JP2015501427A - 高密度導電部を有するテスト用ソケット及びその製造方法 - Google Patents
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/002—Maintenance of line connectors, e.g. cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims (13)
- 被検査デバイスと検査装置との間に配置され、前記被検査デバイスの端子と、検査装置のパッドとを互いに電気的に連結するテスト用ソケットであって、
被検査デバイスの端子と対応する位置に配置されるが、弾性物質内に、多数の第1導電性粒子が厚み方向に配列される第1導電部と、前記第1導電部を支持しながら、隣接した第1導電部から絶縁させる絶縁性支持部と、を含む弾性導電シートと、
前記弾性導電シートの上面側及び下面側のうち少なくともいずれか一方に付着されるが、前記被検査デバイスの端子と対応する位置ごとに、貫通孔が形成される支持シートと、
前記支持シートの貫通孔内に配置されるが、弾性物質内に、多数の第2導電性粒子が厚み方向に配置される第2導電部と、を含んで構成されるが、
前記第2導電性粒子は、前記第1導電性粒子より、前記弾性物質内に高密度に配置されていることを特徴とする高密度導電部を有するテスト用ソケット。 - 前記第2導電性粒子の平均粒径は、前記第1導電性粒子の平均粒径より小さいことを特徴とする請求項1に記載の高密度導電部を有するテスト用ソケット。
- 前記第2導電性粒子の平均粒径は、前記第1導電性粒子の平均粒径より2〜10倍ほど小さいことを特徴とする請求項2に記載の高密度導電部を有するテスト用ソケット。
- 前記第2導電部は、前記貫通孔内に一体的に付着していることを特徴とする請求項1に記載の高密度導電部を有するテスト用ソケット。
- 前記第2導電部は、前記第1導電部に一体的に付着していること特徴とする請求項1に記載の高密度導電部を有するテスト用ソケット。
- 前記支持シートは、前記絶縁性支持部より高強度であることを特徴とする請求項1に記載の高密度導電部を有するテスト用ソケット。
- 前記支持シートには、互いに隣接した第2導電部を互いに独立して作動させる分離部が形成されることを特徴とする請求項1に記載の高密度導電部を有するテスト用ソケット。
- 前記分離部は、支持シートを切断して形成される切断溝または切断ホールであることを特徴とする請求項7に記載の高密度導電部を有するテスト用ソケット。
- 被検査デバイスと検査装置との間に配置され、前記被検査デバイスの端子と、検査装置のパッドとを互いに電気的に連結するテスト用ソケットの製造方法であって、
シート状の支持シートに、前記被検査デバイスの端子と対応する位置ごとに、多数の貫通孔を形成する段階と、
内部に空洞が形成された金型を準備し、前記空洞内に、前記シート状の支持シートを配置する段階と、
前記貫通孔内に、多数の第2導電性粒子が分布している液状弾性物質を充填する段階と、
前記空洞内に、第1導電性粒子が分布している液状弾性物質を充填する段階と、
磁場を加え、前記第1導電性粒子を、被検査デバイスの端子と対応する位置ごとに、一列に配置させる段階と、を含むが、
一列に配置される第1導電性粒子より、前記貫通孔内に分布された第2導電性粒子が高密度に密集されるように、前記液状弾性物質内に分布される第2導電性粒子の数を決定することを特徴とする高密度導電部を有するテスト用ソケットの製造方法。 - 前記第2導電性粒子の平均粒径は、前記第1導電性粒子の平均粒径より小さいことを特徴とする請求項9に記載の高密度導電部を有するテスト用ソケットの製造方法。
- 前記第2導電性粒子の平均粒径は、前記第1導電性粒子の平均粒径と同等であることを特徴とする請求項9に記載の高密度導電部を有するテスト用ソケットの製造方法。
- 被検査デバイスと検査装置との間に配置され、前記被検査デバイスの端子と、検査装置のパッドとを互いに電気的に連結するテスト用ソケットの製造方法であって、
シート状の支持シートに、前記被検査デバイスの端子と対応する位置ごとに、多数の貫通孔を形成する段階と、
前記貫通孔内に、多数の第2導電性粒子が分布された液状弾性物質を充填し、前記液状弾性物質を硬化させる段階と、
金型内に、多数の第1導電性粒子が分布された液状弾性物質を充填した後、被検査デバイスの端子と対応する位置ごとに磁場を加え、前記第1導電性粒子を一列に配置し、前記液状弾性物質を硬化させて弾性導電シートを製作する段階と、
前記弾性導電シートの上面及び下面のうち少なくともいずれか一方に、前記支持シートを付着させる段階と、を含むことを特徴とする高密度導電部を有するテスト用ソケットの製造方法。 - 前記弾性導電シートと、前記支持シートは、接着物質によって互いに接着されることを特徴とする請求項12に記載の高密度導電部を有するテスト用ソケットの製造方法。
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KR1020120034578A KR101266124B1 (ko) | 2012-04-03 | 2012-04-03 | 고밀도 도전부를 가지는 테스트용 소켓 및 그 제조방법 |
KR10-2012-0034578 | 2012-04-03 | ||
PCT/KR2013/002748 WO2013151316A1 (ko) | 2012-04-03 | 2013-04-03 | 고밀도 도전부를 가지는 테스트용 소켓 및 그 제조방법 |
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US (1) | US9488675B2 (ja) |
JP (1) | JP5950366B2 (ja) |
KR (1) | KR101266124B1 (ja) |
CN (1) | CN103959577B (ja) |
TW (1) | TWI470232B (ja) |
WO (1) | WO2013151316A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018030438A1 (ja) * | 2016-08-08 | 2018-02-15 | 積水化学工業株式会社 | 導通検査装置用部材及び導通検査装置 |
WO2019045426A1 (ko) * | 2017-08-31 | 2019-03-07 | 주식회사 아이에스시 | 검사용 소켓 및 도전성 입자 |
WO2020095656A1 (ja) | 2018-11-05 | 2020-05-14 | Nok株式会社 | 導電性部材の製造方法 |
KR102270276B1 (ko) * | 2020-04-10 | 2021-06-28 | 주식회사 오킨스전자 | 테스트 러버 소켓 및 그 제조 방법 |
KR102270278B1 (ko) * | 2020-04-10 | 2021-06-28 | 주식회사 오킨스전자 | 테스트 러버 소켓의 제조 방법 |
KR102310726B1 (ko) * | 2021-03-05 | 2021-10-12 | (주)위드멤스 | 플렉서블 컨택터 및 그 제조 방법 |
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KR101266124B1 (ko) | 2013-05-27 |
TWI470232B (zh) | 2015-01-21 |
US9488675B2 (en) | 2016-11-08 |
CN103959577B (zh) | 2016-09-07 |
WO2013151316A1 (ko) | 2013-10-10 |
CN103959577A (zh) | 2014-07-30 |
US20150293147A1 (en) | 2015-10-15 |
JP5950366B2 (ja) | 2016-07-13 |
TW201346266A (zh) | 2013-11-16 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |