CN102056705B - 用于激光加工工件的自动参数管理 - Google Patents

用于激光加工工件的自动参数管理 Download PDF

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Publication number
CN102056705B
CN102056705B CN200980121875.4A CN200980121875A CN102056705B CN 102056705 B CN102056705 B CN 102056705B CN 200980121875 A CN200980121875 A CN 200980121875A CN 102056705 B CN102056705 B CN 102056705B
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CN
China
Prior art keywords
workpiece
characteristic
laser processing
value
processing parameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200980121875.4A
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English (en)
Chinese (zh)
Other versions
CN102056705A (zh
Inventor
文陵
玛密特·伊茗·艾尔帕
杰夫·哈华顿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Irecto Science Industry Co ltd
Original Assignee
Irecto Science Industry Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Irecto Science Industry Co ltd filed Critical Irecto Science Industry Co ltd
Publication of CN102056705A publication Critical patent/CN102056705A/zh
Application granted granted Critical
Publication of CN102056705B publication Critical patent/CN102056705B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/408—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by data handling or data format, e.g. reading, buffering or conversion of data
    • G05B19/4083—Adapting program, configuration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36503—Adapt program to real coordinates, software orientation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45165—Laser machining

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN200980121875.4A 2008-06-13 2009-05-07 用于激光加工工件的自动参数管理 Expired - Fee Related CN102056705B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US6143908P 2008-06-13 2008-06-13
US61/061,439 2008-06-13
US12/164,698 2008-06-30
US12/164,698 US8173931B2 (en) 2008-06-13 2008-06-30 Automatic recipe management for laser processing a work piece
PCT/US2009/043160 WO2009151838A2 (en) 2008-06-13 2009-05-07 Automatic recipe management for laser processing workpiece

Publications (2)

Publication Number Publication Date
CN102056705A CN102056705A (zh) 2011-05-11
CN102056705B true CN102056705B (zh) 2016-01-06

Family

ID=41413810

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980121875.4A Expired - Fee Related CN102056705B (zh) 2008-06-13 2009-05-07 用于激光加工工件的自动参数管理

Country Status (6)

Country Link
US (1) US8173931B2 (enExample)
JP (1) JP5820270B2 (enExample)
KR (1) KR101637402B1 (enExample)
CN (1) CN102056705B (enExample)
TW (1) TWI475417B (enExample)
WO (1) WO2009151838A2 (enExample)

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CN103433619B (zh) * 2013-08-30 2015-10-21 大族激光科技产业集团股份有限公司 激光熔覆打印机及线路板的制作方法
BR112016030522B1 (pt) * 2014-07-03 2019-11-05 Nippon Steel & Sumitomo Metal Corp aparelho de processamento a laser
US10509390B2 (en) 2015-02-12 2019-12-17 Glowforge Inc. Safety and reliability guarantees for laser fabrication
WO2016131022A1 (en) * 2015-02-12 2016-08-18 Glowforge Inc. Cloud controlled laser fabrication
JP6570921B2 (ja) * 2015-03-16 2019-09-04 ビアメカニクス株式会社 レーザ穴あけ加工条件の設定方法及びレーザ加工機
CN106513985B (zh) * 2016-12-29 2018-08-21 齐齐哈尔二机床(集团)有限责任公司 激光诱导成型机床
KR102068210B1 (ko) * 2018-03-09 2020-01-20 주식회사 이오테크닉스 명령어 모드를 이용한 레이저 레시피 제어 방법 및 레이저 제어 시스템
JP7283918B2 (ja) * 2019-02-20 2023-05-30 株式会社ディスコ 加工装置
JPWO2021001905A1 (ja) * 2019-07-01 2021-09-13 三菱電機株式会社 レーザ加工装置、レーザ加工方法、レーザ加工装置の制御装置および機械学習装置
CN113333958B (zh) * 2020-02-17 2023-09-22 Nps株式会社 激光加工系统及方法
KR102327453B1 (ko) * 2020-02-17 2021-11-17 (주)엔피에스 레이저 가공 시스템 및 방법
JP6818950B1 (ja) * 2020-02-21 2021-01-27 三菱電機株式会社 加工エネルギーの制御方法およびレーザ加工装置
US20230286035A1 (en) * 2020-06-30 2023-09-14 Canon Virginia, Inc. Method and system for automated wax mold assembly
CN115916451B (zh) * 2020-10-16 2024-02-20 百超激光有限公司 用于计算空间和时间分辨的、组合的设定点数据集的方法、控制单元和激光切割系统
EP3984686A1 (de) 2020-10-16 2022-04-20 Bystronic Laser AG Verfahren, regelungseinheit und laserschneidsystem für kombinierte bahn- und laserprozessplanung für hochdynamische echtzeit-systeme
CN113203641B (zh) * 2021-03-25 2023-01-17 武汉钢铁有限公司 加工参数确定方法、样品加工方法、装置及设备
CN113245560B (zh) * 2021-06-03 2021-09-28 恒新增材制造研究中心(佛山)有限公司 一种快速获取选区激光熔化设备标准成形参数的方法
CN113453439B (zh) * 2021-07-15 2022-11-11 吉安满坤科技股份有限公司 一种传感控制Touch技术印制电路板及其制备方法
KR102893365B1 (ko) * 2025-05-02 2025-12-02 주식회사 아이쓰리엔지니어링 Abf 레이어가 있는 pcb 패널에 대한 스마트 디텍션 시스템 및 방법

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US20030012238A1 (en) * 2000-04-01 2003-01-16 Qi Wu Apparatus and method for heating a small area of an object to a high temperature and for accurately maintaining this temperature
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US7043330B2 (en) * 2002-10-31 2006-05-09 Ehsan Toyserkani System and method for closed-loop control of laser cladding by powder injection

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US5663076A (en) * 1995-08-08 1997-09-02 Lsi Logic Corporation Automating photolithography in the fabrication of integrated circuits
CN1200314A (zh) * 1997-05-26 1998-12-02 日本烟草产业株式会社 带状材料的开孔装置
US20030012238A1 (en) * 2000-04-01 2003-01-16 Qi Wu Apparatus and method for heating a small area of an object to a high temperature and for accurately maintaining this temperature
US20040105092A1 (en) * 2002-03-26 2004-06-03 Takaaki Iwata Laser beam positioning device for laser machining, apparatus
CN1675020A (zh) * 2002-08-09 2005-09-28 Tdk株式会社 激光加工设备、加工方法及利用其制造电路板的方法
US7043330B2 (en) * 2002-10-31 2006-05-09 Ehsan Toyserkani System and method for closed-loop control of laser cladding by powder injection

Also Published As

Publication number Publication date
TW201005574A (en) 2010-02-01
JP2011522706A (ja) 2011-08-04
WO2009151838A3 (en) 2010-04-22
KR101637402B1 (ko) 2016-07-20
US8173931B2 (en) 2012-05-08
CN102056705A (zh) 2011-05-11
KR20110036533A (ko) 2011-04-07
TWI475417B (zh) 2015-03-01
US20090308854A1 (en) 2009-12-17
WO2009151838A2 (en) 2009-12-17
JP5820270B2 (ja) 2015-11-24

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