JP2019505088A5 - - Google Patents

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JP2019505088A5
JP2019505088A5 JP2018522911A JP2018522911A JP2019505088A5 JP 2019505088 A5 JP2019505088 A5 JP 2019505088A5 JP 2018522911 A JP2018522911 A JP 2018522911A JP 2018522911 A JP2018522911 A JP 2018522911A JP 2019505088 A5 JP2019505088 A5 JP 2019505088A5
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ring
edge
edge ring
electrostatic chuck
disposed
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JP6888007B2 (ja
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JP2018522911A 2016-01-26 2016-12-30 ウェハエッジリングの持ち上げに関する解決 Active JP6888007B2 (ja)

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US201662287038P 2016-01-26 2016-01-26
US62/287,038 2016-01-26
IN201641019009 2016-06-02
IN201641019009 2016-06-02
PCT/US2016/069449 WO2017131927A1 (en) 2016-01-26 2016-12-30 Wafer edge ring lifting solution

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JP2019505088A JP2019505088A (ja) 2019-02-21
JP2019505088A5 true JP2019505088A5 (enExample) 2019-12-26
JP6888007B2 JP6888007B2 (ja) 2021-06-16

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