KR101637402B1 - 가공물을 레이저 처리하기 위한 자동 레시피 관리 - Google Patents

가공물을 레이저 처리하기 위한 자동 레시피 관리 Download PDF

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Publication number
KR101637402B1
KR101637402B1 KR1020107027884A KR20107027884A KR101637402B1 KR 101637402 B1 KR101637402 B1 KR 101637402B1 KR 1020107027884 A KR1020107027884 A KR 1020107027884A KR 20107027884 A KR20107027884 A KR 20107027884A KR 101637402 B1 KR101637402 B1 KR 101637402B1
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South Korea
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workpiece
features
laser
workpieces
processing
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Expired - Fee Related
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English (en)
Korean (ko)
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KR20110036533A (ko
Inventor
링 웬
메멧 에민 알패이
제프 하워톤
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일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/408—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by data handling or data format, e.g. reading, buffering or conversion of data
    • G05B19/4083—Adapting programme, configuration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36503—Adapt program to real coordinates, software orientation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45165—Laser machining

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020107027884A 2008-06-13 2009-05-07 가공물을 레이저 처리하기 위한 자동 레시피 관리 Expired - Fee Related KR101637402B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US6143908P 2008-06-13 2008-06-13
US61/061,439 2008-06-13
US12/164,698 US8173931B2 (en) 2008-06-13 2008-06-30 Automatic recipe management for laser processing a work piece
US12/164,698 2008-06-30

Publications (2)

Publication Number Publication Date
KR20110036533A KR20110036533A (ko) 2011-04-07
KR101637402B1 true KR101637402B1 (ko) 2016-07-20

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KR1020107027884A Expired - Fee Related KR101637402B1 (ko) 2008-06-13 2009-05-07 가공물을 레이저 처리하기 위한 자동 레시피 관리

Country Status (6)

Country Link
US (1) US8173931B2 (enExample)
JP (1) JP5820270B2 (enExample)
KR (1) KR101637402B1 (enExample)
CN (1) CN102056705B (enExample)
TW (1) TWI475417B (enExample)
WO (1) WO2009151838A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190106597A (ko) * 2018-03-09 2019-09-18 주식회사 이오테크닉스 명령어 모드를 이용한 레이저 레시피 제어 방법 및 레이저 제어 시스템
KR20210104519A (ko) * 2020-02-17 2021-08-25 (주)엔피에스 레이저 가공 시스템 및 방법

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CN103433619B (zh) * 2013-08-30 2015-10-21 大族激光科技产业集团股份有限公司 激光熔覆打印机及线路板的制作方法
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JP6570921B2 (ja) * 2015-03-16 2019-09-04 ビアメカニクス株式会社 レーザ穴あけ加工条件の設定方法及びレーザ加工機
CN106513985B (zh) * 2016-12-29 2018-08-21 齐齐哈尔二机床(集团)有限责任公司 激光诱导成型机床
JP7283918B2 (ja) * 2019-02-20 2023-05-30 株式会社ディスコ 加工装置
JPWO2021001905A1 (ja) * 2019-07-01 2021-09-13 三菱電機株式会社 レーザ加工装置、レーザ加工方法、レーザ加工装置の制御装置および機械学習装置
CN113333958B (zh) * 2020-02-17 2023-09-22 Nps株式会社 激光加工系统及方法
JP6818950B1 (ja) * 2020-02-21 2021-01-27 三菱電機株式会社 加工エネルギーの制御方法およびレーザ加工装置
US20230286035A1 (en) * 2020-06-30 2023-09-14 Canon Virginia, Inc. Method and system for automated wax mold assembly
EP3984686A1 (de) 2020-10-16 2022-04-20 Bystronic Laser AG Verfahren, regelungseinheit und laserschneidsystem für kombinierte bahn- und laserprozessplanung für hochdynamische echtzeit-systeme
CN115916451B (zh) * 2020-10-16 2024-02-20 百超激光有限公司 用于计算空间和时间分辨的、组合的设定点数据集的方法、控制单元和激光切割系统
CN113203641B (zh) * 2021-03-25 2023-01-17 武汉钢铁有限公司 加工参数确定方法、样品加工方法、装置及设备
CN113245560B (zh) * 2021-06-03 2021-09-28 恒新增材制造研究中心(佛山)有限公司 一种快速获取选区激光熔化设备标准成形参数的方法
CN113453439B (zh) * 2021-07-15 2022-11-11 吉安满坤科技股份有限公司 一种传感控制Touch技术印制电路板及其制备方法

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Cited By (4)

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Publication number Priority date Publication date Assignee Title
KR20190106597A (ko) * 2018-03-09 2019-09-18 주식회사 이오테크닉스 명령어 모드를 이용한 레이저 레시피 제어 방법 및 레이저 제어 시스템
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Publication number Publication date
US20090308854A1 (en) 2009-12-17
TW201005574A (en) 2010-02-01
JP5820270B2 (ja) 2015-11-24
TWI475417B (zh) 2015-03-01
KR20110036533A (ko) 2011-04-07
WO2009151838A3 (en) 2010-04-22
CN102056705B (zh) 2016-01-06
CN102056705A (zh) 2011-05-11
WO2009151838A2 (en) 2009-12-17
JP2011522706A (ja) 2011-08-04
US8173931B2 (en) 2012-05-08

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