JP2016074040A5 - - Google Patents

Download PDF

Info

Publication number
JP2016074040A5
JP2016074040A5 JP2015250885A JP2015250885A JP2016074040A5 JP 2016074040 A5 JP2016074040 A5 JP 2016074040A5 JP 2015250885 A JP2015250885 A JP 2015250885A JP 2015250885 A JP2015250885 A JP 2015250885A JP 2016074040 A5 JP2016074040 A5 JP 2016074040A5
Authority
JP
Japan
Prior art keywords
workpiece
alignment
already known
laser beam
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015250885A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016074040A (ja
JP6147325B2 (ja
Filing date
Publication date
Priority claimed from US11/417,269 external-priority patent/US7834293B2/en
Application filed filed Critical
Publication of JP2016074040A publication Critical patent/JP2016074040A/ja
Publication of JP2016074040A5 publication Critical patent/JP2016074040A5/ja
Application granted granted Critical
Publication of JP6147325B2 publication Critical patent/JP6147325B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015250885A 2006-05-02 2015-12-24 レーザ加工のための方法および装置 Expired - Fee Related JP6147325B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/417,269 2006-05-02
US11/417,269 US7834293B2 (en) 2006-05-02 2006-05-02 Method and apparatus for laser processing

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013024399A Division JP2013126691A (ja) 2006-05-02 2013-02-12 レーザ加工のための方法および装置

Publications (3)

Publication Number Publication Date
JP2016074040A JP2016074040A (ja) 2016-05-12
JP2016074040A5 true JP2016074040A5 (enExample) 2017-03-16
JP6147325B2 JP6147325B2 (ja) 2017-06-14

Family

ID=38660278

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2009510034A Pending JP2009535222A (ja) 2006-05-02 2007-05-01 レーザ加工のための方法および装置
JP2013024399A Pending JP2013126691A (ja) 2006-05-02 2013-02-12 レーザ加工のための方法および装置
JP2015250885A Expired - Fee Related JP6147325B2 (ja) 2006-05-02 2015-12-24 レーザ加工のための方法および装置

Family Applications Before (2)

Application Number Title Priority Date Filing Date
JP2009510034A Pending JP2009535222A (ja) 2006-05-02 2007-05-01 レーザ加工のための方法および装置
JP2013024399A Pending JP2013126691A (ja) 2006-05-02 2013-02-12 レーザ加工のための方法および装置

Country Status (8)

Country Link
US (1) US7834293B2 (enExample)
JP (3) JP2009535222A (enExample)
KR (2) KR101509549B1 (enExample)
CN (1) CN101432857B (enExample)
DE (1) DE112007001065T5 (enExample)
GB (1) GB2451782A (enExample)
TW (1) TWI386266B (enExample)
WO (1) WO2007130986A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007012815B4 (de) * 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Verfahren und Vorrichtung zur Bildung eines Gesenks
US7947919B2 (en) * 2008-03-04 2011-05-24 Universal Laser Systems, Inc. Laser-based material processing exhaust systems and methods for using such systems
US8024060B2 (en) * 2008-06-16 2011-09-20 Electro Scientific Industries, Inc. Method for defining safe zones in laser machining systems
US20110300692A1 (en) * 2008-10-29 2011-12-08 Oerlikon Solar Ag, Trubbach Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
KR101448444B1 (ko) * 2010-06-10 2014-10-15 에스티에스반도체통신 주식회사 무선 신호 검사 기능을 가지는 비아 홀 가공용 레이저 장치 및 그 가공 방법
US8263899B2 (en) * 2010-07-01 2012-09-11 Sunpower Corporation High throughput solar cell ablation system
US20130122687A1 (en) * 2011-11-16 2013-05-16 Applied Materials, Inc. Laser scribing systems, apparatus, and methods
CN103600170B (zh) * 2013-04-28 2015-08-26 宝山钢铁股份有限公司 一种纵向金属板上下料与切割方法及其系统
CN103600171B (zh) * 2013-04-28 2015-12-09 宝山钢铁股份有限公司 一种金属板上下料及切割的方法及系统
US10618131B2 (en) * 2014-06-05 2020-04-14 Nlight, Inc. Laser patterning skew correction
CN116213918A (zh) 2015-09-09 2023-06-06 伊雷克托科学工业股份有限公司 镭射处理设备、镭射处理工件的方法及相关配置
US10434600B2 (en) 2015-11-23 2019-10-08 Nlight, Inc. Fine-scale temporal control for laser material processing
JP6382901B2 (ja) * 2016-09-29 2018-08-29 ファナック株式会社 レーザー加工システム
KR102401037B1 (ko) 2016-12-30 2022-05-24 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템
JP6844901B2 (ja) * 2017-05-26 2021-03-17 株式会社ディスコ レーザ加工装置及びレーザ加工方法
EP3774166A4 (en) 2018-06-05 2022-01-19 Electro Scientific Industries, Inc. LASER PROCESSING DEVICE, METHOD OF OPERATION THEREOF AND METHOD OF PROCESSING WORKPIECES USING SAME
DE102018119313B4 (de) * 2018-08-08 2023-03-30 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats und Anlage zum Durchführen des Verfahrens
KR102122778B1 (ko) * 2018-10-10 2020-06-15 (주)성현 테크놀로지 레이저 및 드릴을 이용한 미세 홀 가공방법
CN110899998A (zh) * 2019-11-29 2020-03-24 上海精测半导体技术有限公司 一种激光切割设备以及校准方法
KR102429862B1 (ko) * 2019-12-12 2022-08-05 두원포토닉스 주식회사 이종파장의 레이저 빔을 이용한 레이저 가공 장치 및 그 방법
JP7575971B2 (ja) * 2021-03-09 2024-10-30 Ｊｓｗアクティナシステム株式会社 レーザ照射装置、レーザ照射方法、及び有機ｅｌディスプレイの製造方法
CN113618262B (zh) * 2021-10-12 2021-12-14 江油星联电子科技有限公司 一种铝基印制电路板用开料装置
CN116072583B (zh) 2023-02-13 2024-01-30 无锡星微科技有限公司 一种基于视觉的晶圆预对准平台以及对准方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60210390A (ja) * 1984-04-05 1985-10-22 Kokusan Denki Co Ltd レ−ザ加工方法及び装置
JPS61125712A (ja) * 1984-11-26 1986-06-13 Matsushita Electric Works Ltd 多層印刷配線板の孔穿設法
JPS61172003A (ja) * 1985-01-28 1986-08-02 Hitachi Ltd プリント基板パタ−ン検査装置
JPS62144890A (ja) * 1985-12-20 1987-06-29 Mitsubishi Electric Corp レ−ザ裁断機
DE3743902A1 (de) * 1986-12-26 1988-07-07 Mitsubishi Electric Corp Laserbearbeitungsvorrichtung
US5111406A (en) * 1990-01-05 1992-05-05 Nicolet Instrument Corporation Method for determining drill target locations in a multilayer board panel
JP2578035B2 (ja) * 1991-08-28 1997-02-05 日本写真印刷株式会社 基板位置決め方法
JPH0620899A (ja) 1992-07-01 1994-01-28 Nikon Corp 薄膜除去装置
JP3253784B2 (ja) * 1993-12-17 2002-02-04 日立ビアメカニクス株式会社 多層プリント基板の内層パターン位置検出方法および穴明け加工方法並びにその装置
US5841099A (en) 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
JPH09506827A (ja) * 1994-10-18 1997-07-08 レーザー マシーニング， インコーポレイテッド 固定ビームレーザシステムとともに用いるダブルｘ−ｙテーブルシステム
JP3077539B2 (ja) * 1994-12-22 2000-08-14 松下電器産業株式会社 レーザ加工方法
JPH08290282A (ja) * 1995-04-21 1996-11-05 Sanyo Mach Works Ltd レーザ溶接装置
JPH1058173A (ja) * 1996-08-27 1998-03-03 Nikon Corp レーザ加工装置
US7732732B2 (en) * 1996-11-20 2010-06-08 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US5948291A (en) * 1997-04-29 1999-09-07 General Scanning, Inc. Laser beam distributor and computer program for controlling the same
EP0927597B1 (en) * 1997-11-03 2000-09-06 RAINER S.r.l. Machine for cutting sheet metal and similar
JPH11221690A (ja) * 1998-02-09 1999-08-17 Mitsubishi Electric Corp レーザ加工装置およびレーザ加工方法
EP0937532B1 (en) * 1998-02-19 2002-11-06 M J Technologies Limited Laser drilling with optical feedback
US6340806B1 (en) * 1999-12-28 2002-01-22 General Scanning Inc. Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train
JP3364464B2 (ja) * 2000-01-18 2003-01-08 川崎重工業株式会社 自動加工装置
WO2001074529A2 (en) 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
JP2002011588A (ja) * 2000-06-28 2002-01-15 Sumitomo Heavy Ind Ltd レーザドリル加工機及びレーザを用いた加工方法
JP4132014B2 (ja) 2001-03-28 2008-08-13 凸版印刷株式会社 レーザ加工装置及び加工方法
JP3855684B2 (ja) * 2001-06-05 2006-12-13 松下電器産業株式会社 レーザ加工装置およびレーザ加工方法
JP2003112278A (ja) 2001-09-28 2003-04-15 Matsushita Electric Ind Co Ltd 加工装置及びその加工方法
WO2003080283A1 (en) * 2002-03-26 2003-10-02 Mitsubishi Denki Kabushiki Kaisha Laser beam positioning device for laser machining, apparatus
JP4143334B2 (ja) * 2002-05-24 2008-09-03 日立ビアメカニクス株式会社 プリント基板穴明け用レーザ加工機の制御方法
US6580054B1 (en) * 2002-06-10 2003-06-17 New Wave Research Scribing sapphire substrates with a solid state UV laser
US6610961B1 (en) * 2002-07-25 2003-08-26 Matsushita Electric Industrial Co., Ltd. System and method of workpiece alignment in a laser milling system
US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
JP4215677B2 (ja) * 2003-08-25 2009-01-28 日立ビアメカニクス株式会社 レーザ加工機及びレーザ加工方法
US20050205778A1 (en) * 2003-10-17 2005-09-22 Gsi Lumonics Corporation Laser trim motion, calibration, imaging, and fixturing techniques
FR2883503B1 (fr) * 2005-03-23 2020-11-06 Datacard Corp Machine de marquage laser a haute cadence

Similar Documents

Publication Publication Date Title
JP2016074040A5 (enExample)
KR101986058B1 (ko) 두 개의 기판을 정렬하기 위한 장치
US20160236418A1 (en) Error pattern compensation
KR101487597B1 (ko) 오버레이 계측을 위한 툴 인듀스드 시프트 감소 결정
US9201312B2 (en) Method for correcting position measurements for optical errors and method for determining mask writer errors
CN105215990B (zh) 机械手臂系统及其平行度校正方法
JP2019526796A (ja) 集積回路デバイスのビジョンアライメントのためのオフラインビジョン支援方法および装置
CN105881102A (zh) 使用了拍摄部的工件的定位装置
JP2014133248A5 (enExample)
JP2015017844A5 (enExample)
CN108044408A (zh) 适用于离子束抛光的工件定位误差标定及补偿方法
KR20190137131A (ko) 머신 비전 시스템
CN103270534A (zh) 用于检测机床中的对象的位置的装置和方法
KR101395660B1 (ko) 법선 벡터를 이용한 3 차원 좌표 정렬 방법 및 이 방법을 처리하는 컴퓨터 판독 가능한 프로그램을 저장하는 저장 매체
JP6031368B2 (ja) ワークとの相関位置決め方法
US11713965B2 (en) Method and apparatus for determining a chamfer property of a workpiece chamfer and computer program
KR102430643B1 (ko) 스테이지의 위치 보정 방법 및 장치
WO2011139061A2 (ko) 반도체 자재 정렬방법
JP5577770B2 (ja) 座標補正方法
CN104439769B (zh) 一种机器人焊接垂直度测量机构及其测量方法
JP2017129439A (ja) 加工孔の座標位置測定方法
Zhenjiu et al. A modified sequential multilateration scheme and its application in geometric error measurement of rotary axis
US10036967B2 (en) Lithography apparatus, lithography method, and article manufacturing method
JP2020082231A (ja) 測定方法
KR101480210B1 (ko) 직선 이송계의 기하학적 오차 측정 방법