JP3960320B2 - 配線基板とそれを用いたバランと配線基板の製造方法 - Google Patents
配線基板とそれを用いたバランと配線基板の製造方法 Download PDFInfo
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- JP3960320B2 JP3960320B2 JP2004122580A JP2004122580A JP3960320B2 JP 3960320 B2 JP3960320 B2 JP 3960320B2 JP 2004122580 A JP2004122580 A JP 2004122580A JP 2004122580 A JP2004122580 A JP 2004122580A JP 3960320 B2 JP3960320 B2 JP 3960320B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 131
- 239000010410 layer Substances 0.000 claims description 73
- 229910052759 nickel Inorganic materials 0.000 claims description 65
- 239000004020 conductor Substances 0.000 claims description 64
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 61
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- 239000011574 phosphorus Substances 0.000 claims description 35
- 229910052698 phosphorus Inorganic materials 0.000 claims description 35
- 238000010304 firing Methods 0.000 claims description 25
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 24
- 238000007747 plating Methods 0.000 claims description 23
- 238000001035 drying Methods 0.000 claims description 22
- 238000007639 printing Methods 0.000 claims description 19
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 15
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 15
- 239000012298 atmosphere Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
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- 239000005388 borosilicate glass Substances 0.000 claims description 10
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- 238000013508 migration Methods 0.000 description 23
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 22
- 239000012790 adhesive layer Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 12
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
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- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
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- 239000011261 inert gas Substances 0.000 description 2
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/42—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
- H03H7/422—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns comprising distributed impedance elements together with lumped impedance elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
先ず、本実施の形態1における配線基板の製造方法について以下図面を用いて説明する。図1は本実施の形態1における製造工程図であり、図2は、導体パターン製造工程のフローチャートである。さらに、図3から図15は本実施の形態1における各製造工程の詳細図である。なお、本実施の形態1の説明に用いる図面(図1から図15)において、背景技術で用いた図面(図18、図19)と同じものは同じ番号とし、その説明は簡略化している。
以下、本発明の実施の形態2について、図面を用いて説明する。図17は、本発明の実施の形態2における携帯電話(高周波機器の一例として用いた)のブロック図であり、図18は受信系におけるバランの回路図であり、図19は同、送信系におけるバランの回路図である。
4 絶縁膜
65a 導体パターン
65b 導体パターン
66 酸化ニッケル層
Claims (7)
- 無機質の基材を複数回焼成して配線パターンを形成する配線基板において、前記配線基板は、前記基材と、この基材上に銀導体で形成された配線パターンと、この配線パターンの表層に形成された酸化ニッケル層と、この酸化ニッケル層の上に形成された絶縁保護膜とを有し、前記絶縁保護膜はホウ硅酸鉛ガラス系ペーストの焼成体で形成された配線基板において、前記酸化ニッケル層は、5wt%以上9wt%以下のリンを含有する層とした配線基板。
- 配線パターンと酸化ニッケル層との間にはパラジウム層を有した請求項1に記載の配線基板。
- 無機質の基板と、この基板上に焼成して形成された第1の配線導体と、この第1の配線導体に対し分布結合されるとともに、前記基板上に焼成して形成された第2の配線導体と、前記第1の配線導体の一方に接続された第1の端子と、前記第1の配線導体の他方に接続された第2の端子と、前記第2の配線導体の一方に接続された第3の端子と、前記第2の配線導体の他方に接続された第4の端子と、グランドへ接続されるとともに前記第1の配線導体の略中点が接続されたグランド端子とを備え、前記中点と前記グランドとの間にはキャパシタを有するとともに、前記中点には前記第1の端子と前記第2の端子へ供給するための電圧が供給され、少なくとも前記第1の配線導体の表層には、酸化ニッケル層が形成され、前記第1の配線導体と前記第2の配線導体との上にはホウ硅酸鉛ガラス系ペーストの焼成体で形成されたガラス系の絶縁膜が形成されるとともに、酸化ニッケル層は、5wt%以上9wt%以下のリンを含有する層としたバラン。
- 無機質の基材上に銀導体による配線パターンを形成する配線基板の製造方法において、前記配線基板の製造方法は、前記基板上に前記配線パターンを形成する導体パターン形成工程と、この導体パターン形成工程の後で、前記配線パターン上へ選択的にニッケル層を形成する無電解ニッケルめっき工程と、この無電解ニッケルめっき工程の後で少なくとも前記配線パターンが形成された面側に絶縁保護膜を形成する絶縁膜形成工程と、前記無電解ニッケルめっき工程の下流に設けられるとともに、酸化性雰囲気中で前記配線パターンを焼成する焼成工程とを備え、絶縁膜形成工程には、前記配線パターンが形成された面側にホウ硅酸鉛ガラス系の絶縁ペーストを印刷する印刷工程と、この印刷工程の後で前記絶縁ペーストを焼成し、絶縁膜を形成する焼成工程とを有し、前記焼成工程ではニッケル層を酸化させるとともに、無電解ニッケルめっき工程では、5wt%以上9wt%以下のリンを含有するニッケル層を形成する配線基板の製造方法。
- 銀導体パターン形成工程と無電解ニッケルめっき工程との間には、下地めっき工程を有し、前記下地めっき工程では、配線パターン上に選択的にパラジウムを置換する請求項4に記載の配線基板の製造方法。
- 導体形成工程は、可とう性フィルムへ凹部を形成して凹版を製造する凹版製造工程と、この凹版製造工程の後で前記凹版へ銀ペーストを充填する充填工程と、この充填工程の後で前記充填された銀ペーストを乾燥する乾燥工程と、この乾燥工程の後で予め接着剤が塗布された無機質な基板上へ前記凹版を貼り付ける貼り付け工程と、この貼り付け工程の後で前記凹版と前記基板とを加熱・圧着する加熱・圧着工程と、この加熱・圧着工程の後で前記凹版を前記基板から剥離し、前記基板上へ前記銀ペーストを敷設する剥離工程と、この剥離工程の後で敷設された前記銀ペーストを焼成し配線パターンを形成させる焼成工程とを有した請求項4に記載の配線基板の製造方法。
- 充填工程は、フィルム上へ銀粉を含む銀ペーストを供給し、凹部へ前記銀ペーストを充填する印刷工程と、この印刷工程の後で前記フィルム表面がスキージによって掻かれ、前記凹部に充填された銀ペースト以外の不要ペーストを除去する掻き取り工程とを有するとともに、焼成工程と無電解ニッケルめっき工程との間には、配線パターン上に形成された酸化膜を除去するとともに、前記掻き取り工程で配線パターン間に残留した銀粉を除去する清浄化工程が挿入された請求項6に記載の配線基板の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004122580A JP3960320B2 (ja) | 2004-04-19 | 2004-04-19 | 配線基板とそれを用いたバランと配線基板の製造方法 |
US11/103,592 US20050231926A1 (en) | 2004-04-19 | 2005-04-12 | Wiring board, balun and apparatus using wiring board, and method of manufacturing wiring board |
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JP2004122580A JP3960320B2 (ja) | 2004-04-19 | 2004-04-19 | 配線基板とそれを用いたバランと配線基板の製造方法 |
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JP2005310875A JP2005310875A (ja) | 2005-11-04 |
JP3960320B2 true JP3960320B2 (ja) | 2007-08-15 |
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JP2004122580A Expired - Fee Related JP3960320B2 (ja) | 2004-04-19 | 2004-04-19 | 配線基板とそれを用いたバランと配線基板の製造方法 |
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JP (1) | JP3960320B2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1672769A3 (de) * | 2004-12-18 | 2009-07-08 | LuK Lamellen und Kupplungsbau Beteiligungs KG | Betätigungsvorrichtung für Kraftfahrzeugkomponenten |
JP4661762B2 (ja) * | 2006-10-17 | 2011-03-30 | Tdk株式会社 | フィルタ |
JP4947416B2 (ja) * | 2007-03-29 | 2012-06-06 | Tdk株式会社 | 電子素子およびその製造方法 |
KR100974655B1 (ko) * | 2008-06-17 | 2010-08-09 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP5258957B2 (ja) * | 2009-02-25 | 2013-08-07 | セイコーインスツル株式会社 | 圧電振動子の製造方法及び基板の製造方法 |
CN104981099A (zh) * | 2015-06-18 | 2015-10-14 | 镇江华印电路板有限公司 | 高精度贯孔板 |
CN105655005A (zh) * | 2016-03-22 | 2016-06-08 | 广西吉宽太阳能设备有限公司 | 一种晶体硅太阳能电池用电极银浆 |
CN105655006A (zh) * | 2016-03-22 | 2016-06-08 | 广西吉宽太阳能设备有限公司 | 一种硅太阳能电池用电极混合浆料 |
GB201613051D0 (en) * | 2016-07-28 | 2016-09-14 | Landa Labs (2012) Ltd | Applying an electrical conductor to a substrate |
AU2019200576B2 (en) * | 2016-07-28 | 2020-09-03 | Lumet Technologies Ltd | Application of electrical conductors of a solar cell |
AU2019200578B2 (en) * | 2016-07-28 | 2021-05-06 | Landa Labs (2012) Ltd | Application of electrical conductors to an electrically insulating substrate |
KR20220116804A (ko) * | 2021-02-15 | 2022-08-23 | 신웅철 | 인쇄회로기판 제조방법 |
CN113543472A (zh) * | 2021-06-16 | 2021-10-22 | 昆山沪利微电有限公司 | 一种复合电路板及其制作方法 |
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US5235139A (en) * | 1990-09-12 | 1993-08-10 | Macdermid, Incorprated | Method for fabricating printed circuits |
JP2665134B2 (ja) * | 1993-09-03 | 1997-10-22 | 日本黒鉛工業株式会社 | フレキシブル回路基板及びその製造方法 |
JP2885113B2 (ja) * | 1995-01-30 | 1999-04-19 | 日本電気株式会社 | 印刷配線板およびその製造方法 |
JPH10261212A (ja) * | 1996-09-27 | 1998-09-29 | Nippon Mektron Ltd | 回路配線付き磁気ヘッド用サスペンションの製造法 |
JP3195590B2 (ja) * | 1999-04-27 | 2001-08-06 | 日東電工株式会社 | フレキシブル配線板 |
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