JP7480249B2 - 基板処理装置 - Google Patents
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- JP7480249B2 JP7480249B2 JP2022167741A JP2022167741A JP7480249B2 JP 7480249 B2 JP7480249 B2 JP 7480249B2 JP 2022167741 A JP2022167741 A JP 2022167741A JP 2022167741 A JP2022167741 A JP 2022167741A JP 7480249 B2 JP7480249 B2 JP 7480249B2
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- H—ELECTRICITY
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
C 基板収納容器
1 基板処理装置
5 基板処理エリア
5A 処理区域
5B 基板搬送区域
51 液処理ユニット
53 基板搬送機構
20 容器保持部
40 基板搬送機構がアクセス可能な位置(受け渡しユニット)
60 第1雰囲気制御系
61 第1ガス供給部
614、615 第1ガス排出部
70 第2雰囲気制御系
71 循環系
72 循環路
73 第2ガス供給部
74 第2ガス排出部
Claims (8)
- 基板に対して処理を行うように構成されるとともにユニットケーシングを有する少なくとも1つの処理ユニットが設けられた処理区域と、前記処理ユニットに対して基板を搬送する基板搬送機構が設けられた基板搬送区域と、前記処理区域を基板搬送区域から隔離する隔離部と、を有する基板処理エリアと、
前記基板処理エリアの前記処理区域内の雰囲気を制御する第1雰囲気制御系と、
前記基板処理エリアの前記基板搬送区域内の雰囲気を制御する第2雰囲気制御系と、を備え、
前記第1雰囲気制御系は、第1ガス供給部と、第1ガス排出部とを有し、前記隔離部により前記処理区域を基板搬送区域から隔離された状態で前記各処理ユニットで処理が行われているときに、当該処理ユニットに前記第1ガス供給部によって雰囲気制御ガスを供給するとともに当該処理ユニット内の雰囲気を前記第1ガス排出部によって排出するように構成され、
前記第2雰囲気制御系は、前記基板処理エリアの前記基板搬送区域と前記基板搬送区域に接続された循環路とを含む循環系と、前記第2雰囲気制御系の前記循環系に雰囲気制御ガスを供給する第2ガス供給部と、前記第2雰囲気制御系の前記循環系内の雰囲気を排出する第2ガス排出部と、を有し、前記第2雰囲気制御系の前記循環系に雰囲気調整ガスを循環させるように構成されるとともに、前記第2雰囲気制御系は、前記処理区域が前記隔離部により前記基板搬送区域から隔離されていない状態で前記第2雰囲気制御系の前記循環系内の雰囲気を前記第2ガス排出部によって排出するように構成されている、基板処理装置。 - 容器保持部により保持された基板収納容器から基板を取り出して前記基板処理エリアの前記基板搬送機構がアクセス可能な位置まで搬送する基板搬送機を有する基板搬送エリアと、
前記基板搬送エリア内の雰囲気を制御する第3雰囲気制御系と、
をさらに備え、
前記第3雰囲気制御系は、前記基板搬送エリアと、前記基板搬送エリアに接続された循環路とを含む循環系と、前記第3雰囲気制御系の前記循環系に雰囲気制御ガスを供給する第3ガス供給部と、前記第3雰囲気制御系の前記循環系内の雰囲気を排出する第3ガス排出部と、を有し、前記第3雰囲気制御系の前記循環系内に雰囲気調整ガスを循環させるように構成されている、請求項1記載の基板処理装置。 - 前記処理区域には、さらに、少なくとも1つの加熱ユニットが設けられている、請求項1または2記載の基板処理装置。
- 前記処理ユニットは、前記処理ユニットにより処理された基板が当該処理ユニットから搬出されるときに、当該基板上に、膜が形成されるような処理を実行するように構成されており、
前記加熱ユニットは、前記膜を加熱するように構成されている、請求項3記載の基板処理装置。 - 前記基板処理エリアの前記基板搬送区域に設けられた前記基板搬送機構は、基板を保持する基板保持アームと、前記基板保持アームにより保持された基板を囲むように設けられたカバーと、を有し、前記カバーにより囲まれた空間から雰囲気を排出する排気部が設けられている、請求項1から4のうちのいずれか一項に記載の基板処理装置。
- 前記基板搬送機構は、前記カバーにより囲まれた空間に雰囲気調整ガスを供給する給気部をさらに有する、請求項5記載の基板処理装置。
- 前記第1雰囲気制御系は、前記各処理ユニットで処理が行われていないときに、当該処理ユニットへの第1ガス供給部による雰囲気制御ガスの供給を停止するように構成されている、請求項1または2記載の基板処理装置。
- 前記処理ユニットは、流体を用いて基板を処理するように構成され、
前記処理ユニットのユニットケージングには、前記基板搬送区域と前記処理区域との間を前記基板搬送機構が通過するための開口が形成されており、
前記隔離部は、前記基板搬送区域と前記処理区域との間を前記基板搬送機構が通過するための開口を開閉するシャッタである、請求項1に記載の基板処理装置。
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JP7253955B2 (ja) * | 2019-03-28 | 2023-04-07 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
KR102553643B1 (ko) * | 2021-05-17 | 2023-07-13 | 세메스 주식회사 | 기판 처리 장치 및 기판 반송로봇 |
KR20230033256A (ko) | 2021-08-31 | 2023-03-08 | 삼성전자주식회사 | 기판 이송 유닛, 기판 처리 장치, 및 기판 처리 방법 |
US11923216B2 (en) | 2021-12-17 | 2024-03-05 | Samsung Electronics Co., Ltd. | Apparatus and method for treating substrate including process chambers and transfer chamber |
WO2024121960A1 (ja) * | 2022-12-07 | 2024-06-13 | 株式会社荏原製作所 | 搬送装置および基板処理装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20200086218A (ko) | 2020-07-16 |
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CN111415884B (zh) | 2024-04-09 |
JP2020113576A (ja) | 2020-07-27 |
TW202040735A (zh) | 2020-11-01 |
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