JP2015503215A - 炭化ケイ素エピタキシャル成長法 - Google Patents
炭化ケイ素エピタキシャル成長法 Download PDFInfo
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- JP2015503215A JP2015503215A JP2014537716A JP2014537716A JP2015503215A JP 2015503215 A JP2015503215 A JP 2015503215A JP 2014537716 A JP2014537716 A JP 2014537716A JP 2014537716 A JP2014537716 A JP 2014537716A JP 2015503215 A JP2015503215 A JP 2015503215A
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 144
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 105
- 238000000034 method Methods 0.000 title claims description 48
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 88
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 88
- 239000010703 silicon Substances 0.000 claims abstract description 88
- 230000000873 masking effect Effects 0.000 claims abstract description 68
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 15
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 13
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 134
- 235000012431 wafers Nutrition 0.000 description 87
- 239000013078 crystal Substances 0.000 description 17
- 239000007789 gas Substances 0.000 description 12
- 229910021417 amorphous silicon Inorganic materials 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 2
- 239000005052 trichlorosilane Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 241001502050 Acis Species 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 241000252506 Characiformes Species 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 101100460147 Sarcophaga bullata NEMS gene Proteins 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 210000000746 body region Anatomy 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001534 heteroepitaxy Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005092 sublimation method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 238000009279 wet oxidation reaction Methods 0.000 description 1
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Abstract
Description
Claims (39)
- シリコンウェハーの対応する領域を露出させるウィンドウを有するマスキング層を支持する主面を有する単結晶シリコンウェハーを用意すること、
ウェハーの露出された領域上に炭化ケイ素シード領域を形成すること、及び
炭化ケイ素シード層上に単結晶炭化ケイ素を成長させること、
を含む方法。 - マスキング層を支持する主面を有する単結晶シリコンウェハーを用意することが、
単結晶シリコンウェハーを用意すること、
該シリコンウェハー上にマスキング層を、マスキング層が該主面の直接上に在るようにして形成すること、
マスキング層上にウィンドウを有するエッチマスクを提供すること、及び
エッチマスク中のウィンドウを通してマスキング層をエッチングして、ウェハーの主面に達すること、
を含む請求項1に記載の方法。 - マスキング層が誘電体層である、請求項1又は2記載の方法。
- 誘電体層が二酸化ケイ素層である、請求項3記載の方法。
- 二酸化ケイ素層が熱酸化により形成された層である、請求項4記載の方法。
- マスキング層が半導体又は導電性物質の層である、請求項1又は2記載の方法。
- マスキング層が、多結晶シリコンの層である、請求項1又は2記載の方法。
- マスキング層が、第一の層及び第二の層を含む2層構造を含む、上記請求項のいずれか1項記載の方法。
- マスキング層が、2,000 〜10,000 Åの厚みを有する、上記請求項のいずれか1項記載の層。
- マスキング層が、4,000 〜6,000Åの厚みを有する、上記請求項のいずれか1項記載の層。
- 主面が第一主面であり及びマスキング層が第一マスキング層であり、並びに、シリコンウェハーが第二マスキング層を支持する、反対側の第二主面を有する、上記請求項のいずれか1項記載の方法。
- 第一マスキング層と第二マスキング層が同一材料を含む、請求項11記載の方法。
- 炭化ケイ素シード層領域を形成することが、
ウェハーの露出された領域に炭素を堆積させること、及び
炭素を炭化ケイ素へと転換すること、
を含む、上記請求項のいずれか1項記載の方法。 - 炭化ケイ素を成長させることが、
少なくとも0.5 μm、所望により少なくとも 1 μm、所望により少なくとも2 μm及び/又は所望により少なくとも5μmの厚みを有する炭化ケイ素を成長させること、
を含む、上記請求項のいずれか1項記載の方法。 - 炭化ケイ素層を成長させることが、5 μm以下又は 10 μm以下の厚みを有する炭化ケイ素を成長させることを含む、上記請求項のいずれか1項記載の方法。
- 炭化ケイ素層を成長させることが、三層立方晶炭化ケイ素を成長させることを含む、上記請求項のいずれか1項記載の方法。
- ウェハーが少なくとも4インチ(101.6 mm)又は100 mmの直径を有する、上記請求項のいずれか1項記載の方法。
- ウェハーが少なくとも500μmの厚みを有する、上記請求項のいずれか1項記載の方法。
- 炭化ケイ素を処理して半導体デバイスを形成することをさらに含む、上記請求項のいずれか1項記載の方法。
- ウィンドウとウィンドウの間でマスキング層及びシリコンウェハーを切断してダイを形成することをさらに含む、上記請求項のいずれか1項記載の方法。
- ウィンドウが、ウィンドウとウィンドウの間の第二幅より、実質的に広い第一幅を有する、上記請求項のいずれか1項記載の方法。
- ウィンドウが5 mm 〜20 mmの幅及び/又は長さを有する、上記請求項のいずれか1項記載の方法。
- ウィンドウが、1 mm未満、500μm未満、又は 200μm未満の幅で分離されている、上記請求項のいずれか1項記載の方法。
- ウィンドウが約100 μmの幅で分離されている、上記請求項のいずれか1項記載の方法。
- 上記請求項のいずれか1項記載の方法を含む、半導体ダイを形成する方法。
- 請求項26に記載の方法により半導体ダイを形成すること、及び
半導体ダイをパッケージすること、
を含む方法。 - 主面を有する単結晶シリコンウェハー;及び
分離して配置され、該ウェハーの主面上に直接配置された単結晶炭化ケイ素層、
を含むシリコン半導体構造。 - 各炭化ケイ素層が、
該シリコンウェハーの主面上に直接形成された炭化ケイ素シード層;及び
該炭化ケイ素シード層上に直接配置された単結晶炭化ケイ素層、
を含む、請求項28記載の半導体構造。 - 炭化ケイ素層が、三層立方晶炭化ケイ素を含む、請求項28又は29記載の半導体構造。
- 該シリコンウェハーの主面上に支持されたマスキング層であって、単結晶炭化ケイ素層を分離して配置させるウィンドウを有する、マスキング層をさらに含む、請求項28〜30のいずれか1項記載の半導体構造。
- 炭化ケイ素層の間に配置された(複数の)多結晶炭化ケイ素層をさらに含む、請求項28〜31のいずれか1項記載の半導体構造。
- 多結晶及び単結晶炭化ケイ素層が単一の炭化ケイ素層中の異なる領域に形成されている、請求項32記載の半導体構造。
- 主面及び周縁を有する単結晶シリコン基板であって、該シリコン基板の周縁に隣接して延びる外側の環状領域及び該外側領域の内側に配置された内側領域を含む、シリコン基板、及び
基板の、外側領域上ではなく内側領域の主面上に直接配置された単結晶炭化ケイ素層、
を含む半導体デバイス。 - 炭化ケイ素層が、
シリコン基板の主面上に直接形成された単結晶炭化ケイ素シード領域、及び
該炭化ケイ素シード領域上に直接配置された単結晶炭化ケイ素層、
を含む請求項34記載の半導体デバイス。 - 炭化ケイ素層が、三層立方晶炭化ケイ素を含む、請求項34又は35記載の半導体デバイス。
- シリコン基板の、内側領域上ではなく外側領域上の主面上に支持されたマスキング層をさらに含む、請求項34〜36のいずれか1項記載の半導体デバイス。
- 内側領域上ではなく外側領域上に配置された多結晶炭化ケイ素層をさらに含む、請求項34〜37のいずれか1項記載の半導体デバイス。
- 多結晶単結晶炭化ケイ素層が、単一の炭化ケイ素層の異なる領域に形成されている、請求項38記載の半導体デバイス。
- 内側領域が5 mm〜20 mmの幅及び/又は長さを有する、請求項34〜39のいずれか1項記載の半導体デバイス。
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PCT/GB2012/052627 WO2013061047A2 (en) | 2011-10-26 | 2012-10-23 | Silicon carbide epitaxy |
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US9082811B2 (en) | 2015-07-14 |
WO2013061047A3 (en) | 2013-06-20 |
GB2495949B (en) | 2015-03-11 |
KR20140082839A (ko) | 2014-07-02 |
CN103946953A (zh) | 2014-07-23 |
US20150206743A1 (en) | 2015-07-23 |
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EP2771903A2 (en) | 2014-09-03 |
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