JP5820270B2 - 工作物をレーザ加工するための自動レシピ管理方法 - Google Patents

工作物をレーザ加工するための自動レシピ管理方法 Download PDF

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Publication number
JP5820270B2
JP5820270B2 JP2011513523A JP2011513523A JP5820270B2 JP 5820270 B2 JP5820270 B2 JP 5820270B2 JP 2011513523 A JP2011513523 A JP 2011513523A JP 2011513523 A JP2011513523 A JP 2011513523A JP 5820270 B2 JP5820270 B2 JP 5820270B2
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workpiece
feature
laser
value
laser processing
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English (en)
Japanese (ja)
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JP2011522706A5 (enExample
JP2011522706A (ja
Inventor
ウェン，リン
エミン アルペイ，メフメット
エミン アルペイ，メフメット
ハワートン，ジェフ
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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Publication of JP2011522706A publication Critical patent/JP2011522706A/ja
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/408—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by data handling or data format, e.g. reading, buffering or conversion of data
    • G05B19/4083—Adapting programme, configuration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36503—Adapt program to real coordinates, software orientation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45165—Laser machining

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2011513523A 2008-06-13 2009-05-07 工作物をレーザ加工するための自動レシピ管理方法 Expired - Fee Related JP5820270B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US6143908P 2008-06-13 2008-06-13
US61/061,439 2008-06-13
US12/164,698 US8173931B2 (en) 2008-06-13 2008-06-30 Automatic recipe management for laser processing a work piece
US12/164,698 2008-06-30
PCT/US2009/043160 WO2009151838A2 (en) 2008-06-13 2009-05-07 Automatic recipe management for laser processing workpiece

Publications (3)

Publication Number Publication Date
JP2011522706A JP2011522706A (ja) 2011-08-04
JP2011522706A5 JP2011522706A5 (enExample) 2012-04-19
JP5820270B2 true JP5820270B2 (ja) 2015-11-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011513523A Expired - Fee Related JP5820270B2 (ja) 2008-06-13 2009-05-07 工作物をレーザ加工するための自動レシピ管理方法

Country Status (6)

Country Link
US (1) US8173931B2 (enExample)
JP (1) JP5820270B2 (enExample)
KR (1) KR101637402B1 (enExample)
CN (1) CN102056705B (enExample)
TW (1) TWI475417B (enExample)
WO (1) WO2009151838A2 (enExample)

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CN106513985B (zh) * 2016-12-29 2018-08-21 齐齐哈尔二机床(集团)有限责任公司 激光诱导成型机床
KR102068210B1 (ko) * 2018-03-09 2020-01-20 주식회사 이오테크닉스 명령어 모드를 이용한 레이저 레시피 제어 방법 및 레이저 제어 시스템
JP7283918B2 (ja) * 2019-02-20 2023-05-30 株式会社ディスコ 加工装置
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CN113333958B (zh) * 2020-02-17 2023-09-22 Nps株式会社 激光加工系统及方法
KR102327453B1 (ko) * 2020-02-17 2021-11-17 (주)엔피에스 레이저 가공 시스템 및 방법
JP6818950B1 (ja) * 2020-02-21 2021-01-27 三菱電機株式会社 加工エネルギーの制御方法およびレーザ加工装置
US20230286035A1 (en) * 2020-06-30 2023-09-14 Canon Virginia, Inc. Method and system for automated wax mold assembly
EP3984686A1 (de) 2020-10-16 2022-04-20 Bystronic Laser AG Verfahren, regelungseinheit und laserschneidsystem für kombinierte bahn- und laserprozessplanung für hochdynamische echtzeit-systeme
CN115916451B (zh) * 2020-10-16 2024-02-20 百超激光有限公司 用于计算空间和时间分辨的、组合的设定点数据集的方法、控制单元和激光切割系统
CN113203641B (zh) * 2021-03-25 2023-01-17 武汉钢铁有限公司 加工参数确定方法、样品加工方法、装置及设备
CN113245560B (zh) * 2021-06-03 2021-09-28 恒新增材制造研究中心(佛山)有限公司 一种快速获取选区激光熔化设备标准成形参数的方法
CN113453439B (zh) * 2021-07-15 2022-11-11 吉安满坤科技股份有限公司 一种传感控制Touch技术印制电路板及其制备方法

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Also Published As

Publication number Publication date
US20090308854A1 (en) 2009-12-17
TW201005574A (en) 2010-02-01
TWI475417B (zh) 2015-03-01
KR20110036533A (ko) 2011-04-07
WO2009151838A3 (en) 2010-04-22
CN102056705B (zh) 2016-01-06
CN102056705A (zh) 2011-05-11
WO2009151838A2 (en) 2009-12-17
JP2011522706A (ja) 2011-08-04
US8173931B2 (en) 2012-05-08
KR101637402B1 (ko) 2016-07-20

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