JP2016162818A - 搬送室 - Google Patents
搬送室 Download PDFInfo
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- JP2016162818A JP2016162818A JP2015038388A JP2015038388A JP2016162818A JP 2016162818 A JP2016162818 A JP 2016162818A JP 2015038388 A JP2015038388 A JP 2015038388A JP 2015038388 A JP2015038388 A JP 2015038388A JP 2016162818 A JP2016162818 A JP 2016162818A
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- 238000012546 transfer Methods 0.000 title claims abstract description 109
- 239000000126 substance Substances 0.000 claims abstract description 171
- 239000012298 atmosphere Substances 0.000 claims abstract description 23
- 238000000926 separation method Methods 0.000 claims abstract description 21
- 238000012545 processing Methods 0.000 claims description 71
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 29
- 238000010926 purge Methods 0.000 claims description 12
- 238000004904 shortening Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 235
- 235000012431 wafers Nutrition 0.000 description 26
- 238000001514 detection method Methods 0.000 description 16
- 239000002245 particle Substances 0.000 description 7
- 230000001954 sterilising effect Effects 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 239000003513 alkali Substances 0.000 description 6
- 238000004659 sterilization and disinfection Methods 0.000 description 6
- 238000004113 cell culture Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000006200 vaporizer Substances 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 206010037544 Purging Diseases 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 239000005416 organic matter Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000001784 detoxification Methods 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
- B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/38—Removing components of undefined structure
- B01D53/40—Acidic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/38—Removing components of undefined structure
- B01D53/42—Basic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12M—APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
- C12M37/00—Means for sterilizing, maintaining sterile conditions or avoiding chemical or biological contamination
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/28—Arrangement or mounting of filters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
- F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F6/00—Air-humidification, e.g. cooling by humidification
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F7/00—Ventilation
- F24F7/003—Ventilation in combination with air cleaning
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F7/00—Ventilation
- F24F7/04—Ventilation with ducting systems, e.g. by double walls; with natural circulation
- F24F7/06—Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F7/00—Ventilation
- F24F7/04—Ventilation with ducting systems, e.g. by double walls; with natural circulation
- F24F7/06—Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit
- F24F7/065—Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit fan combined with single duct; mounting arrangements of a fan in a duct
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F7/00—Ventilation
- F24F7/04—Ventilation with ducting systems, e.g. by double walls; with natural circulation
- F24F7/06—Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit
- F24F7/08—Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit with separate ducts for supplied and exhausted air with provisions for reversal of the input and output systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2258/00—Sources of waste gases
- B01D2258/02—Other waste gases
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Robotics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biomedical Technology (AREA)
- Wood Science & Technology (AREA)
- Environmental & Geological Engineering (AREA)
- Organic Chemistry (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Zoology (AREA)
- Microbiology (AREA)
- Sustainable Development (AREA)
- Biotechnology (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Genetics & Genomics (AREA)
- Molecular Biology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Ventilation (AREA)
- Separation Of Gases By Adsorption (AREA)
Abstract
Description
1A…搬送室本体
2…搬送ロボット
3B…ケミカルフィルタボックス(ガス処理ボックス)
5…制御手段
6…処理装置
7…ケミカルフィルタユニット(ケミカルフィルタ、ガス処理装置)
8…切離手段
36B1…開口(ガス吐出口)
36B2…開口(ガス流入口)
81〜83…ダンパ(開閉蓋)
CL1…循環路
CL2…循環路(短縮循環路)
HS…水分供給手段
PM…ガスパージ手段
W…ウエハ(被搬送物)
Claims (6)
- 内部に設けられる搬送ロボットを用いて処理装置側との間で被搬送物の受け渡しを行うための搬送室であって、
ガスを循環させるために内部に形成された循環路と、
当該循環路の途中に設けられたガス処理装置と、
当該ガス処理装置の前記循環路からの切り離しと接続とを切り替える接離手段と、を備えることを特徴とする搬送室。 - 前記接離手段によって前記ガス処理装置を前記循環路より切り離した際に、前記ガス処理装置を通過せずにガスが循環する短縮循環路が形成されることを特徴とする請求項1記載の搬送室。
- 前記接離手段が、前記ガス処理装置にガスを流入させるガス流入口と、ガス処理装置よりガスを吐出させるガス吐出口とをそれぞれ開閉する開閉蓋により構成されていることを特徴とする請求項1又は2記載の搬送室。
- 前記搬送ロボットが内部に設けられる搬送室本体と、前記ガス処理装置を収容するガス処理ボックスとを備え、当該ガス処理ボックスを前記搬送室本体に対して接続及び分離可能に構成し、接続した場合にこれらガス処理ボックスと搬送室本体との間で前記循環路が形成されるように構成していることを特徴とする請求項1〜3の何れかに記載の搬送室。
- 前記接離手段によって前記ガス処理装置を前記循環路より切り離した際に、当該ガス処理装置を収容するガス処理ボックス内の雰囲気を置換するガスパージ手段を備えることを特徴とする請求項1〜4の何れかに記載の搬送室。
- 前記ガス処理装置がケミカルフィルタであって、前記ガス処理ボックス内に供給するガスに水分を含ませる水分供給手段と、ガス処理ボックス内の湿度に応じて前記水分供給手段の制御を行う制御手段と、を備えることを特徴とする請求項5記載の搬送室。
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015038388A JP6511858B2 (ja) | 2015-02-27 | 2015-02-27 | 搬送室 |
TW104144478A TWI677653B (zh) | 2015-02-27 | 2015-12-30 | 搬送室 |
KR1020177024042A KR102459133B1 (ko) | 2015-02-27 | 2016-02-05 | 반송실 |
US15/554,135 US10672632B2 (en) | 2015-02-27 | 2016-02-05 | Transfer chamber |
EP16755180.3A EP3264450B1 (en) | 2015-02-27 | 2016-02-05 | Transfer chamber |
KR1020227036716A KR20220146702A (ko) | 2015-02-27 | 2016-02-05 | 반송실 |
PCT/JP2016/053553 WO2016136431A1 (ja) | 2015-02-27 | 2016-02-05 | 搬送室 |
US16/845,555 US11424145B2 (en) | 2015-02-27 | 2020-04-10 | Transfer chamber |
US17/860,202 US11823923B2 (en) | 2015-02-27 | 2022-07-08 | Transfer chamber |
US18/484,546 US20240038554A1 (en) | 2015-02-27 | 2023-10-11 | Transfer chamber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015038388A JP6511858B2 (ja) | 2015-02-27 | 2015-02-27 | 搬送室 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016162818A true JP2016162818A (ja) | 2016-09-05 |
JP6511858B2 JP6511858B2 (ja) | 2019-05-15 |
Family
ID=56788303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015038388A Active JP6511858B2 (ja) | 2015-02-27 | 2015-02-27 | 搬送室 |
Country Status (6)
Country | Link |
---|---|
US (4) | US10672632B2 (ja) |
EP (1) | EP3264450B1 (ja) |
JP (1) | JP6511858B2 (ja) |
KR (2) | KR102459133B1 (ja) |
TW (1) | TWI677653B (ja) |
WO (1) | WO2016136431A1 (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017006057A (ja) * | 2015-06-23 | 2017-01-12 | 清水建設株式会社 | 細胞培養設備及び細胞培養方法 |
JP2018160544A (ja) * | 2017-03-22 | 2018-10-11 | Tdk株式会社 | Efem及びefemのガス置換方法 |
KR20180111547A (ko) * | 2017-03-31 | 2018-10-11 | 도쿄엘렉트론가부시키가이샤 | 기판 반송 장치 및 기판 반송 방법 |
KR20180131493A (ko) * | 2017-05-31 | 2018-12-10 | 티디케이가부시기가이샤 | Efem 및 efem으로의 건조 공기의 도입 방법 |
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Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0938449A (ja) * | 1995-07-26 | 1997-02-10 | Dainippon Screen Mfg Co Ltd | 装置本体部取付け型空調装置 |
JPH11340109A (ja) * | 1998-05-26 | 1999-12-10 | Shimizu Corp | ケミカルクリーンストッカ |
JP2003037144A (ja) * | 2001-07-25 | 2003-02-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置およびフィルタ交換方法 |
JP2003314873A (ja) * | 2002-04-23 | 2003-11-06 | Kondo Kogyo Kk | 清浄空気供給装置および該装置におけるフィルターの交換方法 |
JP2005026674A (ja) * | 2003-06-13 | 2005-01-27 | Kondo Kogyo Kk | 半導体ウェハ収納容器内空気清浄装置 |
JP2007134543A (ja) * | 2005-11-11 | 2007-05-31 | Nippon Pure Tec Kk | 搬送装置 |
JP2007302415A (ja) * | 2006-05-11 | 2007-11-22 | Hitachi Plant Technologies Ltd | ワイヤーロープのダスト回収装置 |
JP2008232612A (ja) * | 2008-03-19 | 2008-10-02 | Hokkaido Univ | クリーンユニット、連結クリーンユニットおよびプロセス方法 |
JP2011162237A (ja) * | 2010-02-10 | 2011-08-25 | Sk Electronics:Kk | 可搬容器 |
JP2014112631A (ja) * | 2012-10-31 | 2014-06-19 | Tdk Corp | ロードポートユニット及びefemシステム |
JP2015018894A (ja) * | 2013-07-10 | 2015-01-29 | 株式会社荏原製作所 | めっき装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3681799D1 (de) * | 1985-01-22 | 1991-11-14 | Applied Materials Inc | Halbleiter-bearbeitungseinrichtung. |
JPH0756879B2 (ja) * | 1988-03-31 | 1995-06-14 | 日鉄セミコンダクター株式会社 | 半導体の無塵化製造装置 |
EP0497281B1 (en) * | 1991-01-29 | 1998-12-30 | Shinko Electric Co. Ltd. | Wafer airtight keeping unit |
JPH05226454A (ja) | 1992-02-10 | 1993-09-03 | Dainippon Screen Mfg Co Ltd | 縦型基板熱処理装置のクリーンエアユニットの取付構造 |
US5565034A (en) * | 1993-10-29 | 1996-10-15 | Tokyo Electron Limited | Apparatus for processing substrates having a film formed on a surface of the substrate |
TW317644B (ja) * | 1996-01-26 | 1997-10-11 | Tokyo Electron Co Ltd | |
US5922095A (en) * | 1997-03-20 | 1999-07-13 | Acoustiflo, Llc | Air handling system for buildings and clean rooms |
WO1998050134A1 (en) * | 1997-05-09 | 1998-11-12 | Szatmary Michael A | Isolation chamber air curtain apparatus |
JP3425592B2 (ja) * | 1997-08-12 | 2003-07-14 | 東京エレクトロン株式会社 | 処理装置 |
JP3939101B2 (ja) * | 2000-12-04 | 2007-07-04 | 株式会社荏原製作所 | 基板搬送方法および基板搬送容器 |
JP3880343B2 (ja) * | 2001-08-01 | 2007-02-14 | 株式会社ルネサステクノロジ | ロードポート、基板処理装置および雰囲気置換方法 |
KR100486690B1 (ko) * | 2002-11-29 | 2005-05-03 | 삼성전자주식회사 | 기판 이송 모듈의 오염을 제어할 수 있는 기판 처리 장치및 방법 |
KR100483428B1 (ko) * | 2003-01-24 | 2005-04-14 | 삼성전자주식회사 | 기판 가공 장치 |
KR100505061B1 (ko) * | 2003-02-12 | 2005-08-01 | 삼성전자주식회사 | 기판 이송 모듈 |
JP5006122B2 (ja) * | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
JP4550101B2 (ja) | 2007-10-11 | 2010-09-22 | 川崎重工業株式会社 | 自動細胞培養装置及びその使用方法 |
US8827695B2 (en) * | 2008-06-23 | 2014-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer's ambiance control |
JPWO2011125973A1 (ja) * | 2010-04-05 | 2013-07-11 | 株式会社ニコン | フィルタ保持装置、露光装置、及びデバイス製造方法 |
JP2012049382A (ja) | 2010-08-27 | 2012-03-08 | Sinfonia Technology Co Ltd | ロードポート、efem |
JP2014038888A (ja) * | 2012-08-10 | 2014-02-27 | Hitachi High-Tech Control Systems Corp | ミニエンバイロメント装置及びその内部雰囲気置換方法 |
US20140271097A1 (en) * | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Processing systems and methods for halide scavenging |
TWI678751B (zh) * | 2013-12-13 | 2019-12-01 | 日商昕芙旎雅股份有限公司 | 設備前端模組(efem) |
JP6500498B2 (ja) * | 2015-02-27 | 2019-04-17 | シンフォニアテクノロジー株式会社 | 搬送室及び搬送室のケミカルフィルタの湿度管理方法 |
-
2015
- 2015-02-27 JP JP2015038388A patent/JP6511858B2/ja active Active
- 2015-12-30 TW TW104144478A patent/TWI677653B/zh active
-
2016
- 2016-02-05 KR KR1020177024042A patent/KR102459133B1/ko active Application Filing
- 2016-02-05 EP EP16755180.3A patent/EP3264450B1/en active Active
- 2016-02-05 US US15/554,135 patent/US10672632B2/en active Active
- 2016-02-05 KR KR1020227036716A patent/KR20220146702A/ko not_active Application Discontinuation
- 2016-02-05 WO PCT/JP2016/053553 patent/WO2016136431A1/ja active Application Filing
-
2020
- 2020-04-10 US US16/845,555 patent/US11424145B2/en active Active
-
2022
- 2022-07-08 US US17/860,202 patent/US11823923B2/en active Active
-
2023
- 2023-10-11 US US18/484,546 patent/US20240038554A1/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0938449A (ja) * | 1995-07-26 | 1997-02-10 | Dainippon Screen Mfg Co Ltd | 装置本体部取付け型空調装置 |
JPH11340109A (ja) * | 1998-05-26 | 1999-12-10 | Shimizu Corp | ケミカルクリーンストッカ |
JP2003037144A (ja) * | 2001-07-25 | 2003-02-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置およびフィルタ交換方法 |
JP2003314873A (ja) * | 2002-04-23 | 2003-11-06 | Kondo Kogyo Kk | 清浄空気供給装置および該装置におけるフィルターの交換方法 |
JP2005026674A (ja) * | 2003-06-13 | 2005-01-27 | Kondo Kogyo Kk | 半導体ウェハ収納容器内空気清浄装置 |
JP2007134543A (ja) * | 2005-11-11 | 2007-05-31 | Nippon Pure Tec Kk | 搬送装置 |
JP2007302415A (ja) * | 2006-05-11 | 2007-11-22 | Hitachi Plant Technologies Ltd | ワイヤーロープのダスト回収装置 |
JP2008232612A (ja) * | 2008-03-19 | 2008-10-02 | Hokkaido Univ | クリーンユニット、連結クリーンユニットおよびプロセス方法 |
JP2011162237A (ja) * | 2010-02-10 | 2011-08-25 | Sk Electronics:Kk | 可搬容器 |
JP2014112631A (ja) * | 2012-10-31 | 2014-06-19 | Tdk Corp | ロードポートユニット及びefemシステム |
JP2015018894A (ja) * | 2013-07-10 | 2015-01-29 | 株式会社荏原製作所 | めっき装置 |
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Also Published As
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WO2016136431A1 (ja) | 2016-09-01 |
EP3264450B1 (en) | 2022-11-30 |
US20180040493A1 (en) | 2018-02-08 |
KR102459133B1 (ko) | 2022-10-27 |
EP3264450A1 (en) | 2018-01-03 |
EP3264450A4 (en) | 2018-10-24 |
US20220344182A1 (en) | 2022-10-27 |
US10672632B2 (en) | 2020-06-02 |
US20240038554A1 (en) | 2024-02-01 |
TW201636553A (zh) | 2016-10-16 |
TWI677653B (zh) | 2019-11-21 |
KR20170121190A (ko) | 2017-11-01 |
KR20220146702A (ko) | 2022-11-01 |
US11823923B2 (en) | 2023-11-21 |
US11424145B2 (en) | 2022-08-23 |
JP6511858B2 (ja) | 2019-05-15 |
US20200312686A1 (en) | 2020-10-01 |
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