JP2005142523A - 埋設抵抗を有する印刷回路基板の製造方法 - Google Patents
埋設抵抗を有する印刷回路基板の製造方法 Download PDFInfo
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- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
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- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
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- H—ELECTRICITY
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
- Y10T29/49098—Applying terminal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49101—Applying terminal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
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Abstract
【解決手段】 銅被覆積層板の表面に抵抗が充填される部分に対応するところにメッキ防止パターンを形成するステップと、銅被覆積層板をメッキするステップと、抵抗が挿入される空間の銅被覆層をエッチングするためのエッチング防止パターンを形成するステップと、メッキ防止パターンを取り除くステップと、銅被覆積層板をエッチングするステップと、抵抗が挿入される空間に抵抗ペーストを充填するステップと、銅被覆積層板に回路パターンを形成するステップを含む。
【選択図】 図3d
Description
該方法では抵抗体が印刷回路基板の内部に形成されて誘電体材料によって抵抗体が保護されるので外部環境による影響を防止するために、別途の工法を要しない。
R(抵抗値)=R(比抵抗)×(抵抗の長さ)/(抵抗の幅×抵抗の厚さ) 数式1
上記数式1から分かるように、抵抗の厚さが増加すれば抵抗値が減少することは理解されるであろう。しかしながら、実際印刷工程においてパネル上に決まった厚さで印刷することは、印刷製版、印刷装置のような設備自体の印刷の偏差(tolerance)により均一な抵抗値を具現することは困難である。
22、62、82 銅被覆層
23、63、83 補強器材
24,64 抵抗が埋設される空間
26、66、88 抵抗ペースト
28 接地端子用銀メッキ層
67 金属層
Claims (16)
- 抵抗が挿入される空間に対応する、銅被覆積層板の銅被覆の部分を取り除くステップと、
該銅被覆が除去された部分に抵抗ペーストを充填するステップと、
上記抵抗ペーストが充填される銅被覆積層板に回路パターンを形成するステップと、
を含むことを特徴とする、埋設抵抗を有する印刷回路基板の製造方法。 - 上記抵抗ペーストを充填するステップは、
充填された抵抗ペーストを乾燥するステップと、
該充填された抵抗ペーストを周辺の銅被覆層の厚さと等しいように研磨加工するステップと、をさらに含むことを特徴とする、請求項1記載の印刷回路基板の製造方法。 - 上記抵抗ペーストを充填するステップは、真空印刷装置によって行われることを特徴とする、請求項1記載の印刷回路基板の製造方法。
- 抵抗ペーストを充填するステップの前に、上記抵抗が挿入される空間の銅被覆内壁に銀、金、ニッケルまたは白金層を形成するステップをさらに含むことを特徴とする、請求項1記載の印刷回路基板の製造方法。
- 回路パターンを形成するステップの前に、埋設抵抗の接点部位に銀、金、ニッケルまたは白金をメッキするステップをさらに含むことを特徴とする、請求項1記載の印刷回路基板の製造方法。
- 抵抗が挿入される空間に対応する、銅被覆積層板の銅被覆の部分を取り除くステップと、
該銅被覆が除去された部分に抵抗ペーストを充填するステップと、
該抵抗ペーストが充填された銅被覆積層板上に金属層をメッキするステップと、
該銅被覆積層板に回路パターンを形成するステップと、
を含むことを特徴とする、埋設抵抗を有する印刷回路基板の製造方法。 - 上記抵抗ペーストを充填するステップは、
該充填された抵抗ペーストを乾燥するステップと、
該充填された抵抗ペーストを他の銅被覆層の厚さと等しいように研磨加工するステップと、
をさらに含むことを特徴とする、請求項6記載の印刷回路基板の製造方法。 - 抵抗ペーストを充填するステップは、真空印刷装置によって行われることを特徴とする、請求項6記載の印刷回路基板の製造方法。
- 抵抗ペーストを充填するステップの前に、該抵抗が挿入される空間の銅被覆内壁に銀、金、ニッケルまたは白金をメッキするステップをさらに含むことを特徴とする、請求項6記載の印刷回路基板の製造方法。
- 抵抗ペースト充填するステップ後に、該埋設抵抗ペーストの接点部位に電気導電度が優れている物質を形成するステップをさらに含むことを特徴とする、請求項6記載の印刷回路基板の製造方法。
- 抵抗が挿入される空間に対応する、銅積層板の部分にメッキ防止パターンを形成するステップと、
該銅被覆積層板をメッキするステップと、
該抵抗が挿入される空間に対応する、銅被覆層の部分をエッチングするためにメッキされた銅被覆の上にエッチング防止パターンを形成するステップと、
該メッキ防止パターンを取り除くステップと、
該銅被覆積層板をエッチングするステップと、
該抵抗が挿入される空間に抵抗ペーストを充填するステップと、
該銅被覆積層板に回路パターンを形成するステップと、
を含むことを特徴とする、埋設抵抗を有する印刷回路基板の製造方法。 - 上記抵抗ペーストを充填するステップは、
該充填された抵抗ペーストを乾燥するステップと、
該充填された抵抗ペーストを他の銅被覆層の厚さと等しいように研磨加工するステップと、
をさらに含むことを特徴とする、請求項11記載の印刷回路基板の製造方法。 - 上記抵抗ペーストを充填するステップは、真空印刷装置によって行われることを特徴とする、請求項11記載の印刷回路基板の製造方法。
- 抵抗ペーストを充填するステップの前に、上記抵抗が挿入される空間の銅被覆内壁に銀、金、ニッケルまたは白金をメッキするステップをさらに含むことを特徴とする、請求項11記載の印刷回路基板の製造方法。
- 回路パターンを形成するステップの前に、埋設抵抗の接点部位に銀、金、ニッケルまたは白金をメッキするステップをさらに含むことを特徴とする、請求項11記載の印刷回路基板の製造方法。
- 抵抗ペーストが充填された銅被覆積層板上に金属材料をメッキするステップをさらに含むことを特徴とする、請求項12記載の印刷回路基板の製造方法。
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KR1020030077949A KR100754065B1 (ko) | 2003-11-05 | 2003-11-05 | 매립된 저항을 갖는 인쇄회로기판 제조 방법 |
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KR100598274B1 (ko) * | 2004-09-01 | 2006-07-07 | 삼성전기주식회사 | 저항 내장형 인쇄회로기판 및 그 제조 방법 |
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CN104582264B (zh) * | 2013-10-14 | 2018-01-26 | 珠海方正科技高密电子有限公司 | 一种制作印刷式器件的方法、印刷盖板以及印刷电路板 |
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- 2004-02-12 JP JP2004035354A patent/JP2005142523A/ja active Pending
- 2004-03-03 CN CNB2004100078623A patent/CN100438723C/zh not_active Expired - Fee Related
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JP2006324477A (ja) * | 2005-05-19 | 2006-11-30 | Toppan Printing Co Ltd | 受動素子内蔵配線板およびその製造方法 |
JP4661351B2 (ja) * | 2005-05-19 | 2011-03-30 | 凸版印刷株式会社 | 受動素子内蔵配線板およびその製造方法 |
JP2014519916A (ja) * | 2011-06-16 | 2014-08-21 | レスメド・リミテッド | 加湿器および層状の加熱エレメント |
US9821135B2 (en) | 2011-06-16 | 2017-11-21 | Resmed Limited | Humidifier and layered heating element |
US10549064B2 (en) | 2011-06-16 | 2020-02-04 | ResMed Pty Ltd | Humidifier and layered heating element |
US10940285B2 (en) | 2011-06-16 | 2021-03-09 | ResMed Pty Ltd | Humidifier and layered heating element |
US11504495B2 (en) | 2011-06-16 | 2022-11-22 | ResMed Pty Ltd | Humidifier and layered heating element |
Also Published As
Publication number | Publication date |
---|---|
CN100438723C (zh) | 2008-11-26 |
US7284317B2 (en) | 2007-10-23 |
US20050175385A1 (en) | 2005-08-11 |
KR100754065B1 (ko) | 2007-08-31 |
KR20050043157A (ko) | 2005-05-11 |
CN1615070A (zh) | 2005-05-11 |
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