JP5820270B2 - 工作物をレーザ加工するための自動レシピ管理方法 - Google Patents

工作物をレーザ加工するための自動レシピ管理方法 Download PDF

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Publication number
JP5820270B2
JP5820270B2 JP2011513523A JP2011513523A JP5820270B2 JP 5820270 B2 JP5820270 B2 JP 5820270B2 JP 2011513523 A JP2011513523 A JP 2011513523A JP 2011513523 A JP2011513523 A JP 2011513523A JP 5820270 B2 JP5820270 B2 JP 5820270B2
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workpiece
feature
laser
value
laser processing
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Japanese (ja)
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JP2011522706A5 (enExample
JP2011522706A (ja
Inventor
ウェン，リン
エミン アルペイ，メフメット
エミン アルペイ，メフメット
ハワートン，ジェフ
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/408—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by data handling or data format, e.g. reading, buffering or conversion of data
    • G05B19/4083—Adapting program, configuration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36503—Adapt program to real coordinates, software orientation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45165—Laser machining

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2011513523A 2008-06-13 2009-05-07 工作物をレーザ加工するための自動レシピ管理方法 Expired - Fee Related JP5820270B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US6143908P 2008-06-13 2008-06-13
US61/061,439 2008-06-13
US12/164,698 2008-06-30
US12/164,698 US8173931B2 (en) 2008-06-13 2008-06-30 Automatic recipe management for laser processing a work piece
PCT/US2009/043160 WO2009151838A2 (en) 2008-06-13 2009-05-07 Automatic recipe management for laser processing workpiece

Publications (3)

Publication Number Publication Date
JP2011522706A JP2011522706A (ja) 2011-08-04
JP2011522706A5 JP2011522706A5 (enExample) 2012-04-19
JP5820270B2 true JP5820270B2 (ja) 2015-11-24

Family

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Family Applications (1)

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JP2011513523A Expired - Fee Related JP5820270B2 (ja) 2008-06-13 2009-05-07 工作物をレーザ加工するための自動レシピ管理方法

Country Status (6)

Country Link
US (1) US8173931B2 (enExample)
JP (1) JP5820270B2 (enExample)
KR (1) KR101637402B1 (enExample)
CN (1) CN102056705B (enExample)
TW (1) TWI475417B (enExample)
WO (1) WO2009151838A2 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9029731B2 (en) 2007-01-26 2015-05-12 Electro Scientific Industries, Inc. Methods and systems for laser processing continuously moving sheet material
JP2012094591A (ja) * 2010-10-25 2012-05-17 Disco Abrasive Syst Ltd ビアホールの加工方法およびレーザー加工装置
FI124538B (fi) * 2012-12-21 2014-10-15 Primoceler Oy Menetelmä substraattia sisältävien kappaleiden hitsaamiseksi yhteen fokusoidun lasersäteen avulla
CN103433619B (zh) * 2013-08-30 2015-10-21 大族激光科技产业集团股份有限公司 激光熔覆打印机及线路板的制作方法
BR112016030522B1 (pt) * 2014-07-03 2019-11-05 Nippon Steel & Sumitomo Metal Corp aparelho de processamento a laser
US10509390B2 (en) 2015-02-12 2019-12-17 Glowforge Inc. Safety and reliability guarantees for laser fabrication
WO2016131022A1 (en) * 2015-02-12 2016-08-18 Glowforge Inc. Cloud controlled laser fabrication
JP6570921B2 (ja) * 2015-03-16 2019-09-04 ビアメカニクス株式会社 レーザ穴あけ加工条件の設定方法及びレーザ加工機
CN106513985B (zh) * 2016-12-29 2018-08-21 齐齐哈尔二机床(集团)有限责任公司 激光诱导成型机床
KR102068210B1 (ko) * 2018-03-09 2020-01-20 주식회사 이오테크닉스 명령어 모드를 이용한 레이저 레시피 제어 방법 및 레이저 제어 시스템
JP7283918B2 (ja) * 2019-02-20 2023-05-30 株式会社ディスコ 加工装置
JPWO2021001905A1 (ja) * 2019-07-01 2021-09-13 三菱電機株式会社 レーザ加工装置、レーザ加工方法、レーザ加工装置の制御装置および機械学習装置
CN113333958B (zh) * 2020-02-17 2023-09-22 Nps株式会社 激光加工系统及方法
KR102327453B1 (ko) * 2020-02-17 2021-11-17 (주)엔피에스 레이저 가공 시스템 및 방법
JP6818950B1 (ja) * 2020-02-21 2021-01-27 三菱電機株式会社 加工エネルギーの制御方法およびレーザ加工装置
US20230286035A1 (en) * 2020-06-30 2023-09-14 Canon Virginia, Inc. Method and system for automated wax mold assembly
CN115916451B (zh) * 2020-10-16 2024-02-20 百超激光有限公司 用于计算空间和时间分辨的、组合的设定点数据集的方法、控制单元和激光切割系统
EP3984686A1 (de) 2020-10-16 2022-04-20 Bystronic Laser AG Verfahren, regelungseinheit und laserschneidsystem für kombinierte bahn- und laserprozessplanung für hochdynamische echtzeit-systeme
CN113203641B (zh) * 2021-03-25 2023-01-17 武汉钢铁有限公司 加工参数确定方法、样品加工方法、装置及设备
CN113245560B (zh) * 2021-06-03 2021-09-28 恒新增材制造研究中心(佛山)有限公司 一种快速获取选区激光熔化设备标准成形参数的方法
CN113453439B (zh) * 2021-07-15 2022-11-11 吉安满坤科技股份有限公司 一种传感控制Touch技术印制电路板及其制备方法
KR102893365B1 (ko) * 2025-05-02 2025-12-02 주식회사 아이쓰리엔지니어링 Abf 레이어가 있는 pcb 패널에 대한 스마트 디텍션 시스템 및 방법

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3131252A (en) * 1961-06-05 1964-04-28 Hazeltine Research Inc Electronic previewer for the graphic arts
US4555610A (en) * 1983-09-13 1985-11-26 Data Card Corporation Laser machining system
JPH0276684U (enExample) * 1988-11-22 1990-06-12
JPH04190987A (ja) * 1990-11-26 1992-07-09 Murata Mach Ltd レーザ加工機
US5319183A (en) * 1992-02-18 1994-06-07 Fujitsu Limited Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards
GB9321866D0 (en) * 1993-10-22 1993-12-15 Kinsman Grant Fuzzy logic control of laser welding
US5841099A (en) 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US5593606A (en) 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5663076A (en) * 1995-08-08 1997-09-02 Lsi Logic Corporation Automating photolithography in the fabrication of integrated circuits
US6266581B1 (en) * 1996-05-10 2001-07-24 The United States Of America As Represented By The Secretary Of Commerce Spatial RAM for high precision data acquisition systems
US7732732B2 (en) * 1996-11-20 2010-06-08 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
JPH10323783A (ja) * 1997-05-26 1998-12-08 Japan Tobacco Inc 帯状材の開孔装置
JP3902710B2 (ja) * 1999-03-24 2007-04-11 株式会社牧野フライス製作所 数値制御による工作機械の制御方法及び装置
WO2001052004A1 (en) 2000-01-11 2001-07-19 Electro Scientific Industries, Inc. Abbe error correction system and method
US6407363B2 (en) 2000-03-30 2002-06-18 Electro Scientific Industries, Inc. Laser system and method for single press micromachining of multilayer workpieces
AU2001238090A1 (en) 2000-04-01 2001-10-15 Corning Incorporated Heating method and device
US7157038B2 (en) 2000-09-20 2007-01-02 Electro Scientific Industries, Inc. Ultraviolet laser ablative patterning of microstructures in semiconductors
WO2002046710A1 (en) * 2000-12-08 2002-06-13 Foundation For Research And Technology-Hellas An imaging method and apparatus for the non-destructie analysis of paintings and monuments
TW528636B (en) 2001-05-09 2003-04-21 Electro Scient Ind Inc Micromachining with high-energy, intra-cavity Q-switched CO2 laser pulses
KR20020092231A (ko) * 2001-06-01 2002-12-11 가부시끼가이샤 도시바 막질 검사 방법과 막질 검사 장치
US7280883B2 (en) * 2001-09-06 2007-10-09 Dainippon Screen Mfg. Co., Ltd. Substrate processing system managing apparatus information of substrate processing apparatus
US6875950B2 (en) 2002-03-22 2005-04-05 Gsi Lumonics Corporation Automated laser trimming of resistors
WO2003080283A1 (en) * 2002-03-26 2003-10-02 Mitsubishi Denki Kabushiki Kaisha Laser beam positioning device for laser machining, apparatus
TWI265550B (en) * 2002-05-14 2006-11-01 Toshiba Corp Fabrication method, manufacturing method for semiconductor device, and fabrication device
JP3846573B2 (ja) * 2002-06-14 2006-11-15 三菱電機株式会社 レーザ加工装置及び該加工装置の制御方法
JP2004066327A (ja) * 2002-08-09 2004-03-04 Tdk Corp レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法
CA2504368C (en) * 2002-10-31 2012-07-10 Ehsan Toyserkani System and method for closed-loop control of laser cladding by powder injection
US7364952B2 (en) * 2003-09-16 2008-04-29 The Trustees Of Columbia University In The City Of New York Systems and methods for processing thin films
US7250309B2 (en) * 2004-01-09 2007-07-31 Applied Materials, Inc. Integrated phase angle and optical critical dimension measurement metrology for feed forward and feedback process control
FR2869558B1 (fr) 2004-04-29 2006-09-01 Vai Clecim Soc Par Actions Sim Procede de reglage de l'epaisseur du cordon de soudure de deux toles metalliques
US7342664B1 (en) * 2004-05-06 2008-03-11 Juliusz George Radziszewski Scanning double-beam interferometer
US7985942B2 (en) 2004-05-28 2011-07-26 Electro Scientific Industries, Inc. Method of providing consistent quality of target material removal by lasers having different output performance characteristics
US7133188B2 (en) 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM modulation techniques employing an upstream Bragg adjustment device
US7425719B2 (en) * 2005-01-13 2008-09-16 Wd Media, Inc. Method and apparatus for selectively providing data from a test head to a processor
US7279657B2 (en) 2005-06-13 2007-10-09 Applied Materials, Inc. Scanned rapid thermal processing with feed forward control
US7244906B2 (en) 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
JP2007095952A (ja) * 2005-09-28 2007-04-12 Tokyo Seimitsu Co Ltd レーザーダイシング装置及びレーザーダイシング方法
JP2007237199A (ja) * 2006-03-06 2007-09-20 Sumitomo Heavy Ind Ltd レーザ加工装置及びレーザ加工方法
US8198566B2 (en) * 2006-05-24 2012-06-12 Electro Scientific Industries, Inc. Laser processing of workpieces containing low-k dielectric material
US7848835B2 (en) * 2006-06-02 2010-12-07 Cymer, Inc. High power laser flat panel workpiece treatment system controller

Also Published As

Publication number Publication date
TW201005574A (en) 2010-02-01
JP2011522706A (ja) 2011-08-04
CN102056705B (zh) 2016-01-06
WO2009151838A3 (en) 2010-04-22
KR101637402B1 (ko) 2016-07-20
US8173931B2 (en) 2012-05-08
CN102056705A (zh) 2011-05-11
KR20110036533A (ko) 2011-04-07
TWI475417B (zh) 2015-03-01
US20090308854A1 (en) 2009-12-17
WO2009151838A2 (en) 2009-12-17

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