TWI475417B - 用於雷射加工工件的自動參數管理 - Google Patents

用於雷射加工工件的自動參數管理 Download PDF

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Publication number
TWI475417B
TWI475417B TW098115987A TW98115987A TWI475417B TW I475417 B TWI475417 B TW I475417B TW 098115987 A TW098115987 A TW 098115987A TW 98115987 A TW98115987 A TW 98115987A TW I475417 B TWI475417 B TW I475417B
Authority
TW
Taiwan
Prior art keywords
workpiece
value
parameter configuration
characteristic
laser
Prior art date
Application number
TW098115987A
Other languages
English (en)
Chinese (zh)
Other versions
TW201005574A (en
Inventor
Ling Wen
Mehmet Emin Alpay
Jeff Howerton
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW201005574A publication Critical patent/TW201005574A/zh
Application granted granted Critical
Publication of TWI475417B publication Critical patent/TWI475417B/zh

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/408—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by data handling or data format, e.g. reading, buffering or conversion of data
    • G05B19/4083—Adapting programme, configuration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36503—Adapt program to real coordinates, software orientation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45165—Laser machining

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW098115987A 2008-06-13 2009-05-14 用於雷射加工工件的自動參數管理 TWI475417B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US6143908P 2008-06-13 2008-06-13
US12/164,698 US8173931B2 (en) 2008-06-13 2008-06-30 Automatic recipe management for laser processing a work piece

Publications (2)

Publication Number Publication Date
TW201005574A TW201005574A (en) 2010-02-01
TWI475417B true TWI475417B (zh) 2015-03-01

Family

ID=41413810

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098115987A TWI475417B (zh) 2008-06-13 2009-05-14 用於雷射加工工件的自動參數管理

Country Status (6)

Country Link
US (1) US8173931B2 (enExample)
JP (1) JP5820270B2 (enExample)
KR (1) KR101637402B1 (enExample)
CN (1) CN102056705B (enExample)
TW (1) TWI475417B (enExample)
WO (1) WO2009151838A2 (enExample)

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CN103433619B (zh) * 2013-08-30 2015-10-21 大族激光科技产业集团股份有限公司 激光熔覆打印机及线路板的制作方法
US11498156B2 (en) * 2014-07-03 2022-11-15 Nippon Steel Corporation Laser processing apparatus
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JP6570921B2 (ja) * 2015-03-16 2019-09-04 ビアメカニクス株式会社 レーザ穴あけ加工条件の設定方法及びレーザ加工機
CN106513985B (zh) * 2016-12-29 2018-08-21 齐齐哈尔二机床(集团)有限责任公司 激光诱导成型机床
KR102068210B1 (ko) * 2018-03-09 2020-01-20 주식회사 이오테크닉스 명령어 모드를 이용한 레이저 레시피 제어 방법 및 레이저 제어 시스템
JP7283918B2 (ja) * 2019-02-20 2023-05-30 株式会社ディスコ 加工装置
JPWO2021001905A1 (ja) * 2019-07-01 2021-09-13 三菱電機株式会社 レーザ加工装置、レーザ加工方法、レーザ加工装置の制御装置および機械学習装置
CN113333958B (zh) * 2020-02-17 2023-09-22 Nps株式会社 激光加工系统及方法
KR102327453B1 (ko) * 2020-02-17 2021-11-17 (주)엔피에스 레이저 가공 시스템 및 방법
JP6818950B1 (ja) * 2020-02-21 2021-01-27 三菱電機株式会社 加工エネルギーの制御方法およびレーザ加工装置
US20230286035A1 (en) * 2020-06-30 2023-09-14 Canon Virginia, Inc. Method and system for automated wax mold assembly
EP3984686A1 (de) 2020-10-16 2022-04-20 Bystronic Laser AG Verfahren, regelungseinheit und laserschneidsystem für kombinierte bahn- und laserprozessplanung für hochdynamische echtzeit-systeme
CN115916451B (zh) * 2020-10-16 2024-02-20 百超激光有限公司 用于计算空间和时间分辨的、组合的设定点数据集的方法、控制单元和激光切割系统
CN113203641B (zh) * 2021-03-25 2023-01-17 武汉钢铁有限公司 加工参数确定方法、样品加工方法、装置及设备
CN113245560B (zh) * 2021-06-03 2021-09-28 恒新增材制造研究中心(佛山)有限公司 一种快速获取选区激光熔化设备标准成形参数的方法
CN113453439B (zh) * 2021-07-15 2022-11-11 吉安满坤科技股份有限公司 一种传感控制Touch技术印制电路板及其制备方法

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Also Published As

Publication number Publication date
US20090308854A1 (en) 2009-12-17
TW201005574A (en) 2010-02-01
JP5820270B2 (ja) 2015-11-24
KR20110036533A (ko) 2011-04-07
WO2009151838A3 (en) 2010-04-22
CN102056705B (zh) 2016-01-06
CN102056705A (zh) 2011-05-11
WO2009151838A2 (en) 2009-12-17
JP2011522706A (ja) 2011-08-04
US8173931B2 (en) 2012-05-08
KR101637402B1 (ko) 2016-07-20

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