JP2011522706A5 - - Google Patents
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- JP2011522706A5 JP2011522706A5 JP2011513523A JP2011513523A JP2011522706A5 JP 2011522706 A5 JP2011522706 A5 JP 2011522706A5 JP 2011513523 A JP2011513523 A JP 2011513523A JP 2011513523 A JP2011513523 A JP 2011513523A JP 2011522706 A5 JP2011522706 A5 JP 2011522706A5
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- JP
- Japan
- Prior art keywords
- workpiece
- characteristic
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- primary
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US6143908P | 2008-06-13 | 2008-06-13 | |
| US61/061,439 | 2008-06-13 | ||
| US12/164,698 US8173931B2 (en) | 2008-06-13 | 2008-06-30 | Automatic recipe management for laser processing a work piece |
| US12/164,698 | 2008-06-30 | ||
| PCT/US2009/043160 WO2009151838A2 (en) | 2008-06-13 | 2009-05-07 | Automatic recipe management for laser processing workpiece |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011522706A JP2011522706A (ja) | 2011-08-04 |
| JP2011522706A5 true JP2011522706A5 (enExample) | 2012-04-19 |
| JP5820270B2 JP5820270B2 (ja) | 2015-11-24 |
Family
ID=41413810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011513523A Expired - Fee Related JP5820270B2 (ja) | 2008-06-13 | 2009-05-07 | 工作物をレーザ加工するための自動レシピ管理方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8173931B2 (enExample) |
| JP (1) | JP5820270B2 (enExample) |
| KR (1) | KR101637402B1 (enExample) |
| CN (1) | CN102056705B (enExample) |
| TW (1) | TWI475417B (enExample) |
| WO (1) | WO2009151838A2 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9029731B2 (en) | 2007-01-26 | 2015-05-12 | Electro Scientific Industries, Inc. | Methods and systems for laser processing continuously moving sheet material |
| JP2012094591A (ja) * | 2010-10-25 | 2012-05-17 | Disco Abrasive Syst Ltd | ビアホールの加工方法およびレーザー加工装置 |
| FI124538B (fi) * | 2012-12-21 | 2014-10-15 | Primoceler Oy | Menetelmä substraattia sisältävien kappaleiden hitsaamiseksi yhteen fokusoidun lasersäteen avulla |
| CN103433619B (zh) * | 2013-08-30 | 2015-10-21 | 大族激光科技产业集团股份有限公司 | 激光熔覆打印机及线路板的制作方法 |
| US11498156B2 (en) * | 2014-07-03 | 2022-11-15 | Nippon Steel Corporation | Laser processing apparatus |
| EP3256920B1 (en) * | 2015-02-12 | 2021-06-23 | Glowforge Inc. | Cloud controlled laser fabrication |
| JP6570921B2 (ja) * | 2015-03-16 | 2019-09-04 | ビアメカニクス株式会社 | レーザ穴あけ加工条件の設定方法及びレーザ加工機 |
| CN106513985B (zh) * | 2016-12-29 | 2018-08-21 | 齐齐哈尔二机床(集团)有限责任公司 | 激光诱导成型机床 |
| KR102068210B1 (ko) * | 2018-03-09 | 2020-01-20 | 주식회사 이오테크닉스 | 명령어 모드를 이용한 레이저 레시피 제어 방법 및 레이저 제어 시스템 |
| JP7283918B2 (ja) * | 2019-02-20 | 2023-05-30 | 株式会社ディスコ | 加工装置 |
| JPWO2021001905A1 (ja) * | 2019-07-01 | 2021-09-13 | 三菱電機株式会社 | レーザ加工装置、レーザ加工方法、レーザ加工装置の制御装置および機械学習装置 |
| CN113333958B (zh) * | 2020-02-17 | 2023-09-22 | Nps株式会社 | 激光加工系统及方法 |
| KR102327453B1 (ko) * | 2020-02-17 | 2021-11-17 | (주)엔피에스 | 레이저 가공 시스템 및 방법 |
| JP6818950B1 (ja) * | 2020-02-21 | 2021-01-27 | 三菱電機株式会社 | 加工エネルギーの制御方法およびレーザ加工装置 |
| US20230286035A1 (en) * | 2020-06-30 | 2023-09-14 | Canon Virginia, Inc. | Method and system for automated wax mold assembly |
| EP3984686A1 (de) | 2020-10-16 | 2022-04-20 | Bystronic Laser AG | Verfahren, regelungseinheit und laserschneidsystem für kombinierte bahn- und laserprozessplanung für hochdynamische echtzeit-systeme |
| CN115916451B (zh) * | 2020-10-16 | 2024-02-20 | 百超激光有限公司 | 用于计算空间和时间分辨的、组合的设定点数据集的方法、控制单元和激光切割系统 |
| CN113203641B (zh) * | 2021-03-25 | 2023-01-17 | 武汉钢铁有限公司 | 加工参数确定方法、样品加工方法、装置及设备 |
| CN113245560B (zh) * | 2021-06-03 | 2021-09-28 | 恒新增材制造研究中心(佛山)有限公司 | 一种快速获取选区激光熔化设备标准成形参数的方法 |
| CN113453439B (zh) * | 2021-07-15 | 2022-11-11 | 吉安满坤科技股份有限公司 | 一种传感控制Touch技术印制电路板及其制备方法 |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3131252A (en) * | 1961-06-05 | 1964-04-28 | Hazeltine Research Inc | Electronic previewer for the graphic arts |
| US4555610A (en) * | 1983-09-13 | 1985-11-26 | Data Card Corporation | Laser machining system |
| JPH0276684U (enExample) * | 1988-11-22 | 1990-06-12 | ||
| JPH04190987A (ja) * | 1990-11-26 | 1992-07-09 | Murata Mach Ltd | レーザ加工機 |
| US5319183A (en) * | 1992-02-18 | 1994-06-07 | Fujitsu Limited | Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards |
| GB9321866D0 (en) * | 1993-10-22 | 1993-12-15 | Kinsman Grant | Fuzzy logic control of laser welding |
| US5841099A (en) | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| US5593606A (en) | 1994-07-18 | 1997-01-14 | Electro Scientific Industries, Inc. | Ultraviolet laser system and method for forming vias in multi-layered targets |
| US5751585A (en) | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
| US5663076A (en) * | 1995-08-08 | 1997-09-02 | Lsi Logic Corporation | Automating photolithography in the fabrication of integrated circuits |
| US6266581B1 (en) * | 1996-05-10 | 2001-07-24 | The United States Of America As Represented By The Secretary Of Commerce | Spatial RAM for high precision data acquisition systems |
| US7732732B2 (en) * | 1996-11-20 | 2010-06-08 | Ibiden Co., Ltd. | Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
| JPH10323783A (ja) * | 1997-05-26 | 1998-12-08 | Japan Tobacco Inc | 帯状材の開孔装置 |
| JP3902710B2 (ja) * | 1999-03-24 | 2007-04-11 | 株式会社牧野フライス製作所 | 数値制御による工作機械の制御方法及び装置 |
| WO2001052004A1 (en) | 2000-01-11 | 2001-07-19 | Electro Scientific Industries, Inc. | Abbe error correction system and method |
| WO2001074529A2 (en) | 2000-03-30 | 2001-10-11 | Electro Scientific Industries, Inc. | Laser system and method for single pass micromachining of multilayer workpieces |
| AU2001238090A1 (en) | 2000-04-01 | 2001-10-15 | Corning Incorporated | Heating method and device |
| US7157038B2 (en) | 2000-09-20 | 2007-01-02 | Electro Scientific Industries, Inc. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
| US7042567B2 (en) * | 2000-12-08 | 2006-05-09 | Foundation Of Research And Technology | Imaging method and apparatus for the non-destructive analysis of paintings and monuments |
| US6784399B2 (en) | 2001-05-09 | 2004-08-31 | Electro Scientific Industries, Inc. | Micromachining with high-energy, intra-cavity Q-switched CO2 laser pulses |
| SG103865A1 (en) * | 2001-06-01 | 2004-05-26 | Toshiba Kk | Film quality inspecting method and film quality inspecting apparatus |
| US7280883B2 (en) * | 2001-09-06 | 2007-10-09 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing system managing apparatus information of substrate processing apparatus |
| US6875950B2 (en) | 2002-03-22 | 2005-04-05 | Gsi Lumonics Corporation | Automated laser trimming of resistors |
| WO2003080283A1 (en) * | 2002-03-26 | 2003-10-02 | Mitsubishi Denki Kabushiki Kaisha | Laser beam positioning device for laser machining, apparatus |
| TWI265550B (en) * | 2002-05-14 | 2006-11-01 | Toshiba Corp | Fabrication method, manufacturing method for semiconductor device, and fabrication device |
| JP3846573B2 (ja) * | 2002-06-14 | 2006-11-15 | 三菱電機株式会社 | レーザ加工装置及び該加工装置の制御方法 |
| JP2004066327A (ja) * | 2002-08-09 | 2004-03-04 | Tdk Corp | レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法 |
| US7043330B2 (en) * | 2002-10-31 | 2006-05-09 | Ehsan Toyserkani | System and method for closed-loop control of laser cladding by powder injection |
| US7364952B2 (en) * | 2003-09-16 | 2008-04-29 | The Trustees Of Columbia University In The City Of New York | Systems and methods for processing thin films |
| US7250309B2 (en) * | 2004-01-09 | 2007-07-31 | Applied Materials, Inc. | Integrated phase angle and optical critical dimension measurement metrology for feed forward and feedback process control |
| FR2869558B1 (fr) * | 2004-04-29 | 2006-09-01 | Vai Clecim Soc Par Actions Sim | Procede de reglage de l'epaisseur du cordon de soudure de deux toles metalliques |
| US7342664B1 (en) * | 2004-05-06 | 2008-03-11 | Juliusz George Radziszewski | Scanning double-beam interferometer |
| US7985942B2 (en) | 2004-05-28 | 2011-07-26 | Electro Scientific Industries, Inc. | Method of providing consistent quality of target material removal by lasers having different output performance characteristics |
| US7133182B2 (en) | 2004-06-07 | 2006-11-07 | Electro Scientific Industries, Inc. | AOM frequency and amplitude modulation techniques for facilitating full beam extinction in laser systems |
| US7425719B2 (en) * | 2005-01-13 | 2008-09-16 | Wd Media, Inc. | Method and apparatus for selectively providing data from a test head to a processor |
| US7279657B2 (en) | 2005-06-13 | 2007-10-09 | Applied Materials, Inc. | Scanned rapid thermal processing with feed forward control |
| US7244906B2 (en) | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
| JP2007095952A (ja) * | 2005-09-28 | 2007-04-12 | Tokyo Seimitsu Co Ltd | レーザーダイシング装置及びレーザーダイシング方法 |
| JP2007237199A (ja) * | 2006-03-06 | 2007-09-20 | Sumitomo Heavy Ind Ltd | レーザ加工装置及びレーザ加工方法 |
| US8198566B2 (en) * | 2006-05-24 | 2012-06-12 | Electro Scientific Industries, Inc. | Laser processing of workpieces containing low-k dielectric material |
| US7848835B2 (en) * | 2006-06-02 | 2010-12-07 | Cymer, Inc. | High power laser flat panel workpiece treatment system controller |
-
2008
- 2008-06-30 US US12/164,698 patent/US8173931B2/en not_active Expired - Fee Related
-
2009
- 2009-05-07 JP JP2011513523A patent/JP5820270B2/ja not_active Expired - Fee Related
- 2009-05-07 CN CN200980121875.4A patent/CN102056705B/zh not_active Expired - Fee Related
- 2009-05-07 KR KR1020107027884A patent/KR101637402B1/ko not_active Expired - Fee Related
- 2009-05-07 WO PCT/US2009/043160 patent/WO2009151838A2/en not_active Ceased
- 2009-05-14 TW TW098115987A patent/TWI475417B/zh not_active IP Right Cessation
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