JP2015193916A5 - - Google Patents
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- Publication number
- JP2015193916A5 JP2015193916A5 JP2015043901A JP2015043901A JP2015193916A5 JP 2015193916 A5 JP2015193916 A5 JP 2015193916A5 JP 2015043901 A JP2015043901 A JP 2015043901A JP 2015043901 A JP2015043901 A JP 2015043901A JP 2015193916 A5 JP2015193916 A5 JP 2015193916A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- electroplating bath
- constituting
- tin
- bath according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- -1 aliphatic aldehydes Chemical class 0.000 claims 8
- 238000009713 electroplating Methods 0.000 claims 8
- 150000003839 salts Chemical class 0.000 claims 5
- 239000002736 nonionic surfactant Substances 0.000 claims 4
- 229910001128 Sn alloy Inorganic materials 0.000 claims 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 3
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 125000005702 oxyalkylene group Chemical group 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- 239000004094 surface-active agent Substances 0.000 claims 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 claims 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims 2
- JAEZSIYNWDWMMN-UHFFFAOYSA-N 1,1,3-trimethylthiourea Chemical compound CNC(=S)N(C)C JAEZSIYNWDWMMN-UHFFFAOYSA-N 0.000 claims 1
- KREOCUNMMFZOOS-UHFFFAOYSA-N 1,3-di(propan-2-yl)thiourea Chemical compound CC(C)NC(S)=NC(C)C KREOCUNMMFZOOS-UHFFFAOYSA-N 0.000 claims 1
- YAFIBTDNARUFOG-UHFFFAOYSA-N 2-hydroxy-2-sulfanylpropanoic acid Chemical compound CC(O)(S)C(O)=O YAFIBTDNARUFOG-UHFFFAOYSA-N 0.000 claims 1
- RYYXDZDBXNUPOG-UHFFFAOYSA-N 4,5,6,7-tetrahydro-1,3-benzothiazole-2,6-diamine;dihydrochloride Chemical compound Cl.Cl.C1C(N)CCC2=C1SC(N)=N2 RYYXDZDBXNUPOG-UHFFFAOYSA-N 0.000 claims 1
- PDQAZBWRQCGBEV-UHFFFAOYSA-N Ethylenethiourea Chemical compound S=C1NCCN1 PDQAZBWRQCGBEV-UHFFFAOYSA-N 0.000 claims 1
- VLCDUOXHFNUCKK-UHFFFAOYSA-N N,N'-Dimethylthiourea Chemical compound CNC(=S)NC VLCDUOXHFNUCKK-UHFFFAOYSA-N 0.000 claims 1
- FLVIGYVXZHLUHP-UHFFFAOYSA-N N,N'-diethylthiourea Chemical compound CCNC(=S)NCC FLVIGYVXZHLUHP-UHFFFAOYSA-N 0.000 claims 1
- IPCRBOOJBPETMF-UHFFFAOYSA-N N-acetylthiourea Chemical compound CC(=O)NC(N)=S IPCRBOOJBPETMF-UHFFFAOYSA-N 0.000 claims 1
- MNOILHPDHOHILI-UHFFFAOYSA-N Tetramethylthiourea Chemical compound CN(C)C(=S)N(C)C MNOILHPDHOHILI-UHFFFAOYSA-N 0.000 claims 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- HTKFORQRBXIQHD-UHFFFAOYSA-N allylthiourea Chemical compound NC(=S)NCC=C HTKFORQRBXIQHD-UHFFFAOYSA-N 0.000 claims 1
- 229960001748 allylthiourea Drugs 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- 150000003934 aromatic aldehydes Chemical class 0.000 claims 1
- 150000008365 aromatic ketones Chemical class 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 125000000853 cresyl group Chemical class C1(=CC=C(C=C1)C)* 0.000 claims 1
- BRWIZMBXBAOCCF-UHFFFAOYSA-N hydrazinecarbothioamide Chemical compound NNC(N)=S BRWIZMBXBAOCCF-UHFFFAOYSA-N 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 150000007522 mineralic acids Chemical class 0.000 claims 1
- 125000001624 naphthyl group Chemical group 0.000 claims 1
- 150000007524 organic acids Chemical class 0.000 claims 1
- 235000005985 organic acids Nutrition 0.000 claims 1
- 125000003367 polycyclic group Chemical group 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- NJRXVEJTAYWCQJ-UHFFFAOYSA-N thiomalic acid Chemical compound OC(=O)CC(S)C(O)=O NJRXVEJTAYWCQJ-UHFFFAOYSA-N 0.000 claims 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015043901A JP2015193916A (ja) | 2014-03-18 | 2015-03-05 | 錫または錫合金の電気めっき浴、およびバンプの製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014055266 | 2014-03-18 | ||
| JP2014055266 | 2014-03-18 | ||
| JP2015043901A JP2015193916A (ja) | 2014-03-18 | 2015-03-05 | 錫または錫合金の電気めっき浴、およびバンプの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015193916A JP2015193916A (ja) | 2015-11-05 |
| JP2015193916A5 true JP2015193916A5 (https=) | 2018-03-29 |
Family
ID=54116147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015043901A Pending JP2015193916A (ja) | 2014-03-18 | 2015-03-05 | 錫または錫合金の電気めっき浴、およびバンプの製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150267310A1 (https=) |
| JP (1) | JP2015193916A (https=) |
| KR (1) | KR20150108767A (https=) |
| CN (1) | CN104928730A (https=) |
| TW (1) | TW201542886A (https=) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102233334B1 (ko) * | 2014-04-28 | 2021-03-29 | 삼성전자주식회사 | 주석 도금액, 주석 도금 장치 및 상기 주석 도금액을 이용한 반도체 장치 제조 방법 |
| US20180016689A1 (en) * | 2016-07-18 | 2018-01-18 | Rohm And Haas Electronic Materials Llc | Indium electroplating compositions and methods for electroplating indium |
| KR20180024765A (ko) * | 2016-08-31 | 2018-03-08 | 주식회사 호진플라텍 | 전기도금을 이용한 주석-비스무트-납 삼원합금 솔더 조성물 |
| US10407795B2 (en) | 2016-11-16 | 2019-09-10 | Eci Technology, Inc. | Analysis of silver ion and complexing agent in tin-silver electrodeposition solution |
| WO2018180192A1 (ja) * | 2017-03-27 | 2018-10-04 | 三菱マテリアル株式会社 | めっき液 |
| US11268203B2 (en) | 2017-10-24 | 2022-03-08 | Mitsubishi Materials Corporation | Tin or tin alloy plating solution |
| JP6620858B2 (ja) * | 2017-10-24 | 2019-12-18 | 三菱マテリアル株式会社 | 錫又は錫合金めっき堆積層の形成方法 |
| WO2019082884A1 (ja) | 2017-10-24 | 2019-05-02 | 三菱マテリアル株式会社 | 錫又は錫合金めっき液 |
| JP6620859B2 (ja) * | 2017-10-24 | 2019-12-18 | 三菱マテリアル株式会社 | 錫又は錫合金めっき堆積層の形成方法 |
| JP2019140174A (ja) * | 2018-02-07 | 2019-08-22 | イビデン株式会社 | プリント配線板およびプリント配線板の製造方法 |
| WO2019181906A1 (ja) | 2018-03-20 | 2019-09-26 | 三菱マテリアル株式会社 | 錫又は錫合金めっき液、及びバンプの形成方法 |
| EP3770305A4 (en) | 2018-03-20 | 2021-12-15 | Mitsubishi Materials Corporation | TIN OR TIN ALLOY PLATING LIQUID, BUMPER MOLDING DEVICE AND METHOD OF MANUFACTURING A CIRCUIT BOARD |
| SG11202009106XA (en) * | 2018-04-20 | 2020-11-27 | Basf Se | Composition for tin or tin alloy electroplating comprising suppressing agent |
| JP7035821B2 (ja) * | 2018-06-05 | 2022-03-15 | トヨタ自動車株式会社 | 成膜用金属溶液及び金属被膜の成膜方法 |
| US11021786B2 (en) * | 2018-12-04 | 2021-06-01 | Texas Instruments Incorporated | Copper passivation |
| US11109481B2 (en) * | 2019-02-15 | 2021-08-31 | Ibiden Co., Ltd. | Method for manufacturing printed wiring board and printed wiring board |
| JP7276049B2 (ja) * | 2019-09-27 | 2023-05-18 | 三菱マテリアル株式会社 | めっき方法 |
| CN111139462B (zh) * | 2020-01-16 | 2021-12-28 | 常熟市普华电工材料有限公司 | 一种电镀锡处理工艺 |
| JP2021116473A (ja) * | 2020-01-27 | 2021-08-10 | 三菱マテリアル株式会社 | 錫又は錫合金電解めっき液、バンプの形成方法、及び回路基板の製造方法 |
| US20230038219A1 (en) | 2020-01-27 | 2023-02-09 | Mitsubishi Materials Corporation | Tin or tin alloy electroplating solution, method for forming bumps, and method for producing circuit board |
| JP7064178B2 (ja) | 2020-10-13 | 2022-05-10 | 三菱マテリアル株式会社 | 錫又は錫合金めっき液及び該液を用いたバンプの形成方法 |
| CN112359380A (zh) * | 2020-10-23 | 2021-02-12 | 珠海鑫通化工有限公司 | 一种被动元器件化学镀锡用电镀液 |
| JP7140176B2 (ja) * | 2020-11-25 | 2022-09-21 | 三菱マテリアル株式会社 | 錫合金めっき液 |
| CN114737228B (zh) * | 2022-06-09 | 2022-08-26 | 深圳市板明科技股份有限公司 | 一种线路板电镀锡光亮剂及其应用 |
| US12529159B2 (en) * | 2023-07-12 | 2026-01-20 | Hong Kong Applied Science and Technology Research Institute Company Limited | Co-electroplating Sn—Bi alloy solder for 3D-IC low-temperature bonding |
| CN117238781B (zh) * | 2023-11-16 | 2024-02-23 | 江苏芯德半导体科技有限公司 | 一种晶圆级超薄四边无引脚芯片封装方法及芯片封装结构 |
| JP2025139964A (ja) * | 2024-03-13 | 2025-09-29 | 三菱マテリアル株式会社 | めっき液用微粒化剤補給液、および、錫系めっき材の製造方法 |
| CN120060938A (zh) * | 2025-03-03 | 2025-05-30 | 大连理工大学 | 一种中性光亮镀锡电镀液及其制备方法与应用 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5967387A (ja) * | 1982-10-08 | 1984-04-17 | Hiyougoken | すず、鉛及びすず―鉛合金メッキ浴 |
| TW577938B (en) * | 1998-11-05 | 2004-03-01 | Uyemura C & Co Ltd | Tin-copper alloy electroplating bath and plating process therewith |
| JP3871013B2 (ja) * | 1998-11-05 | 2007-01-24 | 上村工業株式会社 | 錫−銅合金電気めっき浴及びそれを使用するめっき方法 |
| JP2001107287A (ja) * | 1999-10-07 | 2001-04-17 | Ebara Udylite Kk | Ｓｎ−Ｃｕ合金めっき浴 |
| TW583202B (en) * | 2001-03-16 | 2004-04-11 | Sumitomo Chemical Co | Aqueous emulsion comprising ethylene-vinylester copolymer |
| JP2003293185A (ja) * | 2002-04-02 | 2003-10-15 | C Uyemura & Co Ltd | 錫電気めっき浴及びこれを用いためっき方法 |
| JP5158303B2 (ja) * | 2006-04-14 | 2013-03-06 | 上村工業株式会社 | 錫電気めっき浴、錫めっき皮膜、錫電気めっき方法及び電子機器構成部品 |
| MY158939A (en) * | 2008-10-21 | 2016-11-30 | Atotech Deutschland Gmbh | Method to form solder deposits on substrates |
-
2015
- 2015-03-05 JP JP2015043901A patent/JP2015193916A/ja active Pending
- 2015-03-11 TW TW104105036A patent/TW201542886A/zh unknown
- 2015-03-16 KR KR1020150035960A patent/KR20150108767A/ko not_active Withdrawn
- 2015-03-17 CN CN201510115635.0A patent/CN104928730A/zh active Pending
- 2015-03-18 US US14/661,450 patent/US20150267310A1/en not_active Abandoned
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