JP2008540778A5 - - Google Patents

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Publication number
JP2008540778A5
JP2008540778A5 JP2008511437A JP2008511437A JP2008540778A5 JP 2008540778 A5 JP2008540778 A5 JP 2008540778A5 JP 2008511437 A JP2008511437 A JP 2008511437A JP 2008511437 A JP2008511437 A JP 2008511437A JP 2008540778 A5 JP2008540778 A5 JP 2008540778A5
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JP
Japan
Prior art keywords
polymer
conductive filler
polymer resin
light
syrup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008511437A
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English (en)
Japanese (ja)
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JP2008540778A (ja
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Publication date
Priority claimed from KR1020050040155A external-priority patent/KR100608533B1/ko
Application filed filed Critical
Publication of JP2008540778A publication Critical patent/JP2008540778A/ja
Publication of JP2008540778A5 publication Critical patent/JP2008540778A5/ja
Withdrawn legal-status Critical Current

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JP2008511437A 2005-05-13 2006-05-15 導電性ポリマー樹脂とその製造方法 Withdrawn JP2008540778A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050040155A KR100608533B1 (ko) 2005-05-13 2005-05-13 전기 전도성이 우수한 고분자 수지 및 그 제조방법
PCT/US2006/018584 WO2006124694A1 (en) 2005-05-13 2006-05-15 Electrically conductive polymer resin and method for making same

Publications (2)

Publication Number Publication Date
JP2008540778A JP2008540778A (ja) 2008-11-20
JP2008540778A5 true JP2008540778A5 (cg-RX-API-DMAC7.html) 2009-07-02

Family

ID=36930677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008511437A Withdrawn JP2008540778A (ja) 2005-05-13 2006-05-15 導電性ポリマー樹脂とその製造方法

Country Status (10)

Country Link
US (2) US8975004B2 (cg-RX-API-DMAC7.html)
EP (1) EP1880394A1 (cg-RX-API-DMAC7.html)
JP (1) JP2008540778A (cg-RX-API-DMAC7.html)
KR (1) KR100608533B1 (cg-RX-API-DMAC7.html)
CN (1) CN101176169B (cg-RX-API-DMAC7.html)
BR (1) BRPI0609629A2 (cg-RX-API-DMAC7.html)
CA (1) CA2608223A1 (cg-RX-API-DMAC7.html)
MX (1) MX2007013979A (cg-RX-API-DMAC7.html)
TW (1) TWI386952B (cg-RX-API-DMAC7.html)
WO (1) WO2006124694A1 (cg-RX-API-DMAC7.html)

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JP6749698B2 (ja) * 2015-09-04 2020-09-02 国立研究開発法人科学技術振興機構 コネクタ基板、センサーシステム及びウェアラブルなセンサーシステム
TWI738735B (zh) 2016-05-27 2021-09-11 德商漢高智慧財產控股公司 藉由毛細流動以於電子封裝中進行間隙塗覆及／或於其中或其間充填的組合物及其使用方法
WO2018092798A1 (ja) * 2016-11-18 2018-05-24 矢崎総業株式会社 回路体形成方法及び回路体
ES2984843T3 (es) 2017-12-14 2024-10-31 Avery Dennison Corp Adhesivo sensible a la presión con un amplio intervalo de temperaturas y frecuencias de amortiguación
JP2020019876A (ja) * 2018-07-31 2020-02-06 株式会社ダイセル 成形体およびその製造方法
WO2020227881A1 (en) * 2019-05-13 2020-11-19 3M Innovative Properties Company Electrically conductive multilayer film and gasket
CN117417597A (zh) * 2019-05-29 2024-01-19 花王株式会社 热塑性树脂组合物
KR20220146567A (ko) * 2020-02-26 2022-11-01 티코나 엘엘씨 전자 디바이스
KR20220147110A (ko) 2020-02-26 2022-11-02 티코나 엘엘씨 전자 디바이스를 위한 중합체 조성물
WO2022023830A1 (en) * 2020-07-29 2022-02-03 3M Innovative Properties Company Electrically conductive adhesive film

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KR20080004021A (ko) 2006-07-04 2008-01-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법
KR101269741B1 (ko) 2006-07-04 2013-05-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 탄성 및 접착성을 갖는 전자기파 차단용 가스켓
KR20090054198A (ko) 2007-11-26 2009-05-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 점착 시트의 제조방법 및 이에 의한 점착 시트
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