JP2019195015A - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP2019195015A JP2019195015A JP2018088291A JP2018088291A JP2019195015A JP 2019195015 A JP2019195015 A JP 2019195015A JP 2018088291 A JP2018088291 A JP 2018088291A JP 2018088291 A JP2018088291 A JP 2018088291A JP 2019195015 A JP2019195015 A JP 2019195015A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- unit
- cassette
- frame
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012545 processing Methods 0.000 title claims abstract description 58
- 238000001514 detection method Methods 0.000 claims abstract description 86
- 239000013078 crystal Substances 0.000 claims abstract description 11
- 235000012431 wafers Nutrition 0.000 claims description 284
- 238000007689 inspection Methods 0.000 claims description 50
- 238000004364 calculation method Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 230000003028 elevating effect Effects 0.000 claims description 2
- 230000007246 mechanism Effects 0.000 abstract description 18
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000005406 washing Methods 0.000 abstract description 2
- 230000032258 transport Effects 0.000 description 62
- 238000003860 storage Methods 0.000 description 58
- 238000012546 transfer Methods 0.000 description 28
- 238000004140 cleaning Methods 0.000 description 24
- 238000005520 cutting process Methods 0.000 description 20
- 238000010586 diagram Methods 0.000 description 18
- 238000003754 machining Methods 0.000 description 6
- 238000009530 blood pressure measurement Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
2 基板
2O 中心
7 フレーム(環状フレーム)
7a 開口
8 粘着テープ
9 フレームユニット
10 チャックテーブル
11A 保持面
13 仮置きレール(仮置き領域)
20 切削ユニット(加工ユニット)
30 カセット
30A ウエーハカセット
30B フレームカセット
40 カセット載置機構
41 検査用収容部
41A 第1開口
41B カセット載置台
41D 第2開口
60 カセット搬送部(搬送ユニット)
64 搬送アーム
64A バキュームパッド
65 把持部
67 ウエーハ搬送アーム
68 駆動部
70 洗浄搬送部(搬送ユニット)
75 保持部
75A 吸引パッド(ウエーハ保持部)
75B バキュームパッド(フレーム保持部)
80 検出ユニット
82 検出テーブル
82O 中心
83 センサフレーム
84 発光部(センサー部)
85 受光部(センサー部)
86 隙間
90 制御ユニット
91 回転制御部
92 算出部(算出ユニット)
100 加工装置
101 基台
101A 上面
110 収容箱本体
111 底板
113 支持トレー
114 ガイドレール
115 スライドレール(スライダ)
Claims (5)
- ウエーハを加工する加工装置であって、
ウエーハを保持面で保持するチャックテーブルと、該チャックテーブルに保持されたウエーハを加工する加工ユニットと、該チャックテーブルを該保持面と平行な方向に加工送りする加工送りユニットと、ウエーハを収容するカセットが載置される昇降可能なカセット載置台と、ウエーハの結晶方位を示す切り欠きの向きを検出する検出ユニットと、該カセット載置台に載置された該カセットからウエーハを搬出して該チャックテーブルに搬入する搬送ユニットと、を備え、
該検出ユニットは、
ウエーハを保持すると共に、該ウエーハより小径な検出テーブルと、
該検出テーブルに保持されたウエーハの外周に設けられて該切り欠きを検出するセンサー部と、
該検出テーブルを回転させて検出した該切り欠きを所定の方向に向ける回転制御部と、を備え、
該検出テーブルは、該搬送ユニットが該カセットから該ウエーハを搬出した搬送経路に設けられる加工装置。 - 該検出テーブルの中心と該カセットとの距離は該ウエーハの半径より小さく、該検出テーブルに保持された該ウエーハの一部が該カセットに入ったままの状態で該切り欠きが検出される請求項1に記載の加工装置。
- 該検出ユニットは、該センサー部が検出する該ウエーハの外周縁の位置からウエーハの中心と該検出テーブルの中心との距離を算出する算出ユニットを備え、
該算出ユニットは、該ウエーハの該切り欠きを該所定の方向に向けた状態での該ウエーハの中心と該検出テーブルの中心との距離を算出し、
該搬送ユニットは、該チャックテーブルの中心に該ウエーハの中心を位置付けるよう、算出された該距離に基づいて移動距離を調整する請求項1又は2に記載の加工装置。 - 該カセットは、ウエーハを直接支持するウエーハカセットと、環状フレームの開口にウエーハが粘着テープで支持されたフレームユニットを収容するフレームカセットとから選択されて該カセット載置台に載置され、
該搬送ユニットは、該ウエーハを吸引保持するウエーハ保持部と、該フレームユニットの該環状フレームを保持するフレーム保持部とを有し、
該フレームカセットから搬出された該フレームユニットを該チャックテーブルに搬入する前に仮置きする仮置き領域を更に備える請求項1から3のいずれか一項に記載の加工装置。 - 該カセット載置台の下側に設けられ、該カセット載置台と共に昇降し、検査用のウエーハ又はフレームユニットが仮置きされる検査用収容部、を備え、
該検査用収容部は、該搬送ユニットによって水平に搬入される該ウエーハ又は該フレームユニットを支持する支持トレーと、該支持トレーを該カセット載置台の下方から引出可能に支持するスライダと、を備えることを特徴とする、請求項1から4のいずれか一項に記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018088291A JP7061012B2 (ja) | 2018-05-01 | 2018-05-01 | 加工装置 |
CN201910342624.4A CN110429043B (zh) | 2018-05-01 | 2019-04-26 | 加工装置 |
KR1020190049823A KR102633607B1 (ko) | 2018-05-01 | 2019-04-29 | 가공 장치 |
TW108115072A TWI785238B (zh) | 2018-05-01 | 2019-04-30 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018088291A JP7061012B2 (ja) | 2018-05-01 | 2018-05-01 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019195015A true JP2019195015A (ja) | 2019-11-07 |
JP7061012B2 JP7061012B2 (ja) | 2022-04-27 |
Family
ID=68408413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018088291A Active JP7061012B2 (ja) | 2018-05-01 | 2018-05-01 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7061012B2 (ja) |
KR (1) | KR102633607B1 (ja) |
CN (1) | CN110429043B (ja) |
TW (1) | TWI785238B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112509960A (zh) * | 2020-11-09 | 2021-03-16 | 太极半导体(苏州)有限公司 | 一种3d晶圆环切后的定位方法 |
CN112658476A (zh) * | 2021-01-11 | 2021-04-16 | 宿迁学院 | 一种板式激光切割机工作台自动化清理装置 |
CN115148651A (zh) * | 2022-08-01 | 2022-10-04 | 弥费实业(上海)有限公司 | 晶圆盒交换传输设备及其驱动装置、存储库 |
JP7479244B2 (ja) | 2020-08-18 | 2024-05-08 | 株式会社ディスコ | 加工装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110224052B (zh) * | 2019-05-28 | 2024-02-06 | 深圳新益昌科技股份有限公司 | 一种led固晶的双摆臂固晶装置及其固晶方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07263518A (ja) * | 1994-03-18 | 1995-10-13 | Fujitsu Ltd | 半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置 |
JP2003163253A (ja) * | 2001-11-28 | 2003-06-06 | Disco Abrasive Syst Ltd | 切削装置 |
JP2005045134A (ja) * | 2003-07-25 | 2005-02-17 | Disco Abrasive Syst Ltd | 半導体ウエーハの加工装置 |
JP2009105109A (ja) * | 2007-10-22 | 2009-05-14 | Disco Abrasive Syst Ltd | ワーク収納搬送装置及び該ワーク収納搬送装置を備えた切削装置 |
JP2014060224A (ja) * | 2012-09-14 | 2014-04-03 | Disco Abrasive Syst Ltd | 加工装置 |
JP2015119003A (ja) * | 2013-12-17 | 2015-06-25 | 株式会社ディスコ | 加工装置 |
JP2015170719A (ja) * | 2014-03-06 | 2015-09-28 | 株式会社ディスコ | 板状物の搬送装置および切削装置 |
JP2015228403A (ja) * | 2014-05-30 | 2015-12-17 | 株式会社ディスコ | 加工装置 |
JP2016152394A (ja) * | 2015-02-19 | 2016-08-22 | 株式会社ディスコ | 加工装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4303041B2 (ja) * | 2003-06-18 | 2009-07-29 | 株式会社ディスコ | 半導体ウエーハの加工装置 |
JPWO2006025386A1 (ja) * | 2004-08-31 | 2008-05-08 | 株式会社ニコン | 位置合わせ方法、処理システム、基板の投入再現性計測方法、位置計測方法、露光方法、基板処理装置、計測方法及び計測装置 |
JP4918537B2 (ja) * | 2008-12-11 | 2012-04-18 | 日東電工株式会社 | 半導体ウエハの保護テープ剥離方法および保護テープ剥離装置 |
JP5582152B2 (ja) * | 2012-02-03 | 2014-09-03 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及び記憶媒体 |
JP5959216B2 (ja) * | 2012-02-06 | 2016-08-02 | 日東電工株式会社 | 基板搬送方法および基板搬送装置 |
JP6202962B2 (ja) * | 2013-09-20 | 2017-09-27 | 株式会社ディスコ | 切削装置 |
KR101682468B1 (ko) * | 2015-11-13 | 2016-12-05 | 주식회사 이오테크닉스 | 웨이퍼 정렬방법 및 이를 이용한 정렬장비 |
JP6672053B2 (ja) * | 2016-04-18 | 2020-03-25 | 株式会社ディスコ | ウェーハの加工方法 |
-
2018
- 2018-05-01 JP JP2018088291A patent/JP7061012B2/ja active Active
-
2019
- 2019-04-26 CN CN201910342624.4A patent/CN110429043B/zh active Active
- 2019-04-29 KR KR1020190049823A patent/KR102633607B1/ko active IP Right Grant
- 2019-04-30 TW TW108115072A patent/TWI785238B/zh active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07263518A (ja) * | 1994-03-18 | 1995-10-13 | Fujitsu Ltd | 半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置 |
JP2003163253A (ja) * | 2001-11-28 | 2003-06-06 | Disco Abrasive Syst Ltd | 切削装置 |
JP2005045134A (ja) * | 2003-07-25 | 2005-02-17 | Disco Abrasive Syst Ltd | 半導体ウエーハの加工装置 |
JP2009105109A (ja) * | 2007-10-22 | 2009-05-14 | Disco Abrasive Syst Ltd | ワーク収納搬送装置及び該ワーク収納搬送装置を備えた切削装置 |
JP2014060224A (ja) * | 2012-09-14 | 2014-04-03 | Disco Abrasive Syst Ltd | 加工装置 |
JP2015119003A (ja) * | 2013-12-17 | 2015-06-25 | 株式会社ディスコ | 加工装置 |
JP2015170719A (ja) * | 2014-03-06 | 2015-09-28 | 株式会社ディスコ | 板状物の搬送装置および切削装置 |
JP2015228403A (ja) * | 2014-05-30 | 2015-12-17 | 株式会社ディスコ | 加工装置 |
JP2016152394A (ja) * | 2015-02-19 | 2016-08-22 | 株式会社ディスコ | 加工装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7479244B2 (ja) | 2020-08-18 | 2024-05-08 | 株式会社ディスコ | 加工装置 |
CN112509960A (zh) * | 2020-11-09 | 2021-03-16 | 太极半导体(苏州)有限公司 | 一种3d晶圆环切后的定位方法 |
CN112509960B (zh) * | 2020-11-09 | 2024-04-09 | 太极半导体(苏州)有限公司 | 一种3d晶圆环切后的定位方法 |
CN112658476A (zh) * | 2021-01-11 | 2021-04-16 | 宿迁学院 | 一种板式激光切割机工作台自动化清理装置 |
CN115148651A (zh) * | 2022-08-01 | 2022-10-04 | 弥费实业(上海)有限公司 | 晶圆盒交换传输设备及其驱动装置、存储库 |
CN115148651B (zh) * | 2022-08-01 | 2023-05-02 | 弥费科技(上海)股份有限公司 | 晶圆盒交换传输设备及其驱动装置、存储库 |
Also Published As
Publication number | Publication date |
---|---|
TWI785238B (zh) | 2022-12-01 |
TW201946216A (zh) | 2019-12-01 |
KR20190126248A (ko) | 2019-11-11 |
JP7061012B2 (ja) | 2022-04-27 |
CN110429043A (zh) | 2019-11-08 |
KR102633607B1 (ko) | 2024-02-05 |
CN110429043B (zh) | 2024-02-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7061012B2 (ja) | 加工装置 | |
JP7282461B2 (ja) | 検査装置、及び加工装置 | |
CN110429044B (zh) | 切削装置 | |
TWI751354B (zh) | 切割裝置及晶圓的加工方法 | |
JP2006074004A (ja) | ワーク搬送収納装置,およびそのワーク搬送収納装置を備えた切削装置 | |
JP2006021264A (ja) | 研削装置 | |
US10079166B2 (en) | Processing apparatus | |
JP2005011917A (ja) | 半導体ウエーハの加工装置 | |
JP6202962B2 (ja) | 切削装置 | |
JP2009061568A (ja) | 板状物加工用トレイおよび加工装置 | |
JP2022115616A (ja) | 切削装置 | |
JP7362308B2 (ja) | 加工装置 | |
TWI840353B (zh) | 切割裝置 | |
CN113334240A (zh) | 加工装置 | |
JP7436165B2 (ja) | ダイシングユニットの診断方法、及び、ダイシングシステム | |
JP2020102573A (ja) | 搬送装置及び加工装置 | |
JP3222726U (ja) | 切削装置 | |
JP7350454B2 (ja) | 加工装置 | |
KR20230123882A (ko) | 가공 장치 | |
JP2022034480A (ja) | 加工装置 | |
JP2021190591A (ja) | 被加工物の搬送方法 | |
JP2023076058A (ja) | 加工装置 | |
JP2021132119A (ja) | 加工装置 | |
JP2024024360A (ja) | 搬送パッドの高さ記録方法 | |
JP2019018317A (ja) | バイト切削装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210302 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220225 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220322 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220415 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7061012 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |