JP2018528107A5 - - Google Patents

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JP2018528107A5
JP2018528107A5 JP2018512552A JP2018512552A JP2018528107A5 JP 2018528107 A5 JP2018528107 A5 JP 2018528107A5 JP 2018512552 A JP2018512552 A JP 2018512552A JP 2018512552 A JP2018512552 A JP 2018512552A JP 2018528107 A5 JP2018528107 A5 JP 2018528107A5
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epoxy resin
weight percent
temperature
optionally
resin
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JP2018512552A
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JP6845226B2 (ja
JP2018528107A (ja
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Priority claimed from PCT/US2016/050043 external-priority patent/WO2017044381A1/en
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JP2018512552A 2015-09-09 2016-09-02 積層造形用エポキシ二重硬化樹脂 Active JP6845226B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201562215944P 2015-09-09 2015-09-09
US62/215,944 2015-09-09
US201562270637P 2015-12-22 2015-12-22
US62/270,637 2015-12-22
US201662369409P 2016-08-01 2016-08-01
US62/369,409 2016-08-01
PCT/US2016/050043 WO2017044381A1 (en) 2015-09-09 2016-09-02 Epoxy dual cure resins for additive manufacturing

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JP2018528107A JP2018528107A (ja) 2018-09-27
JP2018528107A5 true JP2018528107A5 (cg-RX-API-DMAC7.html) 2019-10-10
JP6845226B2 JP6845226B2 (ja) 2021-03-17

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US (2) US10975193B2 (cg-RX-API-DMAC7.html)
EP (1) EP3347399B1 (cg-RX-API-DMAC7.html)
JP (1) JP6845226B2 (cg-RX-API-DMAC7.html)
CN (1) CN108291011B (cg-RX-API-DMAC7.html)
WO (1) WO2017044381A1 (cg-RX-API-DMAC7.html)

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