JP2009295952A5 - - Google Patents
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- Publication number
- JP2009295952A5 JP2009295952A5 JP2008236026A JP2008236026A JP2009295952A5 JP 2009295952 A5 JP2009295952 A5 JP 2009295952A5 JP 2008236026 A JP2008236026 A JP 2008236026A JP 2008236026 A JP2008236026 A JP 2008236026A JP 2009295952 A5 JP2009295952 A5 JP 2009295952A5
- Authority
- JP
- Japan
- Prior art keywords
- groove
- manufacturing
- laser device
- semiconductor laser
- nitride semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 13
- 238000004519 manufacturing process Methods 0.000 claims 8
- 150000004767 nitrides Chemical class 0.000 claims 7
- 238000005530 etching Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008236026A JP5223552B2 (ja) | 2008-05-02 | 2008-09-16 | 窒化物半導体レーザ素子の製造方法 |
| US12/431,393 US8053262B2 (en) | 2008-05-02 | 2009-04-28 | Method for manufacturing nitride semiconductor laser element |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008120446 | 2008-05-02 | ||
| JP2008120446 | 2008-05-02 | ||
| JP2008236026A JP5223552B2 (ja) | 2008-05-02 | 2008-09-16 | 窒化物半導体レーザ素子の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009295952A JP2009295952A (ja) | 2009-12-17 |
| JP2009295952A5 true JP2009295952A5 (enExample) | 2011-09-22 |
| JP5223552B2 JP5223552B2 (ja) | 2013-06-26 |
Family
ID=41257376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008236026A Active JP5223552B2 (ja) | 2008-05-02 | 2008-09-16 | 窒化物半導体レーザ素子の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8053262B2 (enExample) |
| JP (1) | JP5223552B2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100999779B1 (ko) | 2010-02-01 | 2010-12-08 | 엘지이노텍 주식회사 | 발광소자, 발광소자의 제조방법 및 발광소자 패키지 |
| KR101125334B1 (ko) * | 2010-04-09 | 2012-03-27 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
| CN102122686A (zh) * | 2011-01-17 | 2011-07-13 | 泉州市金太阳电子科技有限公司 | 发光二极管的制造方法 |
| CN107579428B (zh) | 2012-05-08 | 2020-03-03 | 镁可微波技术有限公司 | 具有光束形状修改的激光器 |
| JP6357654B2 (ja) * | 2013-04-17 | 2018-07-18 | パナソニックIpマネジメント株式会社 | 化合物半導体装置および樹脂封止型半導体装置 |
| DE102016101942B4 (de) | 2016-02-04 | 2022-07-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung |
| CN109565141B (zh) * | 2016-07-28 | 2021-03-05 | 三菱电机株式会社 | 平面波导型激光装置 |
| WO2019186743A1 (ja) * | 2018-03-28 | 2019-10-03 | 三菱電機株式会社 | 半導体レーザ素子およびその製造方法 |
| JP7468361B2 (ja) * | 2018-12-13 | 2024-04-16 | ソニーグループ株式会社 | 半導体装置及び半導体装置の製造方法 |
| CN111279564B (zh) * | 2019-05-28 | 2023-07-04 | 厦门三安光电有限公司 | 一种激光二极管及其制作方法 |
| US20210313760A1 (en) * | 2020-04-06 | 2021-10-07 | Asahi Kasei Kabushiki Kaisha | Method for manufacturing semiconductor laser diode and semiconductor laser diode |
| JP2022073701A (ja) * | 2020-11-02 | 2022-05-17 | パナソニックホールディングス株式会社 | 半導体レーザ素子、及び半導体レーザ素子の製造方法 |
| DE102020130017A1 (de) * | 2020-11-13 | 2022-05-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum herstellen einer mehrzahl von halbleiterlasern und halbleiterlaser |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833435A (en) * | 1972-09-25 | 1974-09-03 | Bell Telephone Labor Inc | Dielectric optical waveguides and technique for fabricating same |
| GB8518353D0 (en) * | 1985-07-20 | 1985-08-29 | Plessey Co Plc | Heterostructure device |
| JPS62283686A (ja) * | 1986-05-31 | 1987-12-09 | Mitsubishi Electric Corp | 半導体レ−ザの製造方法 |
| JPS62286294A (ja) * | 1986-06-04 | 1987-12-12 | Oki Electric Ind Co Ltd | 半導体レ−ザの製造方法 |
| DE3731312C2 (de) | 1987-09-17 | 1997-02-13 | Siemens Ag | Verfahren zum Vereinzeln von monolithisch hergestellten Laserdioden |
| JPH0283990A (ja) * | 1988-09-20 | 1990-03-26 | Nec Corp | 半導体発光装置の製造方法 |
| JP2869279B2 (ja) * | 1992-09-16 | 1999-03-10 | 三菱電機株式会社 | 半導体レーザダイオード及びその製造方法並びに半導体レーザダイオードアレイ |
| US5838029A (en) * | 1994-08-22 | 1998-11-17 | Rohm Co., Ltd. | GaN-type light emitting device formed on a silicon substrate |
| JP3184440B2 (ja) * | 1995-02-10 | 2001-07-09 | 株式会社リコー | 半導体発光装置 |
| JP3490229B2 (ja) | 1995-12-15 | 2004-01-26 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子の製造方法 |
| JP2000106470A (ja) | 1998-09-29 | 2000-04-11 | Sharp Corp | 半導体レーザ素子の製造方法及び半導体レーザ素子 |
| JP2000114666A (ja) | 1998-10-09 | 2000-04-21 | Sanyo Electric Co Ltd | 半導体発光素子およびその製造方法 |
| JP2001244569A (ja) * | 2000-03-01 | 2001-09-07 | Sony Corp | 半導体レーザ発光装置の製造方法 |
| JP2001267555A (ja) * | 2000-03-22 | 2001-09-28 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| WO2002103866A1 (en) | 2001-06-15 | 2002-12-27 | Nichia Corporation | Semiconductor laser element, and its manufacturing method |
| JP2002270968A (ja) * | 2002-02-13 | 2002-09-20 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子の製造方法 |
| JP4032836B2 (ja) * | 2002-06-11 | 2008-01-16 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
| JPWO2004086580A1 (ja) * | 2003-03-26 | 2006-06-29 | 日本電気株式会社 | 半導体レーザおよびその製造方法 |
| KR100541111B1 (ko) * | 2004-06-25 | 2006-01-11 | 삼성전기주식회사 | 다파장 반도체 레이저 제조방법 |
| JP2006024703A (ja) | 2004-07-07 | 2006-01-26 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子 |
| US8138002B2 (en) * | 2008-08-21 | 2012-03-20 | Sony Corporation | Semiconductor light-emitting element, fabrication method thereof, convex part formed on backing, and convex part formation method for backing |
-
2008
- 2008-09-16 JP JP2008236026A patent/JP5223552B2/ja active Active
-
2009
- 2009-04-28 US US12/431,393 patent/US8053262B2/en active Active
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