JP2016207674A - 被加工物の切削加工方法 - Google Patents
被加工物の切削加工方法 Download PDFInfo
- Publication number
- JP2016207674A JP2016207674A JP2015082988A JP2015082988A JP2016207674A JP 2016207674 A JP2016207674 A JP 2016207674A JP 2015082988 A JP2015082988 A JP 2015082988A JP 2015082988 A JP2015082988 A JP 2015082988A JP 2016207674 A JP2016207674 A JP 2016207674A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- support member
- cutting
- resin
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005520 cutting process Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 35
- 229920005989 resin Polymers 0.000 claims abstract description 58
- 239000011347 resin Substances 0.000 claims abstract description 57
- 239000002390 adhesive tape Substances 0.000 claims abstract description 33
- 238000003825 pressing Methods 0.000 claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 11
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 7
- 230000007246 mechanism Effects 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000005385 borate glass Substances 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
11a 表面
11b 裏面
13 デバイス
15 粘着テープ
17 支持部材
17a 表面
17b 裏面
19 樹脂(紫外線硬化型樹脂)
2 押圧固定装置
4 基台
6 ステージ
8 光源
10 シャッター
12 フィルタ
14 排気管
16 支持構造
16a 柱部
16b 庇部
18 押圧機構
20 主ロッド
22 副ロッド
24 押圧プレート
32 切削装置
34 切削ユニット
36 スピンドル
38 切削ブレード
Claims (3)
- 被加工物の切削加工方法であって、
被加工物の表面又は裏面に粘着テープを貼着する貼着工程と、
支持部材の表面又は裏面に液状の樹脂を塗布する塗布工程と、
該樹脂と該粘着テープとが接するように該支持部材に該被加工物を重ねた状態で、該被加工物又は該支持部材を押圧する押圧工程と、
該樹脂を硬化させて該被加工物を該支持部材に固定する固定工程と、
該支持部材に固定された該被加工物を切削ブレードで切削加工する切削工程と、を備えることを特徴とする被加工物の切削加工方法。 - 被加工物の切削加工方法であって、
被加工物の表面又は裏面に粘着テープを貼着する貼着工程と、
被加工物に貼着された該粘着テープに液状の樹脂を塗布する塗布工程と、
支持部材の表面又は裏面と該樹脂とが接するように該支持部材に該被加工物を重ねた状態で、該被加工物又は該支持部材を押圧する押圧工程と、
該樹脂を硬化させて該被加工物を該支持部材に固定する固定工程と、
該支持部材に固定された該被加工物を切削ブレードで切削加工する切削工程と、を備えることを特徴とする被加工物の切削加工方法。 - 該樹脂として、紫外線によって硬化する紫外線硬化型樹脂を用いることを特徴とする請求項1又は請求項2記載の被加工物の切削加工方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015082988A JP6486176B2 (ja) | 2015-04-15 | 2015-04-15 | 被加工物の切削加工方法 |
TW105105709A TWI685556B (zh) | 2015-04-15 | 2016-02-25 | 被加工物的切割加工方法 |
KR1020160033882A KR102379433B1 (ko) | 2015-04-15 | 2016-03-22 | 피가공물의 절삭 가공 방법 |
DE102016206056.2A DE102016206056A1 (de) | 2015-04-15 | 2016-04-12 | Schneidverfahren für ein Werkstück |
CN201610223718.6A CN106057718B (zh) | 2015-04-15 | 2016-04-12 | 被加工物的切削加工方法 |
US15/098,902 US9633887B2 (en) | 2015-04-15 | 2016-04-14 | Workpiece cutting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015082988A JP6486176B2 (ja) | 2015-04-15 | 2015-04-15 | 被加工物の切削加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016207674A true JP2016207674A (ja) | 2016-12-08 |
JP6486176B2 JP6486176B2 (ja) | 2019-03-20 |
Family
ID=57043764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015082988A Active JP6486176B2 (ja) | 2015-04-15 | 2015-04-15 | 被加工物の切削加工方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9633887B2 (ja) |
JP (1) | JP6486176B2 (ja) |
KR (1) | KR102379433B1 (ja) |
CN (1) | CN106057718B (ja) |
DE (1) | DE102016206056A1 (ja) |
TW (1) | TWI685556B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020035918A (ja) * | 2018-08-30 | 2020-03-05 | 株式会社ディスコ | 被加工物の加工方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7187112B2 (ja) * | 2018-08-13 | 2022-12-12 | 株式会社ディスコ | キャリア板の除去方法 |
JP7242268B2 (ja) * | 2018-11-30 | 2023-03-20 | 株式会社ディスコ | ダイシング装置 |
Citations (9)
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JP2007088292A (ja) * | 2005-09-22 | 2007-04-05 | Fujifilm Corp | 板状部材の切断方法 |
JP2008306049A (ja) * | 2007-06-08 | 2008-12-18 | Lintec Corp | 脆質部材の処理方法 |
JP2011151355A (ja) * | 2009-12-22 | 2011-08-04 | Furukawa Electric Co Ltd:The | 半導体ウエハ表面保護用粘着テープ |
JP2011222877A (ja) * | 2010-04-14 | 2011-11-04 | Okamoto Machine Tool Works Ltd | バンプ付き基板用チャックおよびそれを用いてバンプ付き基板の裏面を研削加工する方法 |
JP2012074452A (ja) * | 2010-09-28 | 2012-04-12 | Sumitomo Bakelite Co Ltd | 半導体用フィルムおよび半導体装置の製造方法 |
JP2013041973A (ja) * | 2011-08-15 | 2013-02-28 | Disco Abrasive Syst Ltd | 板状物の研削方法 |
JP2014107339A (ja) * | 2012-11-26 | 2014-06-09 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
JP2014157909A (ja) * | 2013-02-15 | 2014-08-28 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置の製造方法 |
JP2015050268A (ja) * | 2013-08-30 | 2015-03-16 | 富士フイルム株式会社 | 積層体及びその応用 |
Family Cites Families (11)
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JP2002158276A (ja) * | 2000-11-20 | 2002-05-31 | Hitachi Chem Co Ltd | ウエハ貼着用粘着シートおよび半導体装置 |
JP2002226796A (ja) * | 2001-01-29 | 2002-08-14 | Hitachi Chem Co Ltd | ウェハ貼着用粘着シート及び半導体装置 |
JP2004296839A (ja) * | 2003-03-27 | 2004-10-21 | Kansai Paint Co Ltd | 半導体チップの製造方法 |
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JP2005209940A (ja) * | 2004-01-23 | 2005-08-04 | Lintec Corp | 半導体装置の製造方法 |
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JP5324212B2 (ja) | 2008-12-26 | 2013-10-23 | 株式会社ディスコ | 樹脂被覆方法および樹脂被覆装置 |
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JP5600035B2 (ja) * | 2010-06-30 | 2014-10-01 | 株式会社ディスコ | ウエーハの分割方法 |
JP2014135424A (ja) * | 2013-01-11 | 2014-07-24 | Disco Abrasive Syst Ltd | ウエーハ切断方法 |
-
2015
- 2015-04-15 JP JP2015082988A patent/JP6486176B2/ja active Active
-
2016
- 2016-02-25 TW TW105105709A patent/TWI685556B/zh active
- 2016-03-22 KR KR1020160033882A patent/KR102379433B1/ko active IP Right Grant
- 2016-04-12 CN CN201610223718.6A patent/CN106057718B/zh active Active
- 2016-04-12 DE DE102016206056.2A patent/DE102016206056A1/de active Pending
- 2016-04-14 US US15/098,902 patent/US9633887B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007088292A (ja) * | 2005-09-22 | 2007-04-05 | Fujifilm Corp | 板状部材の切断方法 |
JP2008306049A (ja) * | 2007-06-08 | 2008-12-18 | Lintec Corp | 脆質部材の処理方法 |
JP2011151355A (ja) * | 2009-12-22 | 2011-08-04 | Furukawa Electric Co Ltd:The | 半導体ウエハ表面保護用粘着テープ |
JP2011222877A (ja) * | 2010-04-14 | 2011-11-04 | Okamoto Machine Tool Works Ltd | バンプ付き基板用チャックおよびそれを用いてバンプ付き基板の裏面を研削加工する方法 |
JP2012074452A (ja) * | 2010-09-28 | 2012-04-12 | Sumitomo Bakelite Co Ltd | 半導体用フィルムおよび半導体装置の製造方法 |
JP2013041973A (ja) * | 2011-08-15 | 2013-02-28 | Disco Abrasive Syst Ltd | 板状物の研削方法 |
JP2014107339A (ja) * | 2012-11-26 | 2014-06-09 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
JP2014157909A (ja) * | 2013-02-15 | 2014-08-28 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置の製造方法 |
JP2015050268A (ja) * | 2013-08-30 | 2015-03-16 | 富士フイルム株式会社 | 積層体及びその応用 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2020035918A (ja) * | 2018-08-30 | 2020-03-05 | 株式会社ディスコ | 被加工物の加工方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106057718A (zh) | 2016-10-26 |
TWI685556B (zh) | 2020-02-21 |
DE102016206056A1 (de) | 2016-10-20 |
CN106057718B (zh) | 2021-12-07 |
JP6486176B2 (ja) | 2019-03-20 |
US20160307789A1 (en) | 2016-10-20 |
KR20160123225A (ko) | 2016-10-25 |
US9633887B2 (en) | 2017-04-25 |
TW201638257A (zh) | 2016-11-01 |
KR102379433B1 (ko) | 2022-03-28 |
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