JP2017517900A5 - - Google Patents
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- JP2017517900A5 JP2017517900A5 JP2017501124A JP2017501124A JP2017517900A5 JP 2017517900 A5 JP2017517900 A5 JP 2017517900A5 JP 2017501124 A JP2017501124 A JP 2017501124A JP 2017501124 A JP2017501124 A JP 2017501124A JP 2017517900 A5 JP2017517900 A5 JP 2017517900A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- composition
- colloidal silica
- abrasive particles
- silica abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 claims 17
- 239000002245 particle Substances 0.000 claims 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 15
- 238000005296 abrasive Methods 0.000 claims 11
- 239000008119 colloidal silica Substances 0.000 claims 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 8
- 238000005498 polishing Methods 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 239000000969 carrier Substances 0.000 claims 5
- 239000007788 liquid Substances 0.000 claims 5
- 229910052742 iron Inorganic materials 0.000 claims 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims 3
- 239000007800 oxidant agent Substances 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- WNLRTRBMVRJNCN-UHFFFAOYSA-N Adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N Glutaric acid Chemical compound OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims 2
- TXXHDPDFNKHHGW-CCAGOZQPSA-N Muconic acid Natural products OC(=O)\C=C/C=C\C(O)=O TXXHDPDFNKHHGW-CCAGOZQPSA-N 0.000 claims 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N Pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 claims 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N Suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 2
- DZKDPOPGYFUOGI-UHFFFAOYSA-N Tungsten(IV) oxide Chemical compound O=[W]=O DZKDPOPGYFUOGI-UHFFFAOYSA-N 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- XNCSCQSQSGDGES-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]propyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)C(C)CN(CC(O)=O)CC(O)=O XNCSCQSQSGDGES-UHFFFAOYSA-N 0.000 claims 1
- 229960005261 Aspartic Acid Drugs 0.000 claims 1
- BDJRBEYXGGNYIS-UHFFFAOYSA-N Azelaic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims 1
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N Phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 239000001361 adipic acid Substances 0.000 claims 1
- 235000011037 adipic acid Nutrition 0.000 claims 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- -1 amine compound Chemical class 0.000 claims 1
- 235000003704 aspartic acid Nutrition 0.000 claims 1
- 235000015165 citric acid Nutrition 0.000 claims 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N edta Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N fumaric acid Chemical compound OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims 1
- XVOUMQNXTGKGMA-UHFFFAOYSA-N glutaconic acid Chemical compound OC(=O)CC=CC(O)=O XVOUMQNXTGKGMA-UHFFFAOYSA-N 0.000 claims 1
- 239000011976 maleic acid Substances 0.000 claims 1
- 235000006408 oxalic acid Nutrition 0.000 claims 1
- 230000001590 oxidative Effects 0.000 claims 1
- 239000011164 primary particle Substances 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 239000001384 succinic acid Substances 0.000 claims 1
Claims (15)
- 水系液体キャリアと、
前記液体キャリアに分散したコロイダルシリカ研磨粒子であって、30%以上の前記コロイダルシリカ研磨粒子が、3個以上が凝集した一次粒子を含み、少なくとも6mVの永久正電荷を有するコロイダルシリカ研磨粒子と、
鉄含有促進剤と、
酸化剤と
を含む、化学機械研磨組成物。 - 前記鉄含有促進剤が可溶性鉄含有触媒を含む、請求項1に記載の組成物。
- 可溶性鉄含有触媒と結合して、かつ、リン酸、酢酸、フタル酸、クエン酸、アジピン酸、シュウ酸、マロン酸、アスパラギン酸、コハク酸、グルタル酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、マレイン酸、グルタコン酸、ムコン酸、エチレンジアミンテトラ酢酸、プロピレンジアミンテトラ酢酸、及びそれらの混合物からなる群より選択される安定剤をさらに含む、請求項1に記載の組成物。
- 1〜4wt%の前記コロイダルシリカ研磨粒子を含む、請求項1に記載の組成物。
- 水系液体キャリアと、
前記液体キャリアに分散したコロイダルシリカ研磨粒子であって、少なくとも6mVの永久正電荷を有し、30%以上の前記コロイダルシリカ研磨粒子が、3個以上が凝集した一次粒子を含むコロイダルシリカ研磨粒子と、
酸化剤と
を含み、かつ、1〜4wt%の前記コロイダルシリカ研磨粒子を含む、化学機械研磨組成物。 - 前記酸化剤が過酸化水素を含む、請求項1又は5に記載の組成物。
- 3〜4の範囲のpHを有する、請求項1又は5に記載の組成物。
- 1000μS/cm未満の電気伝導率を有する、請求項1又は5に記載の組成物。
- 600μS/cm未満の電気伝導率を有する、請求項1又は5に記載の組成物。
- 前記コロイダルシリカ研磨粒子が40〜70nmの範囲の平均粒子サイズを有する、請求項1又は5に記載の組成物。
- 前記コロイダルシリカ研磨粒子が45〜65nmの範囲の平均粒子サイズを有する、請求項1又は5に記載の組成物。
- 前記液体キャリアに溶解したアミン化合物をさらに含む、請求項1又は5に記載の組成物。
- 前記組成物が3〜4の範囲のpHを有し、1000μS/cm未満の電気伝導率を有し、1〜4wt%の前記コロイダルシリカ研磨粒子を有し、
前記コロイダルシリカ研磨粒子が40〜70nmの範囲の平均粒子サイズを有する、請求項1に記載の組成物。 - タングステン及び二酸化ケイ素の層を含む基材を化学機械研磨する方法であって、
(a)請求項1、7、8及び11のいずれか1項に記載の研磨組成物と前記基材を接触させる工程、
(b)前記基材に対して前記研磨組成物を動かす工程、及び
(c)前記基材をすり減らして前記基材から前記タングステンの一部を除去して、それによって、前記基材を研磨する工程、を含む方法。 - 工程(c)における二酸化ケイ素の除去速度が、工程(c)におけるタングステンの除去速度以上である、請求項14に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/222,086 | 2014-03-21 | ||
US14/222,086 US9309442B2 (en) | 2014-03-21 | 2014-03-21 | Composition for tungsten buffing |
PCT/US2015/021666 WO2015143270A1 (en) | 2014-03-21 | 2015-03-20 | Composition for tungsten buffing |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017517900A JP2017517900A (ja) | 2017-06-29 |
JP2017517900A5 true JP2017517900A5 (ja) | 2018-04-12 |
JP6616394B2 JP6616394B2 (ja) | 2019-12-04 |
Family
ID=54141489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017501124A Active JP6616394B2 (ja) | 2014-03-21 | 2015-03-20 | タングステンのバフ研磨用組成物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9309442B2 (ja) |
EP (1) | EP3120380B1 (ja) |
JP (1) | JP6616394B2 (ja) |
KR (1) | KR102390227B1 (ja) |
CN (1) | CN106133881B (ja) |
TW (1) | TWI535836B (ja) |
WO (1) | WO2015143270A1 (ja) |
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JP5844135B2 (ja) * | 2010-12-24 | 2016-01-13 | 花王株式会社 | 研磨液組成物の製造方法 |
US8366059B2 (en) | 2011-01-06 | 2013-02-05 | GM Global Technology Operations LLC | Position controlled cable guide clip |
KR20150113956A (ko) * | 2013-02-01 | 2015-10-08 | 가부시키가이샤 후지미인코퍼레이티드 | 표면 선택성 연마 조성물 |
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2014
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