diode |
| JP4987847B2 (ja) | 2006-02-27 | 2012-07-25 | 京セラ株式会社 | セラミック部材の製造方法 |
| CA2646987C (en) | 2006-03-09 | 2014-09-30 | The Regents Of The University Of California | Method and apparatus for target detection using electrode-bound viruses |
| US7744714B2 (en) * | 2006-11-20 | 2010-06-29 | E.I. Du Pont De Nemours And Company | Paste patterns formation method and transfer film used therein |
| US20080229941A1 (en) * | 2007-03-19 | 2008-09-25 | Babak Heidari | Nano-imprinting apparatus and method |
| DE102007027999A1 (de) | 2007-06-14 | 2008-12-18 | Leonhard Kurz Gmbh & Co. Kg | Heißprägen von Strukturen |
| US20090025595A1 (en) * | 2007-07-25 | 2009-01-29 | Nano Terra Inc. | Contact Printing Method Using an Elastomeric Stamp Having a Variable Surface Area and Variable Shape |
| TW200920687A (en) * | 2007-11-02 | 2009-05-16 | Delta Electronics Inc | Method for treating surface of element |
| US8286342B2 (en) | 2007-11-26 | 2012-10-16 | S.D. Warren Company | Methods for manufacturing electronic devices |
| JP2009172965A (ja) | 2008-01-28 | 2009-08-06 | Fujifilm Corp | 感光性ウエブの剥離装置及び剥離方法 |
| US8470701B2 (en) * | 2008-04-03 | 2013-06-25 | Advanced Diamond Technologies, Inc. | Printable, flexible and stretchable diamond for thermal management |
| CN102037794B (zh) * | 2008-05-20 | 2013-02-13 | 3M创新有限公司 | 在不定长幅材上连续烧结的方法 |
| US8383929B2 (en) | 2008-07-18 | 2013-02-26 | Solyndra Llc | Elongated photovoltaic devices, methods of making same, and systems for making same |
| JP2010062170A (ja) | 2008-09-01 | 2010-03-18 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
| CN102144432B (zh) | 2008-09-05 | 2015-09-30 | 住友电木株式会社 | 导电连接材料、使用该导电连接材料的端子之间的连接方法以及连接端子的制造方法 |
| JP5646492B2 (ja) * | 2008-10-07 | 2014-12-24 | エムシー10 インコーポレイテッドMc10,Inc. | 伸縮可能な集積回路およびセンサアレイを有する装置 |
| JP2010129604A (ja) | 2008-11-25 | 2010-06-10 | Fujikura Ltd | 回路配線基板及びその製造方法 |
| EP2421341B1 (en) * | 2008-12-22 | 2013-09-11 | Fujitsu Limited | Electronic component and method of manufacturing the same |
| JP2010161298A (ja) | 2009-01-09 | 2010-07-22 | Denso Corp | 導電ペーストの充填方法及び多層基板の製造方法 |
| JP5319326B2 (ja) * | 2009-02-25 | 2013-10-16 | 株式会社東芝 | 凹凸パターンの形成方法および凹凸パターン形成用シート |
| JP2010239101A (ja) * | 2009-03-30 | 2010-10-21 | Hidejiro Ono | パターン形成法及び印刷機 |
| JP2010267357A (ja) * | 2009-05-18 | 2010-11-25 | Hitachi High-Technologies Corp | パターンドメディアの製造方法及び製造装置 |
| WO2010137854A2 (ko) * | 2009-05-26 | 2010-12-02 | 주식회사 엘지화학 | 고효율 태양전지 전면 전극의 제조 방법 |
| JP4730484B2 (ja) | 2009-09-30 | 2011-07-20 | 住友ベークライト株式会社 | 導電接続材料、端子間の接続方法及び接続端子の製造方法 |
| SG181575A1 (en) | 2009-12-24 | 2012-07-30 | Sumitomo Bakelite Co | Conductive connection material, method for producing electronic component, electronic member with conductive connective material and electronic component |
| US20110209749A1 (en) * | 2010-01-07 | 2011-09-01 | Korea Advanced Institute Of Science And Technology | Pattern transfer method and apparatus, flexible display panel, flexible solar cell, electronic book, thin film transistor, electromagnetic-shielding sheet, and flexible printed circuit board applying thereof |
| US8480942B2 (en) * | 2010-01-27 | 2013-07-09 | The Board Of Trustees Of The University Of Illinois | Method of forming a patterned layer of a material on a substrate |
| WO2011093162A1 (ja) | 2010-01-29 | 2011-08-04 | 住友ベークライト株式会社 | 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器 |
| EP3223300A1 (en) | 2010-03-12 | 2017-09-27 | Sumitomo Electric Industries, Ltd. | Silicon carbide semiconductor device and method for manufacturing the same |
| KR101022015B1 (ko) | 2010-04-09 | 2011-03-16 | 한국기계연구원 | 열형 롤 임프린팅과 블레이드 코팅을 이용하는 필름제품 제조방법, 이를 이용한 보안 필름 및 필름 일체형 전기 소자 |
| DE102010015659A1 (de) | 2010-04-20 | 2011-10-20 | Giesecke & Devrient Gmbh | Transferverfahren zur Herstellung von Leiterstrukturen mittels Nanotinten |
| US8664533B2 (en) | 2010-07-05 | 2014-03-04 | Dic Corporation | Substrate having transparent conductive layer, method for producing same, transparent conductive film laminate for touch panel, and touch panel |
| JP2012142539A (ja) | 2010-12-14 | 2012-07-26 | Mitsubishi Materials Corp | 薄膜太陽電池向け裏面電極テープ、及びこれを用いる薄膜太陽電池の製造方法 |
| WO2012097163A1 (en) * | 2011-01-14 | 2012-07-19 | The Board Of Trustees Of The University Of Illinois | Optical component array having adjustable curvature |
| JP5717595B2 (ja) * | 2011-03-29 | 2015-05-13 | 株式会社ミマキエンジニアリング | 曲面印刷方法及び印刷システム |
| JP2012213864A (ja) * | 2011-03-31 | 2012-11-08 | Toppan Printing Co Ltd | 印刷用版および印刷用版の製造方法 |
| KR101358254B1 (ko) * | 2012-02-06 | 2014-02-06 | 하나마이크로(주) | 기판 상에 기능성 조성물의 패턴을 형성하는 방법 및 그 방법에 의하여 형성된 기능성 패턴을 구비한 전자 장치 |
| WO2013118217A1 (ja) * | 2012-02-10 | 2013-08-15 | 日本電気株式会社 | シート積層モジュールの製造方法 |
| JP2014004819A (ja) | 2012-05-28 | 2014-01-16 | Hitachi High-Technologies Corp | パターン形成方法及びその形成装置 |
| CN102806660B (zh) * | 2012-08-16 | 2014-10-15 | 上海交通大学 | 基于卷对卷热辊压聚合物薄膜表面微结构加工装置及方法 |
| JP5189705B1 (ja) | 2012-09-25 | 2013-04-24 | 田中貴金属工業株式会社 | センサー電極及びその製造方法、並びに、電極形成用の金属ペースト |
| BR112015009655B1 (pt) | 2012-10-31 | 2020-12-29 | Hewlett-Packard Indigo B.V. | método e aparelho para formar em um substrato um padrão de um material |
| KR101604886B1 (ko) * | 2012-12-06 | 2016-03-25 | (주)엘지하우시스 | 미세공명구조를 갖는 흡음시트, 그 제조 방법 및 이를 이용한 흡음형 방음패널 |
| WO2014102904A1 (ja) * | 2012-12-25 | 2014-07-03 | 三菱電機株式会社 | 印刷方法、印刷装置及びこれを用いた太陽電池の製造方法 |
| US8936461B2 (en) * | 2013-03-14 | 2015-01-20 | Dominic Palazzolo | Transfer device and method of using |
| JP5963205B2 (ja) * | 2013-06-28 | 2016-08-03 | 株式会社都ローラー工業 | 炭素系材料膜の成膜方法 |
| KR101436123B1 (ko) | 2013-07-09 | 2014-11-03 | 피에스아이 주식회사 | 초소형 led를 포함하는 디스플레이 및 이의 제조방법 |
| KR102138519B1 (ko) * | 2013-11-08 | 2020-07-28 | 엘지전자 주식회사 | 가전기기용 외장 패널과 그 제조장치 |
| RU2593463C2 (ru) * | 2013-12-23 | 2016-08-10 | Станислав Викторович Хартов | Способ получения проводящих сетчатых микро- и наноструктур и структура для его реализации |
| WO2015128857A1 (en) | 2014-02-28 | 2015-09-03 | Utilight Ltd. | Tracks patterns production apparatus |
| JP6063411B2 (ja) * | 2014-03-28 | 2017-01-18 | 富士フイルム株式会社 | 導電性フィルム、導電性フィルムの製造方法及びタッチパネル |
| JP6200582B2 (ja) | 2014-04-08 | 2017-09-20 | 株式会社フジクラ | 配線体及び配線基板 |
| JP2016058664A (ja) | 2014-09-11 | 2016-04-21 | コネクテックジャパン株式会社 | 導電部を有する基板 |
| US9437754B2 (en) * | 2014-11-10 | 2016-09-06 | E I Du Pont De Nemours And Company | Method of manufacturing electrical device |
| JP6046867B2 (ja) | 2014-12-26 | 2016-12-21 | 株式会社フジクラ | 配線体、配線基板、タッチセンサ、及び配線体の製造方法 |
| CN107735061B (zh) * | 2015-06-08 | 2021-04-30 | 株式会社瑞光 | 一种复合片材及其生产制造复合片材的装置和方法 |
| GB201613051D0 (en) | 2016-07-28 | 2016-09-14 | Landa Labs (2012) Ltd | Applying an electrical conductor to a substrate |
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