JP2020501375A5 - - Google Patents

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Publication number
JP2020501375A5
JP2020501375A5 JP2019531090A JP2019531090A JP2020501375A5 JP 2020501375 A5 JP2020501375 A5 JP 2020501375A5 JP 2019531090 A JP2019531090 A JP 2019531090A JP 2019531090 A JP2019531090 A JP 2019531090A JP 2020501375 A5 JP2020501375 A5 JP 2020501375A5
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JP
Japan
Prior art keywords
material layer
conductive
conductive material
depositing
component
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Application number
JP2019531090A
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English (en)
Japanese (ja)
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JP2020501375A (ja
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Publication date
Priority claimed from US15/835,116 external-priority patent/US10398034B2/en
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Publication of JP2020501375A publication Critical patent/JP2020501375A/ja
Publication of JP2020501375A5 publication Critical patent/JP2020501375A5/ja
Priority to JP2023111882A priority Critical patent/JP2023139049A/ja
Pending legal-status Critical Current

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JP2019531090A 2016-12-12 2017-12-11 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム Pending JP2020501375A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023111882A JP2023139049A (ja) 2016-12-12 2023-07-07 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662432710P 2016-12-12 2016-12-12
US62/432,710 2016-12-12
US15/835,116 2017-12-07
US15/835,116 US10398034B2 (en) 2016-12-12 2017-12-07 Methods of etching conductive features, and related devices and systems
PCT/IL2017/051338 WO2018109762A1 (en) 2016-12-12 2017-12-11 Methods of etching conductive features, and related devices and systems

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023111882A Division JP2023139049A (ja) 2016-12-12 2023-07-07 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム

Publications (2)

Publication Number Publication Date
JP2020501375A JP2020501375A (ja) 2020-01-16
JP2020501375A5 true JP2020501375A5 (https=) 2021-01-28

Family

ID=62558108

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019531090A Pending JP2020501375A (ja) 2016-12-12 2017-12-11 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム
JP2023111882A Pending JP2023139049A (ja) 2016-12-12 2023-07-07 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023111882A Pending JP2023139049A (ja) 2016-12-12 2023-07-07 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム

Country Status (6)

Country Link
US (3) US10398034B2 (https=)
EP (1) EP3551781B1 (https=)
JP (2) JP2020501375A (https=)
KR (1) KR20190093576A (https=)
CN (1) CN110249075A (https=)
WO (1) WO2018109762A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016193978A2 (en) 2015-06-04 2016-12-08 Jet Cu Pcb Ltd. Methods for producing an etch resist pattern on a metallic surface
WO2017025949A1 (en) 2015-08-13 2017-02-16 Jet Cu Pcb Ltd. Methods for producing an etch resist pattern on a metallic surface
US10398034B2 (en) 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
WO2020165897A1 (en) 2019-02-14 2020-08-20 Orbotech Ltd A method and apparatus for preparing a pcb product having highly dense conductors
KR20220127272A (ko) * 2020-01-13 2022-09-19 카티바, 인크. 잉크젯 인쇄 회로 기판
US11963300B2 (en) 2020-08-14 2024-04-16 Au Optronics Corporation Panel device and manufacturing method of panel device
DE102021122646A1 (de) * 2021-09-01 2023-03-02 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententräger-Ätzsystem mit physisch getrennten Äzmodulen und Komponententräger
TWI849785B (zh) 2023-03-08 2024-07-21 友達光電股份有限公司 電路裝置
CN118612936B (zh) * 2024-06-21 2024-12-06 南华大学 一种可拉伸的金属基电/热导件
CN119603888B (zh) * 2024-12-18 2025-09-23 西安电子科技大学 一种面向曲面电路三维打印的基材表面改性与附着力增强方法
CN120512823B (zh) * 2025-05-29 2026-04-07 都看(江苏)数码科技有限公司 基于喷墨掩模的陶瓷电路板高精度蚀刻方法及设备

Family Cites Families (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4015706A (en) 1971-11-15 1977-04-05 Chemcut Corporation Connecting modules for an etching system
US4127438A (en) 1977-11-07 1978-11-28 International Business Machines Corporation Adhesion promoter for additively plated printed circuit boards
DE3402883A1 (de) 1984-01-27 1985-08-01 Siemens AG, 1000 Berlin und 8000 München Leiterplatten aus schichtpressstoffen
DE3683194D1 (de) * 1985-06-07 1992-02-13 Sekisui Chemical Co Ltd Photovernetzbare zusammensetzung.
US4946711A (en) 1987-10-14 1990-08-07 Desoto, Inc. Masking compositions and method for applying the same
JP2585070B2 (ja) 1988-08-02 1997-02-26 日本ペイント株式会社 画像形成方法
EP0563251A1 (en) 1990-12-20 1993-10-06 Exxon Chemical Patents Inc. Uv/eb curable butyl copolymers for lithographic and corrosion-resistant coating applications
GB9425031D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
EP0753989B1 (en) 1995-07-11 2005-09-21 Delphi Technologies, Inc. Coatings and methods, especially for circuit boards
DE69800652T2 (de) 1997-02-25 2001-08-23 E.I. Du Pont De Nemours And Co., Wilmington Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten
US6222136B1 (en) 1997-11-12 2001-04-24 International Business Machines Corporation Printed circuit board with continuous connective bumps
IL129307A0 (en) 1999-04-04 2000-02-17 Scitex Corp Ltd Process for direct digital printing of circuit boards
GB9916060D0 (en) 1999-07-08 1999-09-08 Isis Innovation Printed circuit fabrication
ATE326354T1 (de) 1999-07-30 2006-06-15 Seiko Epson Corp Aufzeichnungsverfahren mit der verwendung eines aufzeichnungsmediums und eines druckverfahrens mit zwei flüssigkomponenten darauf
US6399273B1 (en) 1999-08-13 2002-06-04 Board Of Regents, University Of Texas System Water-processable photoresist compositions
DE60103529T2 (de) 2000-03-29 2005-06-02 Kanagawa University, Yokohama Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit
DE10066028C2 (de) 2000-07-07 2003-04-24 Atotech Deutschland Gmbh Kupfersubstrat mit aufgerauhten Oberflächen
JP3754303B2 (ja) 2001-02-16 2006-03-08 株式会社日立インフォメーションテクノロジー Ｓｄｒａｍリフレッシュ回路
JP2006517004A (ja) 2001-08-31 2006-07-13 セミトゥール・インコーポレイテッド 電気泳動エマルジョン付着装置及び方法
US6709962B2 (en) 2002-03-19 2004-03-23 N. Edward Berg Process for manufacturing printed circuit boards
US20030177639A1 (en) 2002-03-19 2003-09-25 Berg N. Edward Process and apparatus for manufacturing printed circuit boards
GB0221891D0 (en) 2002-09-20 2002-10-30 Avecia Ltd Process
TWI291726B (en) 2002-10-25 2007-12-21 Nanya Technology Corp Process for etching metal layer
US7005241B2 (en) * 2003-06-09 2006-02-28 Shinko Electric Industries Co., Ltd. Process for making circuit board or lead frame
US7477627B2 (en) 2003-09-10 2009-01-13 Intel Corporation Method and device of adaptive control of data rate, fragmentation and request to send protection in wireless networks
US7445697B2 (en) 2003-10-22 2008-11-04 Nexx Systems, Inc. Method and apparatus for fluid processing a workpiece
GB0324947D0 (en) 2003-10-25 2003-11-26 Avecia Ltd Process
US20060207888A1 (en) * 2003-12-29 2006-09-21 Taylor E J Electrochemical etching of circuitry for high density interconnect electronic modules
EP1643817A4 (en) * 2004-03-03 2010-04-21 Ibiden Co Ltd RESIN SOLUTION, PAINT PROCESSING AND PCB
KR100585138B1 (ko) 2004-04-08 2006-05-30 삼성전자주식회사 반도체 소자 제조용 마스크 패턴 및 그 형성 방법과 미세패턴을 가지는 반도체 소자의 제조 방법
US20050250052A1 (en) 2004-05-10 2005-11-10 Nguyen Khe C Maskless lithography using UV absorbing nano particle
JP4731135B2 (ja) * 2004-07-02 2011-07-20 ルネサスエレクトロニクス株式会社 微細パターン形成材料を用いた電子デバイス装置の製造方法
GB0414840D0 (en) 2004-07-02 2004-08-04 Ncr Int Inc Self-service terminal
KR100733920B1 (ko) 2004-09-17 2007-07-02 주식회사 엘지화학 에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법
JP2009506187A (ja) 2005-08-31 2009-02-12 プリンター リミテッド Ｕｖ硬化可能なハイブリッド硬化インクジェットインク組成物およびそれを使用するソルダマスク
US20070237899A1 (en) 2006-04-05 2007-10-11 David Sawoska Process for creating a pattern on a copper surface
US20080308003A1 (en) 2007-06-13 2008-12-18 Krol Andrew M UV inkjet resist
JP5454834B2 (ja) 2007-08-30 2014-03-26 日立化成株式会社 粗化処理装置
JP2009158593A (ja) 2007-12-25 2009-07-16 Tessera Interconnect Materials Inc バンプ構造およびその製造方法
WO2009116401A1 (ja) 2008-03-17 2009-09-24 日立化成工業株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板
KR100986287B1 (ko) * 2008-05-09 2010-10-07 삼성전기주식회사 잉크젯 토출장치
EP2562599B1 (en) 2009-01-29 2014-12-10 Digiflex Ltd. Process for producing a photomask on a photopolymeric surface
JP2011243256A (ja) * 2010-05-19 2011-12-01 Dainippon Printing Co Ltd サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
KR20140130234A (ko) 2010-11-17 2014-11-07 히타치가세이가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
US20120288683A1 (en) 2011-05-10 2012-11-15 Chin-Te Kuo Protuberant structure and method for making the same
EP2729595B1 (en) 2011-07-07 2017-02-01 ATOTECH Deutschland GmbH Method for providing organic resist adhesion to a copper or copper alloy surface
US9352544B2 (en) 2011-08-24 2016-05-31 Digiflex Ltd. Process for dry-coating flexographic surfaces
WO2013030931A1 (ja) 2011-08-29 2013-03-07 日本碍子株式会社 積層焼結セラミック配線基板、及び当該配線基板を含む半導体パッケージ
JP2013112882A (ja) * 2011-11-30 2013-06-10 Kanto Chem Co Inc ＴｉおよびＴｉ合金層を有する金属積層膜一括エッチング液組成物
BR112014016337A8 (pt) 2012-01-31 2017-07-04 Agfa Gevaert impressão com tinta a jato de tinta curável por radiação e resistente ao ataque químico
KR20140049358A (ko) * 2012-10-17 2014-04-25 삼성전기주식회사 드라이필름 레지스트 시트 및 제조방법
US20140252571A1 (en) 2013-03-06 2014-09-11 Maxim Integrated Products, Inc. Wafer-level package mitigated undercut
EP3104398B1 (en) 2013-12-06 2020-03-11 Fujifilm Electronic Materials USA, Inc. Cleaning formulation and method for removing residues on surfaces
JP6164614B2 (ja) * 2013-12-06 2017-07-19 メック株式会社 エッチング液、補給液及び銅配線の形成方法
TWI500806B (zh) 2014-03-10 2015-09-21 Nat Univ Tsing Hua 碳化矽薄膜的製造方法
KR20150109932A (ko) 2014-03-21 2015-10-02 삼성전기주식회사 에칭액 조성물 및 이를 이용한 회로 패턴의 제조방법
JP2015227499A (ja) * 2014-06-03 2015-12-17 四国化成工業株式会社 エッチングレジスト材およびプリント配線板の製造方法
BR112017002878A2 (pt) 2014-08-15 2017-12-05 Pneumrx Inc distribuição coordenada de tratamento de copd
WO2016039259A1 (ja) 2014-09-08 2016-03-17 国立大学法人九州大学 有機マイクロディスク構造体の製造方法
US9324669B2 (en) * 2014-09-12 2016-04-26 International Business Machines Corporation Use of electrolytic plating to control solder wetting
GB2538522B (en) 2015-05-19 2019-03-06 Dst Innovations Ltd Electronic circuit and component construction
WO2016193978A2 (en) 2015-06-04 2016-12-08 Jet Cu Pcb Ltd. Methods for producing an etch resist pattern on a metallic surface
WO2017025949A1 (en) 2015-08-13 2017-02-16 Jet Cu Pcb Ltd. Methods for producing an etch resist pattern on a metallic surface
US10398034B2 (en) * 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems

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