JP2015188102A - マルチゲートトランジスタ - Google Patents
マルチゲートトランジスタ Download PDFInfo
- Publication number
- JP2015188102A JP2015188102A JP2015111261A JP2015111261A JP2015188102A JP 2015188102 A JP2015188102 A JP 2015188102A JP 2015111261 A JP2015111261 A JP 2015111261A JP 2015111261 A JP2015111261 A JP 2015111261A JP 2015188102 A JP2015188102 A JP 2015188102A
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- Prior art keywords
- fin
- region
- gate
- source
- drain
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- 239000004065 semiconductor Substances 0.000 claims abstract description 65
- 238000005530 etching Methods 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000002019 doping agent Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims description 93
- 125000006850 spacer group Chemical group 0.000 claims description 46
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 25
- 229910052710 silicon Inorganic materials 0.000 claims description 25
- 239000010703 silicon Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229910052799 carbon Inorganic materials 0.000 claims description 13
- 229910052698 phosphorus Inorganic materials 0.000 claims description 13
- 238000002955 isolation Methods 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 11
- 239000011574 phosphorus Substances 0.000 claims description 11
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 9
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 9
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- 229910052785 arsenic Inorganic materials 0.000 claims description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 4
- 238000001312 dry etching Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000003071 parasitic effect Effects 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 description 7
- 239000003989 dielectric material Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 238000005468 ion implantation Methods 0.000 description 6
- 238000000137 annealing Methods 0.000 description 5
- 238000002513 implantation Methods 0.000 description 5
- 238000011065 in-situ storage Methods 0.000 description 5
- 229910000676 Si alloy Inorganic materials 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000012159 carrier gas Substances 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 229910000449 hafnium oxide Inorganic materials 0.000 description 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- -1 polygermanium Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000000038 ultrahigh vacuum chemical vapour deposition Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910026551 ZrC Inorganic materials 0.000 description 1
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical compound [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 description 1
- XWCMFHPRATWWFO-UHFFFAOYSA-N [O-2].[Ta+5].[Sc+3].[O-2].[O-2].[O-2] Chemical compound [O-2].[Ta+5].[Sc+3].[O-2].[O-2].[O-2] XWCMFHPRATWWFO-UHFFFAOYSA-N 0.000 description 1
- YIFVJYNWLCNYGB-UHFFFAOYSA-N [Si]=O.[Zr] Chemical compound [Si]=O.[Zr] YIFVJYNWLCNYGB-UHFFFAOYSA-N 0.000 description 1
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229940104869 fluorosilicate Drugs 0.000 description 1
- VTGARNNDLOTBET-UHFFFAOYSA-N gallium antimonide Chemical compound [Sb]#[Ga] VTGARNNDLOTBET-UHFFFAOYSA-N 0.000 description 1
- 150000002290 germanium Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- PDKGWPFVRLGFBG-UHFFFAOYSA-N hafnium(4+) oxygen(2-) silicon(4+) Chemical compound [O-2].[Hf+4].[Si+4].[O-2].[O-2].[O-2] PDKGWPFVRLGFBG-UHFFFAOYSA-N 0.000 description 1
- WHJFNYXPKGDKBB-UHFFFAOYSA-N hafnium;methane Chemical compound C.[Hf] WHJFNYXPKGDKBB-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- JQJCSZOEVBFDKO-UHFFFAOYSA-N lead zinc Chemical compound [Zn].[Pb] JQJCSZOEVBFDKO-UHFFFAOYSA-N 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 1
- 229910021334 nickel silicide Inorganic materials 0.000 description 1
- BCCOBQSFUDVTJQ-UHFFFAOYSA-N octafluorocyclobutane Chemical compound FC1(F)C(F)(F)C(F)(F)C1(F)F BCCOBQSFUDVTJQ-UHFFFAOYSA-N 0.000 description 1
- 235000019407 octafluorocyclobutane Nutrition 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- KJXBRHIPHIVJCS-UHFFFAOYSA-N oxo(oxoalumanyloxy)lanthanum Chemical compound O=[Al]O[La]=O KJXBRHIPHIVJCS-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- CZXRMHUWVGPWRM-UHFFFAOYSA-N strontium;barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[Ti+4].[Sr+2].[Ba+2] CZXRMHUWVGPWRM-UHFFFAOYSA-N 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910021341 titanium silicide Inorganic materials 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66545—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66636—Lateral single gate silicon transistors with source or drain recessed by etching or first recessed by etching and then refilled
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
- H01L29/7848—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being located in the source/drain region, e.g. SiGe source and drain
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
Abstract
【解決手段】ゲートを連結したチャネル側壁の高さがHsiである半導体フィンのチャネル領域の上にゲートスタックを形成し、ゲートスタックに隣接する半導体フィンのソース/ドレイン領域内に、エッチングレートを制御するドーパントを注入し106、ドーピングされたフィン領域をエッチングして110、半導体フィンの略Hsiに等しい厚みを除去して112、ゲートスタックの一部の下にある半導体基板の部分を露呈させるソース/ドレイン延長キャビティを形成し、露呈した半導体基板の上に材料を成長させて、再成長したソース/ドレイン・フィン領域を形成して、ソース/ドレイン延長キャビティを充填し114、ゲートスタックからの長さを、チャネルの長さに実質的に平行な方向に離れる方向に延ばす。
【選択図】図1
Description
[項目1]
マルチゲートトランジスタを形成する方法であって、
ゲートを連結したチャネル側壁の高さがH si である半導体フィンのチャネル領域の上にゲートスタックを形成する段階と、
前記ゲートスタックに隣接する前記半導体フィンのソース/ドレイン領域内に、エッチングレートを制御するドーパントを注入する段階と、
ドーピングされたフィン領域をエッチングして、前記半導体フィンの、H si に等しい厚みを除去して、前記ゲートスタックの一部の下にある半導体基板の部分を露呈させるソース/ドレイン延長キャビティを形成する段階と、
前記露呈した半導体基板の上に材料を成長させて、再成長したソース/ドレイン・フィン領域を形成する段階と
を備え、
前記再成長したソース/ドレイン・フィン領域は、前記ソース/ドレイン延長キャビティを充填し、前記チャネルの長さ方向に平行な方向において前記ゲートスタックから離れる方向に延び、
前記ドーピングされたフィン領域の前記エッチングにより、トランジスタチャネル幅(W si )方向と高さ方向とに垂直な方向に、前記高さH si において一定であるアンダーカット長(X UC )を有する前記ソース/ドレイン延長キャビティが形成される方法。
[項目2]
前記再成長したソース/ドレイン・フィン領域を、トランジスタチャネル幅(W si )に平行な方向において、W si より大きい最大幅に成長させる項目1に記載の方法。
[項目3]
前記ドーピングされたフィン領域のエッチングレートは、前記下にある半導体基板のエッチングレートより大きく、前記露呈した半導体基板に再成長させた前記材料はシリコンを含む項目1に記載の方法。
[項目4]
前記アンダーカット長(X UC )は、前記ゲートスタックの一部の下にあり、前記高さH si より大きいエッチング深さでは低減する項目3に記載の方法。
[項目5]
前記アンダーカット長(X UC )は、前記トランジスタチャネル幅(W si )にわたり一定である項目3に記載の方法。
[項目6]
前記ドーパントを注入した後に、前記ゲートスタックの横方向の向かい合う側壁上に第1のスペーサ対を形成して、前記半導体フィンの横方向の向かい合う側面上に第2のスペーサ対を形成する段階と、
前記シリコンを含む材料を成長させる前に前記第2のスペーサ対を、前記ゲートスタックのゲート電極層を露呈させるに足る程度に前記第1のスペーサ対を除去しないよう、除去する段階と
をさらに備え、
前記第1のスペーサ対は、前記半導体フィンの前記注入された領域の上に設けられ、前記第2のスペーサ対は、前記半導体フィンの前記注入された領域に隣接して設けられる
項目3に記載の方法。
[項目7]
前記第2のスペーサ対を除去する段階は、前記ドーピングされたフィン領域のエッチングの後にエッチングを行う段階をさらに有する項目6に記載の方法。
[項目8]
前記第2のスペーサ対を除去する段階は、さらに、前記ドーピングされたフィン領域のエッチング中にエッチングを行う段階をさらに有する項目6に記載の方法。
[項目9]
前記ドーピングされたフィン領域をエッチングして、前記半導体フィンの、少なくともH si に等しい厚みを除去する段階は、さらに、チャネル領域に近接した前記半導体フィンの領域における、H si に等しい厚み分をエッチングにより除去して、前記チャネル領域から遠い前記半導体フィンの領域の、H si より大きい厚みをエッチングにより除去する段階を有する項目1に記載の方法。
[項目10]
前記チャネル領域から遠い前記半導体フィンの前記領域の、H si より大きい厚みのエッチングによる除去は、隔離上面よりも下の位置にまで前記半導体基板を後退させることを含む項目9に記載の方法。
[項目11]
前記ドーパントを注入する段階は、炭素、リン、またはヒ素のうちの少なくとも1つを注入する段階を含み、
前記ドーピングされたフィン領域をエッチングする段階は、NF 3 、HBr、SF 6 、およびArからなる群から選択された別の化合物と、Cl 2 との混合物を含むドライエッチングを含む項目1に記載の方法。
[項目12]
半導体基板から延びる半導体フィンの、ゲートを連結したチャネル側壁の高さがH si であるチャネル領域の上に設けられたゲート誘電体とゲート電極とを含むゲートスタックと、
前記基板上に設けられ、前記チャネル領域に隣接したソース/ドレイン延長領域を含む、再成長したソース/ドレイン半導体フィンと
を備え、
前記ソース/ドレイン延長領域と前記チャネル領域とで、H si に等しい高さに沿った界面が形成され、
前記ソース/ドレイン延長領域は、トランジスタチャネル幅(W si )方向と高さ方向とに垂直な方向に、前記ゲートスタックの下に重なる量が、前記高さH si において一定であり、
前記ソース/ドレイン延長領域が前記ゲートスタックと重なる量は、ゲート誘電体界面から測った高さがH si より大きくなると低減する
マルチゲートトランジスタ。
[項目13]
前記チャネル領域から離れる方向の前記再成長したソースドレイン・フィンの高さは、少なくともH si に等しく、トランジスタチャネルの幅(W si )に平行な大きさに沿った再成長したソース/ドレイン・フィンの幅は、W si より大きい項目12に記載のマルチゲートトランジスタ。
[項目14]
前記再成長したソース/ドレイン・フィンの幅は、前記高さH si の少なくとも半分の場所でW si より大きい項目13に記載のマルチゲートトランジスタ。
[項目15]
前記ゲートスタックの横方向の向かい合う側面は誘電体スペーサに隣接しており、層間誘電体(ILD)は、前記誘電体スペーサの外部側壁および前記高さH si 内に位置する前記再成長したソース/ドレイン・フィンの側壁部分の両方に接触している項目12に記載のマルチゲートトランジスタ。
[項目16]
前記ゲートスタックは、高誘電率ゲート誘電体層および金属ゲート電極を含み、
前記再成長したソース/ドレイン・フィン領域は、炭素およびリンをドーピングされたシリコン、または、ホウ素ドーピングされたシリコンゲルマニウムを含むことで、前記チャネル領域に歪みを与える項目12に記載のマルチゲートトランジスタ。
[項目17]
前記ソース/ドレイン延長領域は、前記高誘電率ゲート誘電体層から下方に、0より大きい距離分存在している項目16に記載のマルチゲートトランジスタ。
Claims (17)
- マルチゲートトランジスタを形成する方法であって、
ゲートを連結したチャネル側壁の高さがHsiである半導体フィンのチャネル領域の上にゲートスタックを形成する段階と、
前記ゲートスタックに隣接する前記半導体フィンのソース/ドレイン領域内に、エッチングレートを制御するドーパントを注入する段階と、
ドーピングされたフィン領域をエッチングして、前記半導体フィンの、Hsiに等しい厚みを除去して、前記ゲートスタックの一部の下にある半導体基板の部分を露呈させるソース/ドレイン延長キャビティを形成する段階と、
前記露呈した半導体基板の上に材料を成長させて、再成長したソース/ドレイン・フィン領域を形成する段階と
を備え、
前記再成長したソース/ドレイン・フィン領域は、前記ソース/ドレイン延長キャビティを充填し、前記チャネルの長さ方向に平行な方向において前記ゲートスタックから離れる方向に延び、
前記ドーピングされたフィン領域の前記エッチングにより、トランジスタチャネル幅(Wsi)方向と高さ方向とに垂直な方向に、前記高さHsiにおいて一定であるアンダーカット長(XUC)を有する前記ソース/ドレイン延長キャビティが形成される方法。 - 前記再成長したソース/ドレイン・フィン領域を、トランジスタチャネル幅(Wsi)に平行な方向において、Wsiより大きい最大幅に成長させる請求項1に記載の方法。
- 前記ドーピングされたフィン領域のエッチングレートは、前記下にある半導体基板のエッチングレートより大きく、前記露呈した半導体基板に再成長させた前記材料はシリコンを含む請求項1に記載の方法。
- 前記アンダーカット長(XUC)は、前記ゲートスタックの一部の下にあり、前記高さHsiより大きいエッチング深さでは低減する請求項3に記載の方法。
- 前記アンダーカット長(XUC)は、前記トランジスタチャネル幅(Wsi)にわたり一定である請求項3に記載の方法。
- 前記ドーパントを注入した後に、前記ゲートスタックの横方向の向かい合う側壁上に第1のスペーサ対を形成して、前記半導体フィンの横方向の向かい合う側面上に第2のスペーサ対を形成する段階と、
前記シリコンを含む材料を成長させる前に前記第2のスペーサ対を、前記ゲートスタックのゲート電極層を露呈させるに足る程度に前記第1のスペーサ対を除去しないよう、除去する段階と
をさらに備え、
前記第1のスペーサ対は、前記半導体フィンの前記注入された領域の上に設けられ、前記第2のスペーサ対は、前記半導体フィンの前記注入された領域に隣接して設けられる
請求項3に記載の方法。 - 前記第2のスペーサ対を除去する段階は、前記ドーピングされたフィン領域のエッチングの後にエッチングを行う段階をさらに有する請求項6に記載の方法。
- 前記第2のスペーサ対を除去する段階は、さらに、前記ドーピングされたフィン領域のエッチング中にエッチングを行う段階をさらに有する請求項6に記載の方法。
- 前記ドーピングされたフィン領域をエッチングして、前記半導体フィンの、少なくともHsiに等しい厚みを除去する段階は、さらに、チャネル領域に近接した前記半導体フィンの領域における、Hsiに等しい厚み分をエッチングにより除去して、前記チャネル領域から遠い前記半導体フィンの領域の、Hsiより大きい厚みをエッチングにより除去する段階を有する請求項1に記載の方法。
- 前記チャネル領域から遠い前記半導体フィンの前記領域の、Hsiより大きい厚みのエッチングによる除去は、隔離上面よりも下の位置にまで前記半導体基板を後退させることを含む請求項9に記載の方法。
- 前記ドーパントを注入する段階は、炭素、リン、またはヒ素のうちの少なくとも1つを注入する段階を含み、
前記ドーピングされたフィン領域をエッチングする段階は、NF3、HBr、SF6、およびArからなる群から選択された別の化合物と、Cl2との混合物を含むドライエッチングを含む請求項1に記載の方法。 - 半導体基板から延びる半導体フィンの、ゲートを連結したチャネル側壁の高さがHsiであるチャネル領域の上に設けられたゲート誘電体とゲート電極とを含むゲートスタックと、
前記基板上に設けられ、前記チャネル領域に隣接したソース/ドレイン延長領域を含む、再成長したソース/ドレイン半導体フィンと
を備え、
前記ソース/ドレイン延長領域と前記チャネル領域とで、Hsiに等しい高さに沿った界面が形成され、
前記ソース/ドレイン延長領域は、トランジスタチャネル幅(Wsi)方向と高さ方向とに垂直な方向に、前記ゲートスタックの下に重なる量が、前記高さHsiにおいて一定であり、
前記ソース/ドレイン延長領域が前記ゲートスタックと重なる量は、ゲート誘電体界面から測った高さがHsiより大きくなると低減する
マルチゲートトランジスタ。 - 前記チャネル領域から離れる方向の前記再成長したソースドレイン・フィンの高さは、少なくともHsiに等しく、トランジスタチャネルの幅(Wsi)に平行な大きさに沿った再成長したソース/ドレイン・フィンの幅は、Wsiより大きい請求項12に記載のマルチゲートトランジスタ。
- 前記再成長したソース/ドレイン・フィンの幅は、前記高さHsiの少なくとも半分の場所でWsiより大きい請求項13に記載のマルチゲートトランジスタ。
- 前記ゲートスタックの横方向の向かい合う側面は誘電体スペーサに隣接しており、層間誘電体(ILD)は、前記誘電体スペーサの外部側壁および前記高さHsi内に位置する前記再成長したソース/ドレイン・フィンの側壁部分の両方に接触している請求項12に記載のマルチゲートトランジスタ。
- 前記ゲートスタックは、高誘電率ゲート誘電体層および金属ゲート電極を含み、
前記再成長したソース/ドレイン・フィン領域は、炭素およびリンをドーピングされたシリコン、または、ホウ素ドーピングされたシリコンゲルマニウムを含むことで、前記チャネル領域に歪みを与える請求項12に記載のマルチゲートトランジスタ。 - 前記ソース/ドレイン延長領域は、前記高誘電率ゲート誘電体層から下方に、0より大きい距離分存在している請求項16に記載のマルチゲートトランジスタ。
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Also Published As
Publication number | Publication date |
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CN104992979A (zh) | 2015-10-21 |
CN102656672A (zh) | 2012-09-05 |
TWI450341B (zh) | 2014-08-21 |
US8313999B2 (en) | 2012-11-20 |
WO2011087571A1 (en) | 2011-07-21 |
EP2517231B1 (en) | 2019-12-25 |
CN104992979B (zh) | 2019-06-18 |
TW201137985A (en) | 2011-11-01 |
EP2517231A1 (en) | 2012-10-31 |
HK1216455A1 (zh) | 2016-11-11 |
JP2013515356A (ja) | 2013-05-02 |
KR101380984B1 (ko) | 2014-04-17 |
US20110147842A1 (en) | 2011-06-23 |
KR20120098843A (ko) | 2012-09-05 |
JP5756996B2 (ja) | 2015-07-29 |
CN102656672B (zh) | 2015-08-19 |
HK1175028A1 (zh) | 2013-06-21 |
JP6284502B2 (ja) | 2018-02-28 |
EP2517231A4 (en) | 2015-07-29 |
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