JP2018182179A - デバイスチップの製造方法 - Google Patents
デバイスチップの製造方法 Download PDFInfo
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- JP2018182179A JP2018182179A JP2017082561A JP2017082561A JP2018182179A JP 2018182179 A JP2018182179 A JP 2018182179A JP 2017082561 A JP2017082561 A JP 2017082561A JP 2017082561 A JP2017082561 A JP 2017082561A JP 2018182179 A JP2018182179 A JP 2018182179A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 238000002161 passivation Methods 0.000 claims abstract description 68
- 239000007789 gas Substances 0.000 claims abstract description 44
- 238000001020 plasma etching Methods 0.000 claims abstract description 35
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 18
- 239000011737 fluorine Substances 0.000 claims abstract description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000001301 oxygen Substances 0.000 claims abstract description 13
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000003507 refrigerant Substances 0.000 description 14
- 230000001681 protective effect Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 244000309466 calf Species 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Dicing (AREA)
- Drying Of Semiconductors (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
11a 表面
11b 裏面
11c 溝
11d カーフ(切り口)
13 分割予定ライン(ストリート)
15 デバイス
17 パシベーション膜
17a パシベーション膜
17b 一部
19 ダイアタッチフィルム
21 ダイシングテープ
23 フレーム
25 デバイスチップ
27 ダイアタッチフィルム
2 レーザー照射ユニット
2a レーザービーム
4 切削ブレード
6 プラズマエッチング装置
8 処理空間
10 真空チャンバ
10a 底壁
10b 上壁
10c 第1側壁
10d 第2側壁
10e 第3側壁
12 開口
14 ゲート
16 開閉機構
18 エアシリンダ
20 ピストンロッド
22 ブラケット
24 排気口
26 排気ユニット
28 下部電極
30 上部電極
32 保持部
34 支持部
36 開口
38 絶縁部材
40 高周波電源
42 テーブル
42a 吸引路
42b 電極
44 吸引路
46 吸引源
48 冷却流路
50 冷媒導入路
52 冷媒循環ユニット
54 冷媒排出路
56 ガス噴出部
58 支持部
60 開口
62 絶縁部材
64 高周波電源
66 昇降機構
68 支持アーム
70 噴出口
72 ガス流路
74 ガス流路
76 SF6供給源
78 C4F8供給源
80 O2供給源
82 制御ユニット
Claims (4)
- 格子状に設定された分割予定ラインによって区画される表面側の各領域にデバイスを有し、該デバイスを覆うパシベーション膜が該表面側に形成されたウェーハを加工して該デバイスに対応する複数のデバイスチップを製造するデバイスチップの製造方法であって、
該分割予定ラインに沿って該パシベーション膜を除去するパシベーション膜除去ステップと、
ウェーハの裏面にダイアタッチフィルムを貼るとともに、環状のフレームに装着されたダイシングテープに該ダイアタッチフィルムを介して該ウェーハを支持させるウェーハ支持ステップと、
該パシベーション膜除去ステップと該ウェーハ支持ステップとを実施した後、該パシベーション膜をマスクとして該ウェーハの該表面側からフッ素系ガスを用いるプラズマエッチングを施し、該ウェーハを該分割予定ラインに沿って個々のデバイスチップに分割するとともに、該分割予定ラインに沿って該ダイアタッチフィルムを露出させるウェーハ分割ステップと、
該ウェーハ分割ステップを実施した後、該パシベーション膜をマスクとして該ウェーハの該表面側から酸素系ガスを用いるプラズマエッチングを施し、該ダイアタッチフィルムの該分割予定ラインに沿う一部又は全部を除去するダイアタッチフィルム除去ステップと、を備えることを特徴とするデバイスチップの製造方法。 - 該パシベーション膜除去ステップでは、該ウェーハに対して吸収性を有する波長のレーザービームを該分割予定ラインに沿って照射し、該ウェーハの該表面側に溝を形成することで、該分割予定ラインに沿って該パシベーション膜を除去することを特徴とする請求項1に記載のデバイスチップの製造方法。
- 該パシベーション膜除去ステップでは、切削ブレードを該分割予定ラインに沿って切り込ませ、該ウェーハの該表面側に溝を形成することで、該分割予定ラインに沿って該パシベーション膜を除去することを特徴とする請求項1に記載のデバイスチップの製造方法。
- 該ダイシングテープは伸張性を有し、
該ダイアタッチフィルム除去ステップを実施した後、該ダイシングテープを伸張することで、該ダイアタッチフィルムを該分割予定ラインに沿って破断するダイアタッチフィルム破断ステップを更に備えることを特徴とする請求項1から請求項3のいずれかに記載のデバイスチップの製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017082561A JP6903375B2 (ja) | 2017-04-19 | 2017-04-19 | デバイスチップの製造方法 |
TW107108548A TWI744503B (zh) | 2017-04-19 | 2018-03-14 | 元件晶片之製造方法 |
SG10201802809TA SG10201802809TA (en) | 2017-04-19 | 2018-04-04 | Device chip manufacturing method |
CN201810324299.4A CN108735667B (zh) | 2017-04-19 | 2018-04-12 | 器件芯片的制造方法 |
KR1020180043543A KR102512596B1 (ko) | 2017-04-19 | 2018-04-13 | 디바이스 칩의 제조 방법 |
US15/955,953 US10468303B2 (en) | 2017-04-19 | 2018-04-18 | Device chip manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2017082561A JP6903375B2 (ja) | 2017-04-19 | 2017-04-19 | デバイスチップの製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2018182179A true JP2018182179A (ja) | 2018-11-15 |
JP6903375B2 JP6903375B2 (ja) | 2021-07-14 |
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JP2017082561A Active JP6903375B2 (ja) | 2017-04-19 | 2017-04-19 | デバイスチップの製造方法 |
Country Status (6)
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---|---|
US (1) | US10468303B2 (ja) |
JP (1) | JP6903375B2 (ja) |
KR (1) | KR102512596B1 (ja) |
CN (1) | CN108735667B (ja) |
SG (1) | SG10201802809TA (ja) |
TW (1) | TWI744503B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6994646B2 (ja) * | 2018-01-17 | 2022-01-14 | パナソニックIpマネジメント株式会社 | 素子チップの製造方法 |
TWI776026B (zh) * | 2018-06-04 | 2022-09-01 | 美商帕斯馬舍門有限責任公司 | 切割晶粒附接膜的方法 |
JP7281709B2 (ja) * | 2019-05-30 | 2023-05-26 | パナソニックIpマネジメント株式会社 | 素子チップの製造方法 |
JP2022082361A (ja) * | 2020-11-20 | 2022-06-01 | パナソニックIpマネジメント株式会社 | 素子チップの製造方法、およびプラズマ処理方法 |
TWI771893B (zh) * | 2021-02-03 | 2022-07-21 | 國立陽明交通大學 | 陣列式晶片的切割方法 |
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JP2008193034A (ja) * | 2007-02-08 | 2008-08-21 | Matsushita Electric Ind Co Ltd | 半導体チップの製造方法 |
JP2014127570A (ja) * | 2012-12-26 | 2014-07-07 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2016207921A (ja) * | 2015-04-27 | 2016-12-08 | 株式会社ディスコ | ウエーハの分割方法 |
JP2017073439A (ja) * | 2015-10-06 | 2017-04-13 | 株式会社ディスコ | デバイスの製造方法 |
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JP2006114825A (ja) * | 2004-10-18 | 2006-04-27 | Disco Abrasive Syst Ltd | ウェーハの分割方法 |
JP5224837B2 (ja) | 2008-02-01 | 2013-07-03 | 株式会社東芝 | 基板のプラズマ処理装置及びプラズマ処理方法 |
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US20150011073A1 (en) * | 2013-07-02 | 2015-01-08 | Wei-Sheng Lei | Laser scribing and plasma etch for high die break strength and smooth sidewall |
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2017
- 2017-04-19 JP JP2017082561A patent/JP6903375B2/ja active Active
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2018
- 2018-03-14 TW TW107108548A patent/TWI744503B/zh active
- 2018-04-04 SG SG10201802809TA patent/SG10201802809TA/en unknown
- 2018-04-12 CN CN201810324299.4A patent/CN108735667B/zh active Active
- 2018-04-13 KR KR1020180043543A patent/KR102512596B1/ko active IP Right Grant
- 2018-04-18 US US15/955,953 patent/US10468303B2/en active Active
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JP2008193034A (ja) * | 2007-02-08 | 2008-08-21 | Matsushita Electric Ind Co Ltd | 半導体チップの製造方法 |
JP2014127570A (ja) * | 2012-12-26 | 2014-07-07 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2016207921A (ja) * | 2015-04-27 | 2016-12-08 | 株式会社ディスコ | ウエーハの分割方法 |
JP2017073439A (ja) * | 2015-10-06 | 2017-04-13 | 株式会社ディスコ | デバイスの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
SG10201802809TA (en) | 2018-11-29 |
KR102512596B1 (ko) | 2023-03-21 |
US10468303B2 (en) | 2019-11-05 |
CN108735667A (zh) | 2018-11-02 |
TW201903872A (zh) | 2019-01-16 |
CN108735667B (zh) | 2023-12-15 |
KR20180117545A (ko) | 2018-10-29 |
TWI744503B (zh) | 2021-11-01 |
US20180308755A1 (en) | 2018-10-25 |
JP6903375B2 (ja) | 2021-07-14 |
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