CN101432857B - 激光处理的方法和设备 - Google Patents

激光处理的方法和设备 Download PDF

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Publication number
CN101432857B
CN101432857B CN2007800155301A CN200780015530A CN101432857B CN 101432857 B CN101432857 B CN 101432857B CN 2007800155301 A CN2007800155301 A CN 2007800155301A CN 200780015530 A CN200780015530 A CN 200780015530A CN 101432857 B CN101432857 B CN 101432857B
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workpiece
laser beam
laser
processing
calibration
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Expired - Fee Related
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CN2007800155301A
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Chinese (zh)
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CN101432857A (zh
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唐纳·E.·威尔
布莱恩·C.·乔汉森
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Irecto Science Industry Co ltd
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Irecto Science Industry Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/477—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481—Insulating layers on insulating parts, with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/82009—Pre-treatment of the connector or the bonding area
    • H01L2224/8203—Reshaping, e.g. forming vias
    • H01L2224/82035—Reshaping, e.g. forming vias by heating means
    • H01L2224/82039—Reshaping, e.g. forming vias by heating means using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
CN2007800155301A 2006-05-02 2007-05-01 激光处理的方法和设备 Expired - Fee Related CN101432857B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/417,269 2006-05-02
US11/417,269 US7834293B2 (en) 2006-05-02 2006-05-02 Method and apparatus for laser processing
PCT/US2007/067945 WO2007130986A1 (en) 2006-05-02 2007-05-01 Method and apparatus for laser processing

Publications (2)

Publication Number Publication Date
CN101432857A CN101432857A (zh) 2009-05-13
CN101432857B true CN101432857B (zh) 2011-07-06

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CN2007800155301A Expired - Fee Related CN101432857B (zh) 2006-05-02 2007-05-01 激光处理的方法和设备

Country Status (8)

Country Link
US (1) US7834293B2 (enExample)
JP (3) JP2009535222A (enExample)
KR (2) KR101509549B1 (enExample)
CN (1) CN101432857B (enExample)
DE (1) DE112007001065T5 (enExample)
GB (1) GB2451782A (enExample)
TW (1) TWI386266B (enExample)
WO (1) WO2007130986A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007012815B4 (de) * 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Verfahren und Vorrichtung zur Bildung eines Gesenks
US7947919B2 (en) * 2008-03-04 2011-05-24 Universal Laser Systems, Inc. Laser-based material processing exhaust systems and methods for using such systems
US8024060B2 (en) * 2008-06-16 2011-09-20 Electro Scientific Industries, Inc. Method for defining safe zones in laser machining systems
US20110300692A1 (en) * 2008-10-29 2011-12-08 Oerlikon Solar Ag, Trubbach Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
KR101448444B1 (ko) * 2010-06-10 2014-10-15 에스티에스반도체통신 주식회사 무선 신호 검사 기능을 가지는 비아 홀 가공용 레이저 장치 및 그 가공 방법
US8263899B2 (en) * 2010-07-01 2012-09-11 Sunpower Corporation High throughput solar cell ablation system
US20130122687A1 (en) * 2011-11-16 2013-05-16 Applied Materials, Inc. Laser scribing systems, apparatus, and methods
CN103600170B (zh) * 2013-04-28 2015-08-26 宝山钢铁股份有限公司 一种纵向金属板上下料与切割方法及其系统
CN103600171B (zh) * 2013-04-28 2015-12-09 宝山钢铁股份有限公司 一种金属板上下料及切割的方法及系统
US10618131B2 (en) * 2014-06-05 2020-04-14 Nlight, Inc. Laser patterning skew correction
CN116213918A (zh) 2015-09-09 2023-06-06 伊雷克托科学工业股份有限公司 镭射处理设备、镭射处理工件的方法及相关配置
US10434600B2 (en) 2015-11-23 2019-10-08 Nlight, Inc. Fine-scale temporal control for laser material processing
JP6382901B2 (ja) * 2016-09-29 2018-08-29 ファナック株式会社 レーザー加工システム
KR102401037B1 (ko) 2016-12-30 2022-05-24 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템
JP6844901B2 (ja) * 2017-05-26 2021-03-17 株式会社ディスコ レーザ加工装置及びレーザ加工方法
EP3774166A4 (en) 2018-06-05 2022-01-19 Electro Scientific Industries, Inc. LASER PROCESSING DEVICE, METHOD OF OPERATION THEREOF AND METHOD OF PROCESSING WORKPIECES USING SAME
DE102018119313B4 (de) * 2018-08-08 2023-03-30 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats und Anlage zum Durchführen des Verfahrens
KR102122778B1 (ko) * 2018-10-10 2020-06-15 (주)성현 테크놀로지 레이저 및 드릴을 이용한 미세 홀 가공방법
CN110899998A (zh) * 2019-11-29 2020-03-24 上海精测半导体技术有限公司 一种激光切割设备以及校准方法
KR102429862B1 (ko) * 2019-12-12 2022-08-05 두원포토닉스 주식회사 이종파장의 레이저 빔을 이용한 레이저 가공 장치 및 그 방법
JP7575971B2 (ja) * 2021-03-09 2024-10-30 Ｊｓｗアクティナシステム株式会社 レーザ照射装置、レーザ照射方法、及び有機ｅｌディスプレイの製造方法
CN113618262B (zh) * 2021-10-12 2021-12-14 江油星联电子科技有限公司 一种铝基印制电路板用开料装置
CN116072583B (zh) 2023-02-13 2024-01-30 无锡星微科技有限公司 一种基于视觉的晶圆预对准平台以及对准方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1458873A (zh) * 2001-06-05 2003-11-26 松下电器产业株式会社 加工装置与加工方法
CN1509220A (zh) * 2002-03-26 2004-06-30 三菱电机株式会社 激光加工装置的激光束定位装置
CN1590006A (zh) * 2003-08-25 2005-03-09 日立比亚机械股份有限公司 激光加工装置及激光加工方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60210390A (ja) * 1984-04-05 1985-10-22 Kokusan Denki Co Ltd レ−ザ加工方法及び装置
JPS61125712A (ja) * 1984-11-26 1986-06-13 Matsushita Electric Works Ltd 多層印刷配線板の孔穿設法
JPS61172003A (ja) * 1985-01-28 1986-08-02 Hitachi Ltd プリント基板パタ−ン検査装置
JPS62144890A (ja) * 1985-12-20 1987-06-29 Mitsubishi Electric Corp レ−ザ裁断機
DE3743902A1 (de) * 1986-12-26 1988-07-07 Mitsubishi Electric Corp Laserbearbeitungsvorrichtung
US5111406A (en) * 1990-01-05 1992-05-05 Nicolet Instrument Corporation Method for determining drill target locations in a multilayer board panel
JP2578035B2 (ja) * 1991-08-28 1997-02-05 日本写真印刷株式会社 基板位置決め方法
JPH0620899A (ja) 1992-07-01 1994-01-28 Nikon Corp 薄膜除去装置
JP3253784B2 (ja) * 1993-12-17 2002-02-04 日立ビアメカニクス株式会社 多層プリント基板の内層パターン位置検出方法および穴明け加工方法並びにその装置
US5841099A (en) 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
JPH09506827A (ja) * 1994-10-18 1997-07-08 レーザー マシーニング， インコーポレイテッド 固定ビームレーザシステムとともに用いるダブルｘ−ｙテーブルシステム
JP3077539B2 (ja) * 1994-12-22 2000-08-14 松下電器産業株式会社 レーザ加工方法
JPH08290282A (ja) * 1995-04-21 1996-11-05 Sanyo Mach Works Ltd レーザ溶接装置
JPH1058173A (ja) * 1996-08-27 1998-03-03 Nikon Corp レーザ加工装置
US7732732B2 (en) * 1996-11-20 2010-06-08 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US5948291A (en) * 1997-04-29 1999-09-07 General Scanning, Inc. Laser beam distributor and computer program for controlling the same
EP0927597B1 (en) * 1997-11-03 2000-09-06 RAINER S.r.l. Machine for cutting sheet metal and similar
JPH11221690A (ja) * 1998-02-09 1999-08-17 Mitsubishi Electric Corp レーザ加工装置およびレーザ加工方法
EP0937532B1 (en) * 1998-02-19 2002-11-06 M J Technologies Limited Laser drilling with optical feedback
US6340806B1 (en) * 1999-12-28 2002-01-22 General Scanning Inc. Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train
JP3364464B2 (ja) * 2000-01-18 2003-01-08 川崎重工業株式会社 自動加工装置
WO2001074529A2 (en) 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
JP2002011588A (ja) * 2000-06-28 2002-01-15 Sumitomo Heavy Ind Ltd レーザドリル加工機及びレーザを用いた加工方法
JP4132014B2 (ja) 2001-03-28 2008-08-13 凸版印刷株式会社 レーザ加工装置及び加工方法
JP2003112278A (ja) 2001-09-28 2003-04-15 Matsushita Electric Ind Co Ltd 加工装置及びその加工方法
JP4143334B2 (ja) * 2002-05-24 2008-09-03 日立ビアメカニクス株式会社 プリント基板穴明け用レーザ加工機の制御方法
US6580054B1 (en) * 2002-06-10 2003-06-17 New Wave Research Scribing sapphire substrates with a solid state UV laser
US6610961B1 (en) * 2002-07-25 2003-08-26 Matsushita Electric Industrial Co., Ltd. System and method of workpiece alignment in a laser milling system
US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US20050205778A1 (en) * 2003-10-17 2005-09-22 Gsi Lumonics Corporation Laser trim motion, calibration, imaging, and fixturing techniques
FR2883503B1 (fr) * 2005-03-23 2020-11-06 Datacard Corp Machine de marquage laser a haute cadence

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1458873A (zh) * 2001-06-05 2003-11-26 松下电器产业株式会社 加工装置与加工方法
CN1509220A (zh) * 2002-03-26 2004-06-30 三菱电机株式会社 激光加工装置的激光束定位装置
CN1590006A (zh) * 2003-08-25 2005-03-09 日立比亚机械股份有限公司 激光加工装置及激光加工方法

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JP2013126691A (ja) 2013-06-27
DE112007001065T5 (de) 2009-04-23
JP2016074040A (ja) 2016-05-12
KR101509549B1 (ko) 2015-04-06
WO2007130986A1 (en) 2007-11-15
TW200800457A (en) 2008-01-01
CN101432857A (zh) 2009-05-13
KR20140146666A (ko) 2014-12-26
GB0820346D0 (en) 2008-12-17
US20070257012A1 (en) 2007-11-08
JP6147325B2 (ja) 2017-06-14
US7834293B2 (en) 2010-11-16
JP2009535222A (ja) 2009-10-01
KR20090005121A (ko) 2009-01-12
TWI386266B (zh) 2013-02-21
GB2451782A (en) 2009-02-11

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