JP2017516295A5 - - Google Patents

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JP2017516295A5
JP2017516295A5 JP2016558572A JP2016558572A JP2017516295A5 JP 2017516295 A5 JP2017516295 A5 JP 2017516295A5 JP 2016558572 A JP2016558572 A JP 2016558572A JP 2016558572 A JP2016558572 A JP 2016558572A JP 2017516295 A5 JP2017516295 A5 JP 2017516295A5
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layer
dispensing
pattern element
pattern
sintering
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JP2016558572A
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JP2017516295A (ja
JP6573903B2 (ja
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Priority claimed from PCT/IL2015/050316 external-priority patent/WO2015145439A1/en
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JP2016558572A 2014-03-25 2015-03-25 層交差パターンを製作する方法及びシステム Active JP6573903B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461969900P 2014-03-25 2014-03-25
US61/969,900 2014-03-25
PCT/IL2015/050316 WO2015145439A1 (en) 2014-03-25 2015-03-25 Method and system for fabricating cross-layer pattern

Related Child Applications (1)

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JP2019148754A Division JP2019196019A (ja) 2014-03-25 2019-08-14 層交差パターンを製作する方法及びシステム

Publications (3)

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JP2017516295A JP2017516295A (ja) 2017-06-15
JP2017516295A5 true JP2017516295A5 (https=) 2018-02-22
JP6573903B2 JP6573903B2 (ja) 2019-09-11

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JP2016558572A Active JP6573903B2 (ja) 2014-03-25 2015-03-25 層交差パターンを製作する方法及びシステム
JP2019148754A Pending JP2019196019A (ja) 2014-03-25 2019-08-14 層交差パターンを製作する方法及びシステム

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JP2019148754A Pending JP2019196019A (ja) 2014-03-25 2019-08-14 層交差パターンを製作する方法及びシステム

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US (2) US11090858B2 (https=)
EP (1) EP3123843B1 (https=)
JP (2) JP6573903B2 (https=)
KR (1) KR20160138156A (https=)
CN (1) CN106538074B (https=)
IL (1) IL248023B (https=)
WO (1) WO2015145439A1 (https=)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106538074B (zh) 2014-03-25 2020-03-06 斯特拉塔西斯公司 用在制造跨层图案的方法及系统
CN107614265A (zh) * 2015-03-25 2018-01-19 斯特拉塔西斯公司 导电油墨原位烧结的方法和系统
JPWO2016189577A1 (ja) * 2015-05-22 2018-03-15 富士機械製造株式会社 配線形成方法
US10394202B2 (en) * 2015-08-21 2019-08-27 Voxel8, Inc. 3D printer calibration and control
JP2017142316A (ja) * 2016-02-09 2017-08-17 三菱電機株式会社 液晶パネルの製造方法
US11613070B2 (en) * 2016-02-23 2023-03-28 Xerox Corporation System and method for building three-dimensional printed objects with materials having different properties
CN106273485B (zh) * 2016-08-17 2018-06-12 苏州秉创科技有限公司 一种基于嵌入式的面曝光3d打印机多屏异显方法
CN110505953B (zh) * 2017-03-07 2022-07-08 维纳米技术公司 使用喷墨打印制造复合组件
WO2019005022A1 (en) * 2017-06-28 2019-01-03 3M Innovative Properties Company ADDITIVE MANUFACTURING METHODS FOR ADHESIVES AND ADHESIVE ARTICLES
US11229953B2 (en) * 2017-11-29 2022-01-25 Lincoln Global, Inc. Methods and systems for additive manufacturing
WO2019130312A2 (en) 2017-12-28 2019-07-04 Stratasys Ltd. Additive manufacturing employing solvent-free polyimide-containing formulations
EP3732023B1 (en) * 2017-12-28 2024-06-26 Stratasys Ltd. Additive manufacturing employing polyimide-containing formulations
ES2970494T3 (es) * 2017-12-28 2024-05-29 Stratasys Ltd Procedimiento y sistema para fabricación aditiva de estructura sacrificial desprendible
JP7053832B2 (ja) * 2018-07-13 2022-04-12 株式会社Fuji 回路形成方法、および回路形成装置
US11203156B2 (en) 2018-08-20 2021-12-21 NEXA3D Inc. Methods and systems for photo-curing photo-sensitive material for printing and other applications
JP7159777B2 (ja) * 2018-10-15 2022-10-25 セイコーエプソン株式会社 三次元造形物の製造方法
US11570900B2 (en) * 2018-11-05 2023-01-31 Fuji Corporation Circuit forming method
KR20210090197A (ko) 2018-11-09 2021-07-19 넥사3디 인코포레이티드 3차원 프린팅 시스템
FR3089054A1 (fr) * 2018-11-28 2020-05-29 Commissariat A L'energie Atomique Et Aux Energies Alternatives Fabrication additive de circuits imprimes en 3d
EP3705035A1 (en) * 2019-03-07 2020-09-09 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Manufacturing of skin-compatible electrodes
IL286370B2 (en) 2019-03-18 2025-02-01 Nexa3D Inc Method and system for additive manufacturing
US12208566B2 (en) * 2019-03-31 2025-01-28 Stratasys Ltd. Method and system for leveling a layer in freeform fabrication
US10967573B2 (en) 2019-04-02 2021-04-06 NEXA3D Inc. Tank assembly and components thereof for a 3D printing system
US20200388508A1 (en) * 2019-06-04 2020-12-10 Texas Instruments Incorporated Repassivation application for wafer-level chip-scale package
US12594716B2 (en) 2019-06-14 2026-04-07 Fuji Corporation Shaping method and shaping device
WO2021013750A1 (en) * 2019-07-19 2021-01-28 Vito Nv A method and system for manufacturing three-dimensional porous structure
WO2021161376A1 (ja) * 2020-02-10 2021-08-19 株式会社Fuji 回路形成装置、および回路形成方法
WO2021176499A1 (ja) * 2020-03-02 2021-09-10 株式会社Fuji 配線形成方法
EP3925786B1 (en) * 2020-06-18 2024-01-10 Heraeus Electronics GmbH & Co. KG Additive printing method for printing a functional print pattern on a surface of a three-dimensional object, associated computer program and computer-readable medium
WO2022107307A1 (ja) * 2020-11-20 2022-05-27 株式会社Fuji 3次元造形物の製造方法、及び製造装置
KR102481641B1 (ko) * 2021-01-20 2022-12-27 한양대학교 산학협력단 복합체 제조방법 및 이에 의해 제조된 복합체
CN113593774B (zh) * 2021-07-30 2023-03-31 长春捷翼汽车零部件有限公司 一种制造线束的方法及线束
WO2023058111A1 (ja) * 2021-10-05 2023-04-13 株式会社Fuji 吐出装置、および検出方法
US20240422916A1 (en) * 2021-11-04 2024-12-19 Fuji Corporation Circuit-forming method and circuit-forming apparatus

Family Cites Families (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1050726A (en) 1973-04-14 1979-03-20 Ciba-Geigy Ag Method of making a foundry mould or core with an anaerobically cured adhesive
US4196033A (en) 1977-03-08 1980-04-01 Dai Nippon Insatsu Kabushiki Kaisha Process for producing decorative sheets
US4542165A (en) 1983-09-08 1985-09-17 Sanyo Chemical Industries, Ltd. Polyurethane based on epoxy-containing polymer polyol and process for making the same
JPH0625204B2 (ja) 1985-08-28 1994-04-06 住友化学工業株式会社 ビニル系単量体の重合成形方法
JP2773366B2 (ja) 1990-03-19 1998-07-09 富士通株式会社 多層配線基板の形成方法
US6175422B1 (en) * 1991-01-31 2001-01-16 Texas Instruments Incorporated Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data
JPH04296542A (ja) 1991-03-27 1992-10-20 Hitachi Chem Co Ltd 積層板の製造方法
DE4420012A1 (de) 1994-06-08 1995-12-14 Basf Ag Verfahren zur Herstellung von strahlungshärtbaren Acrylaten
US5614602A (en) 1996-07-09 1997-03-25 Betzdearborn Inc. Process for the preparation of aqueous dispersion polymers
US6541709B1 (en) 1996-11-01 2003-04-01 International Business Machines Corporation Inherently robust repair process for thin film circuitry using uv laser
WO2000018191A1 (en) 1998-09-18 2000-03-30 Marc Seghatol Microwave polymerization system for dentistry
US6259962B1 (en) 1999-03-01 2001-07-10 Objet Geometries Ltd. Apparatus and method for three dimensional model printing
US6096469A (en) 1999-05-18 2000-08-01 3M Innovative Properties Company Ink receptor media suitable for inkjet printing
US6658314B1 (en) 1999-10-06 2003-12-02 Objet Geometries Ltd. System and method for three dimensional model printing
JP2001144217A (ja) 1999-11-17 2001-05-25 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
US6850334B1 (en) 2000-01-18 2005-02-01 Objet Geometries Ltd System and method for three dimensional model printing
US20050104241A1 (en) 2000-01-18 2005-05-19 Objet Geometried Ltd. Apparatus and method for three dimensional model printing
US7300619B2 (en) 2000-03-13 2007-11-27 Objet Geometries Ltd. Compositions and methods for use in three dimensional model printing
US20030207959A1 (en) 2000-03-13 2003-11-06 Eduardo Napadensky Compositions and methods for use in three dimensional model printing
US6569373B2 (en) 2000-03-13 2003-05-27 Object Geometries Ltd. Compositions and methods for use in three dimensional model printing
US6673143B2 (en) 2000-03-23 2004-01-06 Shin-Etsu Chemical Co., Ltd. Aqueous slurry of rare earth hydroxide particles
JP3805266B2 (ja) 2002-02-27 2006-08-02 Uht株式会社 セラミック積層体の製造装置
US6467897B1 (en) 2001-01-08 2002-10-22 3M Innovative Properties Company Energy curable inks and other compositions incorporating surface modified, nanometer-sized particles
EP1439824A2 (en) 2001-10-29 2004-07-28 Therics, Inc. Three-dimensional suspension printing of dosage forms
US20030151167A1 (en) 2002-01-03 2003-08-14 Kritchman Eliahu M. Device, system and method for accurate printing of three dimensional objects
US6881691B2 (en) 2002-05-07 2005-04-19 Uop Llc Use of zeolites in preparing low temperature ceramics
JP2004055965A (ja) 2002-07-23 2004-02-19 Seiko Epson Corp 配線基板及び半導体装置並びにこれらの製造方法、回路基板並びに電子機器
WO2004050323A1 (en) 2002-12-03 2004-06-17 Objet Geometries Ltd. Process of and apparatus for three-dimensional printing
WO2004096527A2 (en) 2003-05-01 2004-11-11 Objet Geometries Ltd. Rapid prototyping apparatus
GB0403510D0 (en) 2004-02-18 2004-03-24 Mantra Internat Ltd Bioadhesive compositions and their use in medical electrodes
DE102004033153B4 (de) 2004-06-11 2007-03-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Glühkerze und Verfahren zu ihrer Herstellung
JP2006024768A (ja) 2004-07-08 2006-01-26 Seiko Epson Corp 配線基板、配線基板の製造方法および電子機器
JP4207860B2 (ja) 2004-07-14 2009-01-14 セイコーエプソン株式会社 層形成方法、配線基板、電気光学装置、および電子機器
JP4096962B2 (ja) 2004-08-20 2008-06-04 セイコーエプソン株式会社 多層構造形成方法、配線基板および電子機器の製造方法
JP4059260B2 (ja) * 2004-09-27 2008-03-12 セイコーエプソン株式会社 多層構造形成方法、配線基板の製造方法、および電子機器の製造方法
JP4850487B2 (ja) 2005-11-07 2012-01-11 富士フイルム株式会社 プリント配線板用積層体、それを用いたプリント配線板、プリント配線基板の作製方法、電気部品、電子部品、および、電気機器
US20070165075A1 (en) 2006-01-19 2007-07-19 3M Innovative Properties Company Flexible circuits having ink-resistant covercoats
US20070241482A1 (en) 2006-04-06 2007-10-18 Z Corporation Production of three-dimensional objects by use of electromagnetic radiation
JP5633109B2 (ja) 2006-08-11 2014-12-03 東ソー株式会社 ポリウレタン樹脂製造用の触媒組成物及びポリウレタン樹脂の製造方法
US7576000B2 (en) 2006-12-22 2009-08-18 Palo Alto Research Center Incorporated Molded dielectric layer in print-patterned electronic circuits
WO2008086033A1 (en) 2007-01-10 2008-07-17 Z Corporation Three-dimensional printing material system with improved color, article performance, and ease of use
US7968626B2 (en) 2007-02-22 2011-06-28 Z Corporation Three dimensional printing material system and method using plasticizer-assisted sintering
WO2008102266A2 (en) 2007-02-23 2008-08-28 Infermata Systems Ltd. Method and apparatus for rapid fabrication of functional printed circuit board
JP2009021552A (ja) 2007-06-14 2009-01-29 Seiko Epson Corp コンタクトホール形成方法、導電ポスト形成方法、配線パターン形成方法、多層配線基板の製造方法、及び電子機器製造方法
JP5213375B2 (ja) 2007-07-13 2013-06-19 富士フイルム株式会社 顔料分散液、硬化性組成物、それを用いるカラーフィルタ及び固体撮像素子
WO2009013751A2 (en) 2007-07-25 2009-01-29 Objet Geometries Ltd. Solid freeform fabrication using a plurality of modeling materials
US8534787B2 (en) 2007-10-11 2013-09-17 Camtek Ltd. Method and system for printing on a printed circuit board
US20090107546A1 (en) 2007-10-29 2009-04-30 Palo Alto Research Center Incorporated Co-extruded compositions for high aspect ratio structures
JP4483929B2 (ja) * 2007-10-30 2010-06-16 セイコーエプソン株式会社 導体パターン形成用インク、導体パターンおよび配線基板
US8693079B2 (en) 2008-01-31 2014-04-08 Ajjer, Llc Sealants and conductive busbars for chromogenic devices
US7988903B2 (en) 2008-07-02 2011-08-02 Zeon Chemicals L.P. Fast curing vulcanizable multi-part elastomer composition, and process for blending, injection molding and curing of elastomer composition
US20100000762A1 (en) 2008-07-02 2010-01-07 Applied Nanotech Holdings, Inc. Metallic pastes and inks
JP2012521493A (ja) * 2009-03-24 2012-09-13 イッサム リサーチ ディべロップメント カンパニー オブ ザ ヘブライ ユニバーシティー オブ エルサレム,リミテッド 低温におけるナノ粒子の焼結プロセス
JP5453924B2 (ja) * 2009-05-22 2014-03-26 コニカミノルタ株式会社 導電膜パターン及び導電膜パターンの形成方法
US7973195B2 (en) 2009-07-22 2011-07-05 Kemira Oyj Process for unsaturated quaternary ammonium salt
JP2011031591A (ja) 2009-08-06 2011-02-17 Mitsubishi Rayon Co Ltd ナノ物質含有成形体及びその製造方法
JP2011054620A (ja) * 2009-08-31 2011-03-17 Murata Mfg Co Ltd 多層配線基板の製造方法
US8906818B2 (en) 2009-10-13 2014-12-09 Recapping, Inc. High energy density ionic dielectric materials and devices
GB0921951D0 (en) 2009-12-16 2010-02-03 Fujifilm Mfg Europe Bv Curable compositions and membranes
EP2620479B1 (en) 2010-09-22 2016-06-22 Sekisui Chemical Co., Ltd. Curable composition for inkjet, and method for producing electronic component
JP5409575B2 (ja) 2010-09-29 2014-02-05 富士フイルム株式会社 金属膜材料の製造方法、及びそれを用いた金属膜材料
EP2699406B1 (en) 2011-04-17 2020-02-19 Stratasys Ltd. System and method for additive manufacturing of an object
WO2012168941A1 (en) 2011-06-09 2012-12-13 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd. Flexible transparent conductive coatings by direct room temperature evaporative lithography
KR101970373B1 (ko) 2011-08-03 2019-04-18 히타치가세이가부시끼가이샤 조성물 세트, 도전성 기판 및 그 제조 방법 및 도전성 접착재 조성물
TW201331959A (zh) 2011-10-05 2013-08-01 Applied Nanotech Holdings Inc 低熔點基質上之燒結型金屬墨
JP2013203570A (ja) 2012-03-27 2013-10-07 Seiko Epson Corp 透光性アルミナおよび透光性アルミナの製造方法
GB201206415D0 (en) 2012-04-12 2012-05-23 Fujifilm Mfg Europe Bv Curable compositions and membranes
KR101570398B1 (ko) 2012-04-26 2015-11-19 오사카 유니버시티 투명 도전성 잉크 및 투명 도전 패턴형성방법
JP5275498B1 (ja) 2012-07-03 2013-08-28 石原薬品株式会社 導電膜形成方法及び焼結進行剤
WO2014050688A1 (ja) 2012-09-27 2014-04-03 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
CN105027690A (zh) 2013-01-31 2015-11-04 耶路撒冷希伯来大学伊森姆研究发展有限公司 三维导电性图案和用于制造三维导电性图案的油墨
JP5700864B2 (ja) 2013-05-15 2015-04-15 石原ケミカル株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
CN105408095A (zh) 2013-06-24 2016-03-16 哈佛学院院长等 打印的三维(3d)功能部件及其制造方法
KR101863464B1 (ko) 2013-07-31 2018-05-31 바스프 에스이 역상 중합 방법
US20150104562A1 (en) * 2013-10-10 2015-04-16 Omega Optics, Inc. Method Of Manufacturing Multilayer Interconnects For Printed Electronic Systems
BR112016015944A8 (pt) 2014-01-10 2020-06-09 Johnson & Johnson Consumer Inc processo para produzir comprimido, que usa radiofrequência e partículas revestidas dissipadoras de energia
US9487443B2 (en) 2014-03-14 2016-11-08 Ricoh Company, Ltd. Layer stack formation powder material, powder layer stack formation hardening liquid, layer stack formation material set, and layer stack object formation method
CN106538074B (zh) 2014-03-25 2020-03-06 斯特拉塔西斯公司 用在制造跨层图案的方法及系统
WO2015200280A1 (en) 2014-06-23 2015-12-30 Applied Cavitation, Inc. Systems and methods for additive manufacturing using ceramic materials
CN107614265A (zh) 2015-03-25 2018-01-19 斯特拉塔西斯公司 导电油墨原位烧结的方法和系统
WO2017146741A1 (en) 2016-02-26 2017-08-31 Hewlett-Packard Development Company, L.P. Color printing and three-dimensional (3d) printing

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