JP2010529656A5 - - Google Patents
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- Publication number
- JP2010529656A5 JP2010529656A5 JP2010510438A JP2010510438A JP2010529656A5 JP 2010529656 A5 JP2010529656 A5 JP 2010529656A5 JP 2010510438 A JP2010510438 A JP 2010510438A JP 2010510438 A JP2010510438 A JP 2010510438A JP 2010529656 A5 JP2010529656 A5 JP 2010529656A5
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- sacrificial
- plasma
- sacrificial body
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 5
- 230000002093 peripheral effect Effects 0.000 claims 5
- 239000004696 Poly ether ether ketone Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 229920000620 organic polymer Polymers 0.000 claims 4
- 229920002530 polyetherether ketone Polymers 0.000 claims 4
- 239000004952 Polyamide Substances 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 2
- 230000003628 erosive effect Effects 0.000 claims 2
- 229920002647 polyamide Polymers 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 238000001020 plasma etching Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US94151807P | 2007-06-01 | 2007-06-01 | |
| US12/125,335 US20080296261A1 (en) | 2007-06-01 | 2008-05-22 | Apparatus and methods for improving treatment uniformity in a plasma process |
| PCT/US2008/064670 WO2008150739A1 (en) | 2007-06-01 | 2008-05-23 | Apparatus and methods for improving treatment uniformity in a plasma process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010529656A JP2010529656A (ja) | 2010-08-26 |
| JP2010529656A5 true JP2010529656A5 (enExample) | 2011-07-07 |
Family
ID=40086939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010510438A Pending JP2010529656A (ja) | 2007-06-01 | 2008-05-23 | プラズマプロセスの処理均一性を改善する装置及び方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20080296261A1 (enExample) |
| JP (1) | JP2010529656A (enExample) |
| KR (1) | KR20100025515A (enExample) |
| CN (1) | CN101681785B (enExample) |
| DE (1) | DE112008001482T5 (enExample) |
| TW (1) | TW200905777A (enExample) |
| WO (1) | WO2008150739A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101410706B1 (ko) | 2006-08-22 | 2014-06-25 | 노드슨 코포레이션 | 처리 시스템에서 피가공물을 취급하기 위한 장치 및 방법 |
| US8372238B2 (en) | 2008-05-20 | 2013-02-12 | Nordson Corporation | Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes |
| CN102099870A (zh) * | 2008-06-11 | 2011-06-15 | 因特瓦克公司 | 用于在太阳能电池制作中使用的专用注入系统和方法 |
| US8749053B2 (en) * | 2009-06-23 | 2014-06-10 | Intevac, Inc. | Plasma grid implant system for use in solar cell fabrications |
| WO2013070978A2 (en) | 2011-11-08 | 2013-05-16 | Intevac, Inc. | Substrate processing system and method |
| CN103165374B (zh) * | 2011-12-08 | 2017-05-10 | 中微半导体设备(上海)有限公司 | 一种等离子体处理装置及应用于等离子处理装置的边缘环 |
| US9385017B2 (en) * | 2012-08-06 | 2016-07-05 | Nordson Corporation | Apparatus and methods for handling workpieces of different sizes |
| TWI570745B (zh) | 2012-12-19 | 2017-02-11 | 因特瓦克公司 | 用於電漿離子植入之柵極 |
| US20210287884A1 (en) * | 2018-07-30 | 2021-09-16 | Nordson Corporation | Systems for workpiece processing with plasma |
| CN113035680B (zh) * | 2019-12-24 | 2024-06-14 | 中微半导体设备(上海)股份有限公司 | 用于真空设备的调平机构和等离子体处理装置 |
| CN111180370A (zh) * | 2020-02-21 | 2020-05-19 | 北京北方华创微电子装备有限公司 | 晶圆承载托盘及半导体加工设备 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4786359A (en) * | 1987-06-24 | 1988-11-22 | Tegal Corporation | Xenon enhanced plasma etch |
| JPH0373524A (ja) * | 1989-08-14 | 1991-03-28 | Fujitsu Ltd | エッチング方法 |
| US6284093B1 (en) * | 1996-11-29 | 2001-09-04 | Applied Materials, Inc. | Shield or ring surrounding semiconductor workpiece in plasma chamber |
| US20010049196A1 (en) * | 1997-09-09 | 2001-12-06 | Roger Patrick | Apparatus for improving etch uniformity and methods therefor |
| US6074488A (en) * | 1997-09-16 | 2000-06-13 | Applied Materials, Inc | Plasma chamber support having an electrically coupled collar ring |
| US6014979A (en) * | 1998-06-22 | 2000-01-18 | Applied Materials, Inc. | Localizing cleaning plasma for semiconductor processing |
| DE29813326U1 (de) * | 1998-07-29 | 1998-12-10 | PROTEC Gesellschaft für Werkstoff- und Oberflächentechnik mbH, 57234 Wilnsdorf | Verbesserte Vorrichtung zum Schutz von elektrostatischen Haltesystemen in Anlagen zur Bearbeitung von Wafern |
| JP2000299305A (ja) * | 1999-04-16 | 2000-10-24 | Toshiba Corp | プラズマ処理装置 |
| US6344105B1 (en) * | 1999-06-30 | 2002-02-05 | Lam Research Corporation | Techniques for improving etch rate uniformity |
| US6475336B1 (en) * | 2000-10-06 | 2002-11-05 | Lam Research Corporation | Electrostatically clamped edge ring for plasma processing |
| US6391787B1 (en) * | 2000-10-13 | 2002-05-21 | Lam Research Corporation | Stepped upper electrode for plasma processing uniformity |
| US6554954B2 (en) * | 2001-04-03 | 2003-04-29 | Applied Materials Inc. | Conductive collar surrounding semiconductor workpiece in plasma chamber |
| JP2003100713A (ja) * | 2001-09-26 | 2003-04-04 | Kawasaki Microelectronics Kk | プラズマ電極用カバー |
| US6776849B2 (en) * | 2002-03-15 | 2004-08-17 | Asm America, Inc. | Wafer holder with peripheral lift ring |
| KR100610010B1 (ko) * | 2004-07-20 | 2006-08-08 | 삼성전자주식회사 | 반도체 식각 장치 |
| KR100674922B1 (ko) * | 2004-12-02 | 2007-01-26 | 삼성전자주식회사 | 포커스 링을 냉각하는 냉각 유로를 가지는 웨이퍼지지장치 |
| KR101410706B1 (ko) * | 2006-08-22 | 2014-06-25 | 노드슨 코포레이션 | 처리 시스템에서 피가공물을 취급하기 위한 장치 및 방법 |
-
2008
- 2008-05-22 US US12/125,335 patent/US20080296261A1/en not_active Abandoned
- 2008-05-23 CN CN2008800184440A patent/CN101681785B/zh not_active Expired - Fee Related
- 2008-05-23 WO PCT/US2008/064670 patent/WO2008150739A1/en not_active Ceased
- 2008-05-23 KR KR1020097024756A patent/KR20100025515A/ko not_active Withdrawn
- 2008-05-23 DE DE112008001482T patent/DE112008001482T5/de not_active Withdrawn
- 2008-05-23 JP JP2010510438A patent/JP2010529656A/ja active Pending
- 2008-05-30 TW TW097120323A patent/TW200905777A/zh unknown
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