JP2015519008A5 - - Google Patents

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Publication number
JP2015519008A5
JP2015519008A5 JP2015511630A JP2015511630A JP2015519008A5 JP 2015519008 A5 JP2015519008 A5 JP 2015519008A5 JP 2015511630 A JP2015511630 A JP 2015511630A JP 2015511630 A JP2015511630 A JP 2015511630A JP 2015519008 A5 JP2015519008 A5 JP 2015519008A5
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JP
Japan
Prior art keywords
laser
substrate
facet
etch
semiconductor chip
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JP2015511630A
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English (en)
Japanese (ja)
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JP6220864B2 (ja
JP2015519008A (ja
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Priority claimed from PCT/US2013/039971 external-priority patent/WO2013169796A1/en
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Publication of JP2015519008A5 publication Critical patent/JP2015519008A5/ja
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JP2015511630A 2012-05-08 2013-05-07 ビーム形状の改良を伴うレーザ Active JP6220864B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261644270P 2012-05-08 2012-05-08
US61/644,270 2012-05-08
PCT/US2013/039971 WO2013169796A1 (en) 2012-05-08 2013-05-07 Lasers with beam-shape modification

Publications (3)

Publication Number Publication Date
JP2015519008A JP2015519008A (ja) 2015-07-06
JP2015519008A5 true JP2015519008A5 (enExample) 2016-06-30
JP6220864B2 JP6220864B2 (ja) 2017-10-25

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Family Applications (1)

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JP2015511630A Active JP6220864B2 (ja) 2012-05-08 2013-05-07 ビーム形状の改良を伴うレーザ

Country Status (5)

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US (3) US9401582B2 (enExample)
EP (2) EP2847834B1 (enExample)
JP (1) JP6220864B2 (enExample)
CN (3) CN107579428B (enExample)
WO (1) WO2013169796A1 (enExample)

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CN114336279A (zh) * 2021-12-20 2022-04-12 华侨大学 实现表面等离激元激光输出到远场的装置
CN114006261B (zh) * 2022-01-04 2022-03-11 福建慧芯激光科技有限公司 一种具有圆形光斑的垂直腔面发射激光器
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