CN110249075A - 蚀刻导电特征的方法以及相关装置和系统 - Google Patents

蚀刻导电特征的方法以及相关装置和系统 Download PDF

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Publication number
CN110249075A
CN110249075A CN201780086295.0A CN201780086295A CN110249075A CN 110249075 A CN110249075 A CN 110249075A CN 201780086295 A CN201780086295 A CN 201780086295A CN 110249075 A CN110249075 A CN 110249075A
Authority
CN
China
Prior art keywords
material layer
etch
layer
corrosion
resistant material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780086295.0A
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English (en)
Chinese (zh)
Inventor
N.什派斯曼
M.弗伦克尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kateeva Inc
Original Assignee
Kateeva Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kateeva Inc filed Critical Kateeva Inc
Publication of CN110249075A publication Critical patent/CN110249075A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN201780086295.0A 2016-12-12 2017-12-11 蚀刻导电特征的方法以及相关装置和系统 Pending CN110249075A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662432710P 2016-12-12 2016-12-12
US62/432710 2016-12-12
US15/835116 2017-12-07
US15/835,116 US10398034B2 (en) 2016-12-12 2017-12-07 Methods of etching conductive features, and related devices and systems
PCT/IL2017/051338 WO2018109762A1 (en) 2016-12-12 2017-12-11 Methods of etching conductive features, and related devices and systems

Publications (1)

Publication Number Publication Date
CN110249075A true CN110249075A (zh) 2019-09-17

Family

ID=62558108

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780086295.0A Pending CN110249075A (zh) 2016-12-12 2017-12-11 蚀刻导电特征的方法以及相关装置和系统

Country Status (6)

Country Link
US (3) US10398034B2 (https=)
EP (1) EP3551781B1 (https=)
JP (2) JP2020501375A (https=)
KR (1) KR20190093576A (https=)
CN (1) CN110249075A (https=)
WO (1) WO2018109762A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114945804A (zh) * 2020-01-13 2022-08-26 科迪华公司 喷墨印刷电路板
CN118612936A (zh) * 2024-06-21 2024-09-06 南华大学 一种可拉伸的金属基电/热导件
CN119603888A (zh) * 2024-12-18 2025-03-11 西安电子科技大学 一种面向曲面电路三维打印的基材表面改性与附着力增强方法
CN120512823A (zh) * 2025-05-29 2025-08-19 都看(江苏)数码科技有限公司 基于喷墨掩模的陶瓷电路板高精度蚀刻方法及设备

Families Citing this family (7)

* Cited by examiner, † Cited by third party
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WO2016193978A2 (en) 2015-06-04 2016-12-08 Jet Cu Pcb Ltd. Methods for producing an etch resist pattern on a metallic surface
WO2017025949A1 (en) 2015-08-13 2017-02-16 Jet Cu Pcb Ltd. Methods for producing an etch resist pattern on a metallic surface
US10398034B2 (en) 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
WO2020165897A1 (en) 2019-02-14 2020-08-20 Orbotech Ltd A method and apparatus for preparing a pcb product having highly dense conductors
US11963300B2 (en) 2020-08-14 2024-04-16 Au Optronics Corporation Panel device and manufacturing method of panel device
DE102021122646A1 (de) * 2021-09-01 2023-03-02 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententräger-Ätzsystem mit physisch getrennten Äzmodulen und Komponententräger
TWI849785B (zh) 2023-03-08 2024-07-21 友達光電股份有限公司 電路裝置

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114945804A (zh) * 2020-01-13 2022-08-26 科迪华公司 喷墨印刷电路板
TWI877287B (zh) * 2020-01-13 2025-03-21 美商凱特伊夫公司 噴墨印刷電路板
CN118612936A (zh) * 2024-06-21 2024-09-06 南华大学 一种可拉伸的金属基电/热导件
CN119603888A (zh) * 2024-12-18 2025-03-11 西安电子科技大学 一种面向曲面电路三维打印的基材表面改性与附着力增强方法
CN120512823A (zh) * 2025-05-29 2025-08-19 都看(江苏)数码科技有限公司 基于喷墨掩模的陶瓷电路板高精度蚀刻方法及设备

Also Published As

Publication number Publication date
US20180192521A1 (en) 2018-07-05
JP2020501375A (ja) 2020-01-16
EP3551781A4 (en) 2020-09-02
US20190335589A1 (en) 2019-10-31
EP3551781A1 (en) 2019-10-16
EP3551781B1 (en) 2025-09-24
US10398034B2 (en) 2019-08-27
US11006528B2 (en) 2021-05-11
US11425822B2 (en) 2022-08-23
US20210227696A1 (en) 2021-07-22
KR20190093576A (ko) 2019-08-09
WO2018109762A1 (en) 2018-06-21
JP2023139049A (ja) 2023-10-03

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Application publication date: 20190917