JP2019004080A - 電子部品、電子装置、及び電子部品の製造方法 - Google Patents
電子部品、電子装置、及び電子部品の製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 238000007747 plating Methods 0.000 claims abstract description 165
- 239000012212 insulator Substances 0.000 claims abstract description 146
- 229910052751 metal Inorganic materials 0.000 claims abstract description 127
- 239000002184 metal Substances 0.000 claims abstract description 127
- 229910000679 solder Inorganic materials 0.000 claims abstract description 35
- 238000002844 melting Methods 0.000 claims abstract description 11
- 230000008018 melting Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 25
- 239000003990 capacitor Substances 0.000 claims description 12
- 239000003870 refractory metal Substances 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 238000010586 diagram Methods 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 9
- 239000007769 metal material Substances 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- 239000002003 electrode paste Substances 0.000 description 7
- 239000011810 insulating material Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 229910002065 alloy metal Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- WEUCVIBPSSMHJG-UHFFFAOYSA-N calcium titanate Chemical compound [O-2].[O-2].[O-2].[Ca+2].[Ti+4] WEUCVIBPSSMHJG-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H01F5/00—Coils
- H01F5/06—Insulation of windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/327—Encapsulating or impregnating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
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- H01—ELECTRIC ELEMENTS
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- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
【解決手段】直方体形状の絶縁体部10と、絶縁体部10の内部に設けられたコイル素子32と、絶縁体部10の下面14に設けられ、コイル素子32に電気的に接続された下面電極40と、下面電極40を覆うと共に、絶縁体部10の下面14における端64が下面電極40の端42から離れて下面電極40に重なって設けられためっき層62と、下面電極40とめっき層62との間に配置されて下面電極40を覆って設けられ、めっき層62よりも高融点金属で構成され且つ半田濡れ性の低いめっき層60と、を備える電子部品。
【選択図】図1
Description
12 上面
14 下面
16 端面
18 側面
30 導体
32 コイル素子
34 引出導体
36 ビアホール導体
38 コンデンサ素子
40 下面電極
42 端
44 上面電極
46 端
50 外部電極
60 めっき層
62 めっき層
64 端
66 端
70 絶縁層
72 端
74 絶縁層
80 回路基板
82 電極
84 半田
90 電極ペースト
92 バレル
94 クラック
96 絶縁層
100〜700 コイル部品
800 コンデンサ部品
900 電子装置
Claims (14)
- 直方体形状の絶縁体部と、
前記絶縁体部の内部に設けられた電子素子と、
前記絶縁体部の第1面に設けられ、前記電子素子に電気的に接続された第1金属層と、
前記第1金属層を覆うと共に、前記絶縁体部の前記第1面における端が前記第1金属層の端から離れて前記第1金属層に重なって設けられた第2金属層と、
前記第1金属層と前記第2金属層との間に配置されて前記第1金属層を覆って設けられ、前記第2金属層よりも高融点金属で構成され且つ半田濡れ性の低い第3金属層と、を備える電子部品。 - 直方体形状の絶縁体部と、
前記絶縁体部の内部に設けられた電子素子と、
前記絶縁体部の第1面に設けられ、前記電子素子に電気的に接続された第1金属層と、
前記第1金属層を覆うと共に、前記絶縁体部の前記第1面における端が前記第1金属層の端から離れて前記第1金属層に重なって設けられ、前記第1金属層よりも低融点金属で構成され且つ半田濡れ性が高い第2金属層と、を備える電子部品。 - 前記第2金属層の前記端は、前記第1金属層の前記端から3μm以上離れて設けられている、請求項1または2記載の電子部品。
- 前記絶縁体部の前記第1面に前記第1金属層の前記端を覆って設けられ、前記第2金属層よりも半田濡れ性が低い絶縁層を備え、
前記第2金属層の前記端は前記絶縁層を介して前記第1金属層に重なっている、請求項1から3のいずれか一項記載の電子部品。 - 前記絶縁体部の前記第1面に1対の前記第1金属層が離間して設けられていて、
前記絶縁層は前記1対の第1金属層の一方から他方にかけて延在している、請求項4記載の電子部品。 - 前記第3金属層は、前記第1金属層全体を覆っている、請求項1記載の電子部品。
- 前記第1金属層の前記端は前記絶縁体部の前記第1面を平面視したときに曲線形状をしている、請求項1から6のいずれか一項記載の電子部品。
- 前記絶縁体部の第2面に設けられ、前記電子素子に電気的に接続された第4金属層を備え、
前記第2金属層は前記第1金属層と前記第4金属層を覆って設けられ、
前記絶縁体部の前記第2面における前記第2金属層の端は前記第4金属層の端から離れて前記第4金属層に重なって設けられている、請求項1から7のいずれか一項記載の電子部品。 - 前記第2金属層は錫めっき層である、請求項1から8のいずれか一項記載の電子部品。
- 前記電子素子は、コイル素子またはコンデンサ素子である、請求項1から9のいずれか一項記載の電子部品。
- 請求項1から10のいずれか一項記載の電子部品と、
前記電子部品の前記第2金属層が半田によって接合された回路基板と、を備える電子装置。 - 直方体形状の絶縁体部の内部に電子素子を形成する工程と、
前記絶縁体部の面に前記電子素子に電気的に接続された第1金属層を形成する工程と、
前記絶縁体部の前記面に前記第1金属層の端を覆う絶縁層を形成する工程と、
前記絶縁層をマスクに、前記第1金属層を覆い、前記第1金属層よりも低融点金属で構成され且つ半田濡れ性が高い第2金属層を形成する工程と、を備える電子部品の製造方法。 - 直方体形状の絶縁体部の内部に電子素子を形成する工程と、
前記絶縁体部の面に前記電子素子に電気的に接続された第1金属層を形成する工程と、
前記絶縁体部の前記面に前記第1金属層の端を覆う絶縁層を形成する工程と、
前記第1金属層を覆う第3金属層を形成する工程と、
前記絶縁層をマスクに、前記第3金属層を覆い、前記第3金属層よりも低融点金属で構成され且つ半田濡れ性が高い第2金属層を形成する工程と、を備える電子部品の製造方法。 - 前記絶縁層を形成する工程は、前記第2金属層の形成において前記第2金属層の端が前記第1金属層の前記端から3μm以上離れて形成されるように前記第1金属層の前記端を覆う前記絶縁層を形成する、請求項12または13記載の電子部品の製造方法。
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US16/002,973 US11087909B2 (en) | 2017-06-16 | 2018-06-07 | Electronic component, electronic apparatus, and method for manufacturing electronic component |
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TWI628678B (zh) * | 2016-04-21 | 2018-07-01 | Tdk 股份有限公司 | 電子零件 |
JP7089426B2 (ja) | 2018-07-23 | 2022-06-22 | 太陽誘電株式会社 | 積層セラミック電子部品、積層セラミック電子部品の製造方法及び電子部品内蔵基板 |
JP7052615B2 (ja) * | 2018-07-25 | 2022-04-12 | 株式会社村田製作所 | コイルアレイ部品 |
JP7159997B2 (ja) * | 2019-08-07 | 2022-10-25 | 株式会社村田製作所 | インダクタ部品 |
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JP7234974B2 (ja) * | 2020-02-27 | 2023-03-08 | 株式会社村田製作所 | 積層セラミック電子部品 |
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