JP7288644B2 - 金属表面上のエッチレジストパターンの製造方法 - Google Patents
金属表面上のエッチレジストパターンの製造方法 Download PDFInfo
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- JP7288644B2 JP7288644B2 JP2021121139A JP2021121139A JP7288644B2 JP 7288644 B2 JP7288644 B2 JP 7288644B2 JP 2021121139 A JP2021121139 A JP 2021121139A JP 2021121139 A JP2021121139 A JP 2021121139A JP 7288644 B2 JP7288644 B2 JP 7288644B2
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- metal
- metal surface
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- 229910052751 metal Inorganic materials 0.000 title claims description 70
- 239000002184 metal Substances 0.000 title claims description 70
- 238000004519 manufacturing process Methods 0.000 title description 10
- 238000000034 method Methods 0.000 claims description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 38
- 229910052802 copper Inorganic materials 0.000 claims description 37
- 239000010949 copper Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 17
- 239000007864 aqueous solution Substances 0.000 claims description 13
- 230000003213 activating effect Effects 0.000 claims description 12
- 238000007641 inkjet printing Methods 0.000 claims description 11
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 8
- 239000012190 activator Substances 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 7
- 229910019142 PO4 Inorganic materials 0.000 claims description 5
- 150000001879 copper Chemical class 0.000 claims description 5
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims description 5
- 235000021317 phosphate Nutrition 0.000 claims description 5
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims description 5
- 229960002218 sodium chlorite Drugs 0.000 claims description 5
- 235000015217 chromium(III) sulphate Nutrition 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 3
- 229910001431 copper ion Inorganic materials 0.000 claims description 3
- 150000003013 phosphoric acid derivatives Chemical class 0.000 claims description 3
- 150000003871 sulfonates Chemical class 0.000 claims description 3
- -1 copper cations Chemical class 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 claims 3
- 239000004615 ingredient Substances 0.000 claims 2
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical class [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 claims 1
- 239000000976 ink Substances 0.000 description 29
- 239000000243 solution Substances 0.000 description 25
- 239000000203 mixture Substances 0.000 description 18
- 239000007788 liquid Substances 0.000 description 14
- 239000000126 substance Substances 0.000 description 14
- 230000004913 activation Effects 0.000 description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000007639 printing Methods 0.000 description 7
- 125000000129 anionic group Chemical group 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000001476 alcoholic effect Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 229920006318 anionic polymer Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003100 immobilizing effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229920005792 styrene-acrylic resin Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- NJVOHKFLBKQLIZ-UHFFFAOYSA-N (2-ethenylphenyl) prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1C=C NJVOHKFLBKQLIZ-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910021577 Iron(II) chloride Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229920005692 JONCRYL® Polymers 0.000 description 1
- 229910004882 Na2S2O8 Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- CBTVGIZVANVGBH-UHFFFAOYSA-N aminomethyl propanol Chemical compound CC(C)(N)CO CBTVGIZVANVGBH-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000003906 humectant Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920013730 reactive polymer Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/92—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof prepared from printing surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0058—Digital printing on surfaces other than ordinary paper on metals and oxidised metal surfaces
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
きに瞬時にインク液滴の粘度を著しく(例えば、1桁または2桁の大きさだけ)増加させ得る。
限定的な例としては、pHが7.0より高く(塩基性の)少なくとも1つのアニオン性ポリマーを挙げることができる。アニオン性ポリマーは、溶解した塩の形態のアクリル樹脂およびスチレン-アクリル樹脂、溶解した塩の形態のスルホン樹脂(例えばナトリウム、アンモニウムまたはアミンで中和された形態)から選択されたもの等であり得る。特定の理論的メカニズムに縛られることを意図するものではないが、これらの樹脂は反応性(活性化)表面との反応を起こし得る。例えば、銅金属表面が活性化されて銅の上に銅カチオンを形成し、アクリルポリマー(エッチレジストインク中に含まれる)が表面に当たると、アニオン性アクリレートが銅イオンと反応してポリマーマトリックスを形成し、これは液滴の粘度を劇的に増加させよう。
処理した銅板の上に液体組成物を印刷し、80℃で乾燥させて不溶性エッチレジストマスクを製造した。エッチレジストパターンは、図2Bに示されているように、鋭いエッジを有し、ライン切れがなく、50μmまでの細い線幅を有し、明確に画定された薄いラインを有する高い印刷品質を示していた。露出した銅のエッチングおよびエッチレジストマスクの除去を、実施例1に詳述したように行った。板上の配線パターンは、鋭いエッジを有し、ライン切れがなく、50μmまでの細い線幅を有し、明確に画定された細いラインを示していた。
処理した銅板の上に液体組成物を印刷し、80℃で乾燥させて不溶性エッチレジストマスクを製造した。エッチレジストパターンは、鋭いエッジを有し、ライン切れがなく、50μmまでの細い線幅を有し、明確に画定された薄いラインを有する高い印刷品質を示していた。露出した銅のエッチングおよびエッチレジストマスクの除去を、実施例1に詳述したように行った。板上の配線パターンは、鋭いエッジを有し、ライン切れがなく、30μmまでの細い線幅を有し、明確に画定された細いラインを示していた。
Claims (16)
- 基板上に金属パターンを形成する方法であって、前記方法は、
無機活性化剤を含む水溶液を金属表面に塗布して、前記基板の前記金属表面を活性化するステップと、 溶媒を用いて、活性化された前記金属表面から化学的に前記表面を活性化する前記水溶液を除去するステップと、
前記金属表面を化学的に活性化した後、前記金属表面にエッチレジストインクをインクジェット印刷するステップと、
前記エッチレジストインクの成分を前記金属表面のイオンと反応させて、エッチレジストマスクを生成するステップと、
エッチングプロセスを実施し、金属層の前記エッチレジストマスクで覆われていない部分を除去するステップと、
前記エッチレジストマスクを除去して前記金属パターンを形成するステップと、を含む方法であって、前記エッチングプロセスを実施して形成された前記金属パターンは、複数の金属線を含み、前記複数の金属線のそれぞれは50μm未満の幅を有する方法。 - 請求項1に記載の方法であって、前記エッチレジストマスクは、50μm未満の幅を有するラインを含む方法。
- 請求項1に記載の方法であって、前記エッチングプロセスを実施して形成された前記金属パターンは、30μm未満の幅を有する金属線を含む方法。
- 請求項1に記載の方法であって、前記金属層の前記活性化された表面と反応する前記エッチレジストインクの前記成分は、アクリレート、ホスフェート、スルホネート、またはそれらの任意の組み合わせを含むポリマー成分である方法。
- 請求項1に記載の方法であって、前記無機活性化剤は、銅塩、第二鉄塩、クロム硫酸、過硫酸塩、亜塩素酸ナトリウム、および過酸化水素からなる群から選択される1つ以上の材料を含む方法。
- 請求項1に記載の方法であって、前記水溶液を塗布するステップは、前記水溶液の槽に前記金属表面を約10-60秒間浸漬するステップ、または前記水溶液を前記金属表面に噴霧するステップ、を含む方法。
- 請求項1に記載の方法であって、前記エッチレジストインクは、さらに染料を含む方法。
- 請求項1に記載の方法であって、前記金属表面は銅を含み、前記金属表面の前記イオンは銅カチオンを含む方法。
- 基板上に金属パターンを形成する方法であって、前記方法は、
無機系活性剤を含む水溶液を金属表面に塗布して、前記基板の前記金属表面を活性化するステップと、
溶媒を用いて、活性化された前記金属表面から化学的に前記表面を活性化する前記水溶液を除去するステップと、
前記金属表面を化学的に活性化した後、ポリマー成分を含むインクを前記金属面にインクジェット印刷するステップと、
前記インクの成分を前記金属表面のイオンと反応させてレジストを生成するステップと、
エッチングプロセスを実施し、金属層の前記レジストに覆われていない部分を除去するステップと、
前記レジストを除去して前記金属パターンを形成するステップと、を含む方法であって、前記エッチングプロセスを実施して形成された前記金属パターンは、複数の金属線を含み、前記複数の金属線のそれぞれは50μm未満の幅を有する方法。 - 請求項9に記載の方法であって、前記ポリマー成分は、アクリレート、ホスフェート、スルホネート、またはそれらの任意の組み合わせを含む方法。
- 請求項9に記載の方法であって、前記無機活性化剤は、銅塩、第二鉄塩、クロム硫酸、過硫酸塩、亜塩素酸ナトリウム、および過酸化水素からなる群から選択される1つ以上の材料を含む方法。
- 請求項9に記載の方法であって、前記インクは、さらに染料を含む方法。
- 請求項9に記載の方法であって、前記インクの前記成分は前記金属表面の銅イオンと反応する方法。
- 基板上に金属パターンを形成する方法であって、前記方法は、
銅塩、第二鉄塩、クロム硫酸、過硫酸塩、亜塩素酸ナトリウム、および過酸化水素からなる群から選択される無機活性化剤を含む水溶液を金属表面に塗布して、前記基板の前記金属表面を活性化するステップと、
溶媒を用いて、活性化された前記金属表面から化学的に前記表面を活性化する前記水溶液を除去するステップと、
前記金属表面を化学的に活性化した後、アクリレート、ホスフェート、スルホネート、またはこれらの組み合わせを含むインクを前記金属表面にインクジェット印刷するステップと、
前記インクの成分を前記金属表面の銅イオンと反応させてレジストを生成するステップと、
エッチングプロセスを実施し、金属層の前記レジストで覆われていない部分を除去するステップと、
前記レジストを除去して前記金属パターンを形成するステップと、を含む方法であって、前記エッチングプロセスを実施して形成された前記金属パターンは、複数の金属線を含み、前記複数の金属線のそれぞれは50μm未満の幅を有する方法。 - 請求項14に記載の方法であって、前記エッチングプロセスを実施して形成された前記金属パターンは、30μm未満の幅を有する金属線を含む方法。
- 請求項14に記載の方法であって、前記インクは、さらに染料を含む方法。
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3304197A4 (en) | 2015-06-04 | 2019-01-23 | Kateeva, Inc. | METHOD FOR PRODUCING AN ESTETRESIST PATTERN ON A METALLIC SURFACE |
EP3866572B1 (en) | 2015-08-13 | 2024-01-03 | Kateeva, Inc. | Methods for producing a metallic pattern on a substrate |
US10398034B2 (en) | 2016-12-12 | 2019-08-27 | Kateeva, Inc. | Methods of etching conductive features, and related devices and systems |
CN113275229A (zh) * | 2017-10-23 | 2021-08-20 | Mec株式会社 | 膜形成基材的制造方法、膜形成基材及表面处理剂 |
DE102019113960A1 (de) * | 2019-03-29 | 2020-10-01 | Pierce Protocols Limited | Verfahren und System zur Glasätzvorbereitung |
JP6908207B2 (ja) * | 2019-06-11 | 2021-07-21 | 三菱瓦斯化学株式会社 | 水性組成物、これを用いたステンレス鋼表面の粗化処理方法、ならびに粗化処理されたステンレス鋼およびその製造方法 |
CN110468413A (zh) * | 2019-09-10 | 2019-11-19 | 四会富仕电子科技股份有限公司 | 一种金属基表面粗化的方法 |
US11826775B2 (en) * | 2022-03-07 | 2023-11-28 | CatMarks Manufacturing, LLC | Automotive part identification marking system |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005033049A (ja) | 2003-07-08 | 2005-02-03 | Nec Toppan Circuit Solutions Inc | プリント配線板の配線パターン形成方法及びプリント配線板の製造方法 |
JP2005079479A (ja) | 2003-09-02 | 2005-03-24 | Asahi Kasei Electronics Co Ltd | レジスト直描用レジストインク |
WO2005069705A1 (ja) | 2004-01-15 | 2005-07-28 | Matsushita Electric Industrial Co., Ltd. | 金属パターン及びその製造方法 |
JP2011171323A (ja) | 2010-02-16 | 2011-09-01 | Mitsubishi Paper Mills Ltd | 銅又は銅合金のエッチング方法 |
Family Cites Families (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4015706A (en) | 1971-11-15 | 1977-04-05 | Chemcut Corporation | Connecting modules for an etching system |
US4127438A (en) * | 1977-11-07 | 1978-11-28 | International Business Machines Corporation | Adhesion promoter for additively plated printed circuit boards |
DE3402883A1 (de) | 1984-01-27 | 1985-08-01 | Siemens AG, 1000 Berlin und 8000 München | Leiterplatten aus schichtpressstoffen |
DE3683194D1 (de) | 1985-06-07 | 1992-02-13 | Sekisui Chemical Co Ltd | Photovernetzbare zusammensetzung. |
US4946711A (en) | 1987-10-14 | 1990-08-07 | Desoto, Inc. | Masking compositions and method for applying the same |
JP2585070B2 (ja) | 1988-08-02 | 1997-02-26 | 日本ペイント株式会社 | 画像形成方法 |
WO1992011322A2 (en) | 1990-12-20 | 1992-07-09 | Exxon Chemical Patents Inc. | Uv/eb curable butyl copolymers for lithographic and corrosion-resistant coating applications |
GB9425031D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
EP0753989B1 (en) | 1995-07-11 | 2005-09-21 | Delphi Technologies, Inc. | Coatings and methods, especially for circuit boards |
EP0860742B1 (en) | 1997-02-25 | 2001-04-04 | E.I. Du Pont De Nemours And Company | Flexible, flame-retardant, photoimageable composition for coating printing circuits |
US6222136B1 (en) | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
IL129307A0 (en) * | 1999-04-04 | 2000-02-17 | Scitex Corp Ltd | Process for direct digital printing of circuit boards |
GB9916060D0 (en) * | 1999-07-08 | 1999-09-08 | Isis Innovation | Printed circuit fabrication |
ATE326354T1 (de) | 1999-07-30 | 2006-06-15 | Seiko Epson Corp | Aufzeichnungsverfahren mit der verwendung eines aufzeichnungsmediums und eines druckverfahrens mit zwei flüssigkomponenten darauf |
EP1240552B1 (en) | 1999-08-13 | 2012-09-19 | Intellectual Ventures Holding 40 LLC | Water-processable photoresist compositions |
JP4606684B2 (ja) | 2000-03-29 | 2011-01-05 | 学校法人神奈川大学 | 光硬化性・熱硬化性樹脂組成物、その感光性ドライフィルム及びそれを用いたパターン形成方法 |
DE10066028C2 (de) * | 2000-07-07 | 2003-04-24 | Atotech Deutschland Gmbh | Kupfersubstrat mit aufgerauhten Oberflächen |
JP3754303B2 (ja) | 2001-02-16 | 2006-03-08 | 株式会社日立インフォメーションテクノロジー | Sdramリフレッシュ回路 |
JP2003012971A (ja) | 2001-06-28 | 2003-01-15 | Konica Corp | インクジェット記録方法 |
EP1563119A4 (en) | 2001-08-31 | 2006-03-22 | Semitool Inc | APPARATUS AND METHOD FOR DISPERSING AN ELECTROPHORETIC EMULSION |
US6709962B2 (en) * | 2002-03-19 | 2004-03-23 | N. Edward Berg | Process for manufacturing printed circuit boards |
US20030177639A1 (en) * | 2002-03-19 | 2003-09-25 | Berg N. Edward | Process and apparatus for manufacturing printed circuit boards |
SG107593A1 (en) * | 2002-06-04 | 2004-12-29 | Agency Science Tech & Res | Method for electroless metalisation of polymer substrate |
GB0221891D0 (en) | 2002-09-20 | 2002-10-30 | Avecia Ltd | Process |
TWI291726B (en) | 2002-10-25 | 2007-12-21 | Nanya Technology Corp | Process for etching metal layer |
US7005241B2 (en) | 2003-06-09 | 2006-02-28 | Shinko Electric Industries Co., Ltd. | Process for making circuit board or lead frame |
US7477627B2 (en) | 2003-09-10 | 2009-01-13 | Intel Corporation | Method and device of adaptive control of data rate, fragmentation and request to send protection in wireless networks |
US20050067378A1 (en) * | 2003-09-30 | 2005-03-31 | Harry Fuerhaupter | Method for micro-roughening treatment of copper and mixed-metal circuitry |
EP1678352A2 (en) | 2003-10-22 | 2006-07-12 | Nexx Systems, Inc. | Method and apparatus for fluid processing a workpiece |
GB0324947D0 (en) | 2003-10-25 | 2003-11-26 | Avecia Ltd | Process |
US7357879B2 (en) | 2004-03-03 | 2008-04-15 | Ibiden Co., Ltd. | Etching solution, method of etching and printed wiring board |
KR100585138B1 (ko) | 2004-04-08 | 2006-05-30 | 삼성전자주식회사 | 반도체 소자 제조용 마스크 패턴 및 그 형성 방법과 미세패턴을 가지는 반도체 소자의 제조 방법 |
US20050250052A1 (en) | 2004-05-10 | 2005-11-10 | Nguyen Khe C | Maskless lithography using UV absorbing nano particle |
GB0414840D0 (en) | 2004-07-02 | 2004-08-04 | Ncr Int Inc | Self-service terminal |
KR100733920B1 (ko) * | 2004-09-17 | 2007-07-02 | 주식회사 엘지화학 | 에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법 |
WO2007026366A1 (en) | 2005-08-31 | 2007-03-08 | Printar Ltd. | Uv curable hybridcuring ink jet ink composition and solder mask using the same |
KR100643934B1 (ko) * | 2005-09-02 | 2006-11-10 | 삼성전기주식회사 | 인쇄회로기판의 회로패턴 형성방법 |
US7686986B2 (en) | 2006-01-05 | 2010-03-30 | Headwaters Technology Innovation, Llc | Magnesium hydroxide nanoparticles, methods of making same and compositions incorporating same |
JP2007250884A (ja) * | 2006-03-16 | 2007-09-27 | Shirai Denshi Kogyo Kk | フレキシブルプリント基板およびその製造方法 |
US20070237899A1 (en) * | 2006-04-05 | 2007-10-11 | David Sawoska | Process for creating a pattern on a copper surface |
US20080308003A1 (en) | 2007-06-13 | 2008-12-18 | Krol Andrew M | UV inkjet resist |
JP5454834B2 (ja) | 2007-08-30 | 2014-03-26 | 日立化成株式会社 | 粗化処理装置 |
JP2009158593A (ja) | 2007-12-25 | 2009-07-16 | Tessera Interconnect Materials Inc | バンプ構造およびその製造方法 |
WO2009116401A1 (ja) | 2008-03-17 | 2009-09-24 | 日立化成工業株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板 |
KR100986287B1 (ko) | 2008-05-09 | 2010-10-07 | 삼성전기주식회사 | 잉크젯 토출장치 |
EP2562599B1 (en) * | 2009-01-29 | 2014-12-10 | Digiflex Ltd. | Process for producing a photomask on a photopolymeric surface |
JP2011243256A (ja) | 2010-05-19 | 2011-12-01 | Dainippon Printing Co Ltd | サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
WO2012067107A1 (ja) | 2010-11-17 | 2012-05-24 | 日立化成工業株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
US20120288683A1 (en) | 2011-05-10 | 2012-11-15 | Chin-Te Kuo | Protuberant structure and method for making the same |
KR101842320B1 (ko) * | 2011-07-07 | 2018-03-26 | 아토테크더치랜드게엠베하 | 구리 또는 구리 합금 표면에 유기 레지스트 접착을 제공하는 방법 |
US9352544B2 (en) * | 2011-08-24 | 2016-05-31 | Digiflex Ltd. | Process for dry-coating flexographic surfaces |
WO2013030931A1 (ja) | 2011-08-29 | 2013-03-07 | 日本碍子株式会社 | 積層焼結セラミック配線基板、及び当該配線基板を含む半導体パッケージ |
US9683305B2 (en) * | 2011-12-20 | 2017-06-20 | Apple Inc. | Metal surface and process for treating a metal surface |
AU2013214473B2 (en) | 2012-01-31 | 2016-03-17 | Agfa-Gevaert | Radiation curable etch resistant inkjet ink printing |
JP2013162007A (ja) * | 2012-02-07 | 2013-08-19 | Toppan Printing Co Ltd | 微細配線パターンの製造方法 |
US20140252571A1 (en) | 2013-03-06 | 2014-09-11 | Maxim Integrated Products, Inc. | Wafer-level package mitigated undercut |
CN108485840B (zh) | 2013-12-06 | 2020-12-29 | 富士胶片电子材料美国有限公司 | 用于去除表面上的残余物的清洗调配物 |
JP6164614B2 (ja) | 2013-12-06 | 2017-07-19 | メック株式会社 | エッチング液、補給液及び銅配線の形成方法 |
TWI500806B (zh) | 2014-03-10 | 2015-09-21 | Nat Univ Tsing Hua | 碳化矽薄膜的製造方法 |
KR20150109932A (ko) | 2014-03-21 | 2015-10-02 | 삼성전기주식회사 | 에칭액 조성물 및 이를 이용한 회로 패턴의 제조방법 |
WO2016039259A1 (ja) | 2014-09-08 | 2016-03-17 | 国立大学法人九州大学 | 有機マイクロディスク構造体の製造方法 |
GB2538522B (en) | 2015-05-19 | 2019-03-06 | Dst Innovations Ltd | Electronic circuit and component construction |
EP3304197A4 (en) | 2015-06-04 | 2019-01-23 | Kateeva, Inc. | METHOD FOR PRODUCING AN ESTETRESIST PATTERN ON A METALLIC SURFACE |
EP3866572B1 (en) | 2015-08-13 | 2024-01-03 | Kateeva, Inc. | Methods for producing a metallic pattern on a substrate |
US10398034B2 (en) | 2016-12-12 | 2019-08-27 | Kateeva, Inc. | Methods of etching conductive features, and related devices and systems |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005033049A (ja) | 2003-07-08 | 2005-02-03 | Nec Toppan Circuit Solutions Inc | プリント配線板の配線パターン形成方法及びプリント配線板の製造方法 |
JP2005079479A (ja) | 2003-09-02 | 2005-03-24 | Asahi Kasei Electronics Co Ltd | レジスト直描用レジストインク |
WO2005069705A1 (ja) | 2004-01-15 | 2005-07-28 | Matsushita Electric Industrial Co., Ltd. | 金属パターン及びその製造方法 |
JP2011171323A (ja) | 2010-02-16 | 2011-09-01 | Mitsubishi Paper Mills Ltd | 銅又は銅合金のエッチング方法 |
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CN108027553A (zh) | 2018-05-11 |
EP3335079A4 (en) | 2019-03-27 |
EP3866572B1 (en) | 2024-01-03 |
EP3335079B1 (en) | 2021-05-12 |
US10806035B2 (en) | 2020-10-13 |
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US20220136113A1 (en) | 2022-05-05 |
JP2018527463A (ja) | 2018-09-20 |
EP3866572A2 (en) | 2021-08-18 |
JP2023116478A (ja) | 2023-08-22 |
KR20180074666A (ko) | 2018-07-03 |
JP2021192427A (ja) | 2021-12-16 |
CN108027553B (zh) | 2021-12-31 |
CN114397795A (zh) | 2022-04-26 |
EP3866572A3 (en) | 2021-09-29 |
US20180242457A1 (en) | 2018-08-23 |
WO2017025949A1 (en) | 2017-02-16 |
US20240035167A1 (en) | 2024-02-01 |
US11807947B2 (en) | 2023-11-07 |
KR20240014578A (ko) | 2024-02-01 |
US11255018B2 (en) | 2022-02-22 |
KR102508824B1 (ko) | 2023-03-09 |
KR102626521B1 (ko) | 2024-01-17 |
JP6975463B2 (ja) | 2021-12-01 |
EP3335079A1 (en) | 2018-06-20 |
US20210007225A1 (en) | 2021-01-07 |
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