JP2016213458A - インプリント装置、基板搬送装置、インプリント方法および物品の製造方法 - Google Patents
インプリント装置、基板搬送装置、インプリント方法および物品の製造方法 Download PDFInfo
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- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
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- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
Description
物品として、例えば、デバイス(半導体デバイス、磁気記憶媒体、液晶表示素子等)、カラーフィルター、またはハードディスク等の製造方法について説明する。かかる製造方法は、インプリント装置を用いてパターンを基板(ウエハ、ガラスプレート、フィルム状基板等)に形成する工程を含む。かかる製造方法は、パターンを形成された基板を処理する工程を更に含む。該処理ステップは、該パターンの残膜を除去するステップを含みうる。また、該パターンをマスクとして基板をエッチングするステップなどの周知の他のステップを含みうる。本実施形態における物品の製造方法は、従来に比べて、物品の性能、品質、生産性および生産コストの少なくとも1つにおいて有利である。
Claims (21)
- 複数の部分領域において互いに異なる吸着力で基板が吸着された状態で、前記基板上のインプリント材と型とを接触させた後の離型を行い、前記インプリント材にパターンを形成するインプリント装置であって、
前記複数の部分領域を備えた基板保持部と、
前記基板保持部に対する基板の位置ずれを示す計測データを取得する取得部を有し、
前記取得した計測データを用いて、前記基板保持部に対して前記パターンが形成される基板の位置決めを行うことを特徴とするインプリント装置。 - 基板の搬送部を有し、前記計測データより求められた位置ずれの補正量に応じて、前記搬送部を移動することにより、前記位置決めを行う請求項1に記載のインプリント装置。
- 前記計測データより求められた位置ずれの補正量に応じて、前記基板保持部を移動することにより、前記位置決めを行う請求項1又は請求項2に記載のインプリント装置。
- 前記計測データは、基板の端部と前記基板保持部とを含む計測領域の画像である請求項1乃至請求項3のいずれか1項に記載のインプリント装置。
- 前記計測データは、基板の端部と前記基板保持部とを含む計測領域の距離データである請求項1乃至請求項3のいずれか1項に記載のインプリント装置。
- 前記計測データの取得に用いられる基板と、前記パターンが形成される基板とは、同じ基板である請求項1乃至請求項5のいずれか1項に記載のインプリント装置。
- 前記計測データの取得に用いられる基板と、前記パターンが形成される基板とは、互いに異なる基板である請求項1乃至請求項5のいずれか1項に記載のインプリント装置。
- 前記パターンが形成される基板が前記基板保持部に搭載されている状態で前記計測データを取得する請求項1乃至請求項7のいずれか1項に記載のインプリント装置。
- 前記計測データは、前記型と前記基板上の前記インプリント材とが接触している領域を含む画像である請求項8に記載のインプリント装置。
- 前記基板の複数のショット領域のうち、当該基板の最外周にある少なくとも1つのショット領域において前記パターンを形成する際に前記計測データを取得する請求項8又は請求項9に記載のインプリント装置。
- 前記型を介して撮像した画像を前記計測データとして取得する請求項8乃至請求項10のいずれか1項に記載のインプリント装置。
- 前記基板の端部と前記基板保持部とを含む計測領域の複数から前記計測データを取得する請求項1乃至請求項11のいずれか1項に記載のインプリント装置。
- 前記基板の円弧形状の接線と前記基板保持部の円弧形状の接線との距離から位置ずれの補正に用いる補正量を求める請求項1乃至請求項12のいずれか1項に記載のインプリント装置。
- 前記基板の円弧形状の円弧上の少なくとも4点と、前記基板保持部の円弧形状の円弧上の少なくとも4点とにおける、互いに平行な接線の組の距離から位置ずれの補正に用いる補正量を求める請求項13に記載のインプリント装置。
- 前記基板保持部を移動する移動部は、第1定盤に設置され、
前記基板を搬送する搬送部は、前記第1定盤と別の第2定盤に設置される
ことを特徴とする、請求項1乃至請求項14のいずれか1項に記載のインプリント装置。 - 前記複数の部分領域のうち前記基板の前記パターンを形成する領域に対応する部分領域の吸着力を他の部分領域の吸着力より弱めた状態で離型を行う請求項1乃至請求項15のいずれか1項に記載のインプリント装置。
- 請求項1に記載のインプリント装置に基板を搬送する基板搬送装置であって、
パターンが形成される基板を前記インプリント装置の前記基板保持部に搬送する際に、前記計測データから求めた補正量に応じて前記位置決めを行うことを特徴とする基板搬送装置。 - 前記基板搬送装置は、前記基板保持部を移動する移動部が設置されている第1定盤とは異なる第2定盤に設置される請求項17に記載の基板搬送装置。
- 複数の部分領域において互いに異なる吸着力で基板が吸着された状態で、前記基板上のインプリント材と型とを接触させた後の離型を行い、前記インプリント材にパターンを形成するインプリント方法において、
前記複数の部分領域を備えた基板保持部に対する基板の位置ずれを検出し、検出結果に基づいて、前記パターンが形成される基板の位置決めを行うことを特徴とするインプリント方法。 - 前記複数の部分領域のうち前記基板の前記パターンを形成する領域に対応する部分領域の吸着力を他の部分領域の吸着力より弱めた状態で離型を行う請求項19に記載のインプリント方法。
- 請求項19乃至請求項20のいずれか1項に記載のインプリント方法を用いて、前記パターンを前記基板に形成する工程と、
前記工程で前記パターンが形成された前記基板を処理する工程と、
を有することを特徴とする物品の製造方法。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2018211967A1 (ja) * | 2017-05-15 | 2018-11-22 | 東京エレクトロン株式会社 | 基板搬出方法 |
JP2019105532A (ja) * | 2017-12-12 | 2019-06-27 | 芝浦メカトロニクス株式会社 | ワーク検出装置、成膜装置及びワーク検出方法 |
WO2021054101A1 (ja) * | 2019-09-19 | 2021-03-25 | 株式会社Screenホールディングス | 基板搬送装置および基板搬送装置のハンドの位置補正方法 |
Families Citing this family (8)
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CN107346093A (zh) * | 2017-08-29 | 2017-11-14 | 无锡英普林纳米科技有限公司 | 一种纳米压印机卡位机构 |
JP6972853B2 (ja) * | 2017-09-28 | 2021-11-24 | 大日本印刷株式会社 | インプリントモールド形成用基板、インプリントモールド形成用ブランクス、およびインプリントモールド、ならびにインプリントモールド形成用ブランクスの製造方法およびインプリントモールドの製造方法 |
JP6938313B2 (ja) * | 2017-09-28 | 2021-09-22 | キヤノン株式会社 | インプリント装置、インプリント方法、インプリント材の配置パターンの決定方法、および物品の製造方法 |
TWI677419B (zh) * | 2018-03-08 | 2019-11-21 | 奇景光電股份有限公司 | 成型裝置與方法 |
CN110323169B (zh) * | 2018-03-28 | 2021-12-21 | 奇景光电股份有限公司 | 成型装置与方法 |
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TWI619145B (zh) | 2018-03-21 |
JP6169218B2 (ja) | 2017-07-26 |
SG10201603103UA (en) | 2016-11-29 |
CN106098540A (zh) | 2016-11-09 |
TW201642317A (zh) | 2016-12-01 |
KR102032018B1 (ko) | 2019-11-08 |
KR20160129766A (ko) | 2016-11-09 |
US10551753B2 (en) | 2020-02-04 |
US20160320716A1 (en) | 2016-11-03 |
CN106098540B (zh) | 2020-05-01 |
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