CN104582264B - 一种制作印刷式器件的方法、印刷盖板以及印刷电路板 - Google Patents
一种制作印刷式器件的方法、印刷盖板以及印刷电路板 Download PDFInfo
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- CN104582264B CN104582264B CN201310479150.0A CN201310479150A CN104582264B CN 104582264 B CN104582264 B CN 104582264B CN 201310479150 A CN201310479150 A CN 201310479150A CN 104582264 B CN104582264 B CN 104582264B
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- printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Methods (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310479150.0A CN104582264B (zh) | 2013-10-14 | 2013-10-14 | 一种制作印刷式器件的方法、印刷盖板以及印刷电路板 |
Applications Claiming Priority (1)
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CN201310479150.0A CN104582264B (zh) | 2013-10-14 | 2013-10-14 | 一种制作印刷式器件的方法、印刷盖板以及印刷电路板 |
Publications (2)
Publication Number | Publication Date |
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CN104582264A CN104582264A (zh) | 2015-04-29 |
CN104582264B true CN104582264B (zh) | 2018-01-26 |
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CN201310479150.0A Active CN104582264B (zh) | 2013-10-14 | 2013-10-14 | 一种制作印刷式器件的方法、印刷盖板以及印刷电路板 |
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CN (1) | CN104582264B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN85105318A (zh) * | 1985-07-11 | 1987-01-07 | 朱汉雄 | 印刷电阻及其制造方法和用途 |
US5624782A (en) * | 1994-04-14 | 1997-04-29 | E. I. Du Pont De Nemours And Company | Method of manufacturing thick-film resistor elements |
CN1615070A (zh) * | 2003-11-05 | 2005-05-11 | 三星电机株式会社 | 制造具有嵌入电阻的印刷电路板的方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3092471B2 (ja) * | 1994-04-14 | 2000-09-25 | 松下電器産業株式会社 | スクリーン印刷装置及びスクリーン印刷方法 |
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2013
- 2013-10-14 CN CN201310479150.0A patent/CN104582264B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN85105318A (zh) * | 1985-07-11 | 1987-01-07 | 朱汉雄 | 印刷电阻及其制造方法和用途 |
US5624782A (en) * | 1994-04-14 | 1997-04-29 | E. I. Du Pont De Nemours And Company | Method of manufacturing thick-film resistor elements |
CN1615070A (zh) * | 2003-11-05 | 2005-05-11 | 三星电机株式会社 | 制造具有嵌入电阻的印刷电路板的方法 |
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CN104582264A (zh) | 2015-04-29 |
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Address after: Fangzheng PCB Industrial Park, Fushan Industrial Zone, Ganwu Town, Doumen District, Zhuhai City, Guangdong Province, 519070 Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: Fangzheng PCB Industrial Park, Fushan Industrial Zone, Ganwu Town, Doumen District, Zhuhai City, Guangdong Province, 519070 Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20220927 Address after: Fangzheng PCB Industrial Park, Fushan Industrial Zone, Ganwu Town, Doumen District, Zhuhai City, Guangdong Province, 519070 Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Address before: Fangzheng PCB Industrial Park, Fushan Industrial Zone, Ganwu Town, Doumen District, Zhuhai City, Guangdong Province, 519070 Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |
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